EP1544925A3

Method of packaging a semiconductor light emitting device

Abstract

A semiconductor light emitting device is packaged by forming a sealed compartment enclosing the device, at least one of the walls of the sealed compartment being formed of an elastomeric material. The elastomeric material is then penetrated with a needle and a quantity of softer material is injected through the needle into the sealed compartment. In some embodiments, a coaxial needle or two needles are used, one needle to inject the softer material and one needle to vent air from the compartment.

EP1544925A3, drawing sheet 1
Sheet 1 of 1

Term

Term ended

Projected expiry passed 9 December 2024, 1.8 years ago.

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