Dicing die-bonding film

A dicing die-bonding film has a supporting substrate (1), an adhesive layer (2) formed on the supporting substrate (1), and a die-bonding adhesive layer (3) formed on the adhesive layer (2), and further has a mark for recognizing the position of the die-bonding adhesive layer (3). It is possible to provide a dicing die-bonding film in which in the case where a semiconductor wafer and the dicing die-bonding film are stuck onto each other, the position of the die-bonding adhesive layer (3) in the film can be recognized.