Electronic component mounting system and electronic component mounting method
Abstract
This invention is directed to prevention of setting a component feeding unit set with other storage member than a storage member storing same type of components as components in shortage in an electronic component mounting apparatus. A component mounting apparatus sends notice information about component shortage to a control computer (30) when a number of electronic components in a storage member reduces and reaches a level for sending the notice information of component shortage during mounting operations. The control computer (30) stores the notice information, and sends the notice information to a monitor computer (32) to display this information on a monitor (33). A new storage member having the corresponding components is set in the component feeding unit based on the displayed notice information, and an operator inputs information A about which component feeding unit is set with the storage member and which components are stored in the storage member set in the component feeding unit. The monitor computer (32) sends the information A and information about completion of registration of a relation between the component feeding unit and the components to the control computer (30), and the control computer (30) stores this information in a memory (41) and sends the information about registration to the monitor computer (32), and the monitor (33) displays the notice information in a different color.

Term
Term ended
Projected expiry passed 20 December 2024, 1.8 years ago.
- Priority
- Filed
- Published
- Projected expiry
- Today
1 sheet
Sheet 1
Every citation, both ways
| Document | Relation | Office | Category | Cited during | Relevant claims |
|---|---|---|---|---|---|
| WO0016601A1 | Cites | World Intellectual Property Organization (WIPO) | X | Search report | 1-3,5,7 |
| EP1239720A2 | Cites | European Patent Office (EPO) | X | Search report | 1-8 |
| US5329690A | Cites | United States of America | A | Search report | 1-3,5,7 |
| US6480751B1 | Cites | United States of America | A | Search report | 4,6,8 |
| JPH0794896A | Cites | Japan | DXA | Search report | 1,5 |
9 members in 5 offices
Priority claims5
| Document | Office | Kind | Date |
|---|---|---|---|
| 2003422595 | Japan | A | |
| 2003422595 | Japan | A | |
| 2003422595 | Japan | – | |
| 2003422595 | – | – | – |
| JP20030422595 | – | – | – |
Members9
| Document | Office | Kind | |
|---|---|---|---|
| CN1630466A | China | A | |
| EP1545182A2 | European Patent Office (EPO) | A2 | |
| KR20050062405A | Republic of Korea | A | |
| JP2005183679A | Japan | A | |
| US2005165505A1 | United States of America | A1 | |
| US7054707B2 | United States of America | B2 | |
| EP1545182A3This record | European Patent Office (EPO) | A3 | |
| CN100525602C | China | C | |
| KR101156317B1 | Republic of Korea | B1 |
11 legal events, as the office reported them to INPADOC
Over the term
Point at a mark for the eventEvents
| Event | Code | |
|---|---|---|
| Application deemed to be withdrawnWithdrawn18D | 18D | |
| Information on the status of an ep patent application or granted ep patentGrantedSTATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWNSTAA | STAA | |
| First examination report despatched17Q | 17Q | |
| Designation fees paidAKX | AKX | |
| Request for examination filed17P | 17P | |
| Designated contracting statesAK | AK | |
| Request for extension of the european patentAX | AX | |
| Search report despatchedORIGINAL CODE: 0009013PUAL | PUAL | |
| Designated contracting statesAK | AK | |
| Request for extension of the european patentAX | AX | |
| Public reference made under article 153(3) epc to a published international application that has entered the european phaseORIGINAL CODE: 0009012PUAI | PUAI |
Numbers
- Publication
- 1545182
- Publication, DOCDB
- 1545182
- Publication, EPODOC
- EP1545182
- Application
- 4030178
- Application, DOCDB
- 04030178
- Application, EPODOC
- EP20040030178
Titles3
- German
- System und Verfahren zur Montage von elektronischen Bauelementen
- English
- Electronic component mounting system and electronic component mounting method
- French
- Système et procédé de montage de composants électroniques
Classification
- CPC, 4
- H05K13/086
- H05K13/02
- H05K13/021
- Y10T29/53183
- IPC, 2
- H05K13 08
- H05K13 02
Designated states2
- Contracting states, 1
- Türkiye
- Extension states, 1
- Yugoslavia, later Serbia and Montenegro (until 2006)