EP1547141A4
Semiconductor multi-package module having wire bond interconnection between stacked packages
Abstract
This record has no abstract on file.
Term
Term ended
Projected expiry passed 15 September 2023, 3 years ago.
- Priority
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- Published
- Projected expiry
- Today
18 sheets
Sheet 1 Sheet 2 Sheet 3 Sheet 4 Sheet 5 Sheet 6 Sheet 7 Sheet 8 Sheet 9 Sheet 10 Sheet 11 Sheet 12 Sheet 13 Sheet 14 Sheet 15 Sheet 16 Sheet 17 Sheet 18
Every citation, both ways
| Document | Relation | Office | Cited during |
|---|---|---|---|
| JP2000294723A | Cites | Japan | Search report |
| JP2000340736A | Cites | Japan | Search report |
| JP2001223326A | Cites | Japan | Search report |
| US2002066952A1 | Cites | United States of America | Search report |
| JP2002217354A | Cites | Japan | Search report |
| US5222014A | Cites | United States of America | Search report |
| US5247423A | Cites | United States of America | Search report |
| US5652185A | Cites | United States of America | Search report |
| US5903049A | Cites | United States of America | Search report |
| US6340846B1 | Cites | United States of America | Search report |
| See also references of WO 2004027823A2 | Non-patent | – | Search report |
43 members in 7 offices
Priority claims15
| Document | Office | Kind | Date |
|---|---|---|---|
| 411590P | United States of America | – | |
| 41159002 | United States of America | P | |
| 632549 | United States of America | – | |
| 632568 | United States of America | – | |
| 632552 | United States of America | – | |
| 632553 | United States of America | – | |
| 632550 | United States of America | – | |
| 632551 | United States of America | – | |
| 63254903 | United States of America | A | |
| 63256803 | United States of America | A | |
| 63255203 | United States of America | A | |
| 63255303 | United States of America | A | |
| 63255003 | United States of America | A | |
| 63255103 | United States of America | A | |
| 0328919 | United States of America | W |
Members43
| Document | Office | Kind | |
|---|---|---|---|
| US2004056277A1 | United States of America | A1 | |
| US2004061212A1 | United States of America | A1 | |
| US2004061213A1 | United States of America | A1 | |
| US2004063242A1 | United States of America | A1 | |
| US2004063246A1 | United States of America | A1 | |
| WO2004027823A2 | World Intellectual Property Organization (WIPO) | A2 | |
| AU2003272405A1 | Australia | A1 | |
| AU2003272405A8 | Australia | A8 | |
| US2004065963A1 | United States of America | A1 | |
| WO2004027823A3 | World Intellectual Property Organization (WIPO) | A3 | |
| TW200419765A | Taiwan Province of China | A | |
| US6838761B2 | United States of America | B2 | |
| KR20050044925A | Republic of Korea | A | |
| EP1547141A2 | European Patent Office (EPO) | A2 | |
| US6972481B2 | United States of America | B2 | |
| JP2005539403A | Japan | A | |
| US7053476B2 | United States of America | B2 | |
| US7064426B2 | United States of America | B2 | |
| US2006170091A1 | United States of America | A1 | |
| US2006172463A1 | United States of America | A1 | |
| US7205647B2 | United States of America | B2 | |
| US2007155053A1 | United States of America | A1 | |
| US7279361B2 | United States of America | B2 | |
| US2007292990A1 | United States of America | A1 | |
| US2008036096A1 | United States of America | A1 | |
| US7638363B2 | United States of America | B2 | |
| EP1547141A4This record | European Patent Office (EPO) | A4 | |
| US7682873B2 | United States of America | B2 | |
| TW201017853A | Taiwan Province of China | A | |
| US7732254B2 | United States of America | B2 | |
| US2010200966A1 | United States of America | A1 | |
| TWI329918B | Taiwan Province of China | B | |
| US7935572B2 | United States of America | B2 | |
| JP2011181971A | Japan | A | |
| TW201131731A | Taiwan Province of China | A | |
| JP4800625B2 | Japan | B2 | |
| US8143100B2 | United States of America | B2 | |
| KR101166575B1 | Republic of Korea | B1 | |
| TWI378548B | Taiwan Province of China | B | |
| JP2013211589A | Japan | A | |
| JP5602685B2 | Japan | B2 | |
| TWI469301B | Taiwan Province of China | B | |
| JP5856103B2 | Japan | B2 |
12 legal events, as 2 offices reported them to INPADOC
Over the term
Point at a mark for the eventEvents
| Event | Code | Office | |
|---|---|---|---|
| Application refused18R | 18R | EP | |
| Information on the status of an ep patent application or granted ep patentGrantedSTATUS: THE APPLICATION HAS BEEN REFUSEDSTAA | STAA | EP | |
| Refusal decision now finalR003 | R003 | DE | |
| First examination report despatched17Q | 17Q | EP | |
| Supplementary search report drawn up and despatchedA4 | A4 | EP | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | EP | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | EP | |
| Request for extension of the european patent (deleted)DAX | DAX | EP | |
| Request for examination filed17P | 17P | EP | |
| Designated contracting statesAK | AK | EP | |
| Request for extension of the european patentAX | AX | EP | |
| Public reference made under article 153(3) epc to a published international application that has entered the european phaseORIGINAL CODE: 0009012PUAI | PUAI | EP |
Numbers
- Publication
- 1547141
- Application
- 37545852
Titles3
- German
- HALBLEITER-MEHRFACHKAPSELUNGSMODUL MIT DRAHTBONDVERBINDUNG ZWISCHEN GESTAPELTEN KAPSELUNGEN
- English
- SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING WIRE BOND INTERCONNECTION BETWEEN STACKED PACKAGES
- French
- MODULE MULTI-BOITIER A SEMI-CONDUCTEURS COMPORTANT UNE INTERCONNEXION DE MICROCABLAGES ENTRE DES BOITIERS
Classification
- CPC, 23
- H10W42/20
- H10W70/60
- H10W90/734
- H10W72/07251
- H10W72/20
- H10W90/724
- H10W72/075
- H10W72/952
- H10W72/01515
- H10W90/00
- H10W72/536
- H10W72/5363
- H10W74/15
- H10W72/877
- H10W90/754
- H10W72/884
- H10W90/28
- H10W90/752
- H10W90/288
- H10W90/722
- H10W74/00
- H10W72/551
- H10W70/611
- IPC, 5
- H01L25 065
- H01L25 10
- H10W70 60
- H01L25 11
- H01L25 18
Designated states1
- Contracting states, 1
- Türkiye