EP1539295A2

Cochlear implant electrode and method of making same

Abstract

This record has no abstract on file.

Term

Term ended

Projected expiry passed 19 September 2023, 3 years ago.

  1. Priority
  2. Filed
  3. Published
  4. Projected expiry
  5. Today

17 claims: 2 independent, 15 dependent

  1. 1
    Claims of equivalent WO 2004026199 A2 CLAIMS What is claimed is:1. An implantable lead for use with electrical stimulation, the lead comprising: a flexible carrier (60) having a proximal end, a distal end, a medial side (73) and a lateral side (74);a distal, pre-curved lead section (71) having memory;a plurality of electrode contacts (200) embedded at the distal end of the lead, which electrode contacts comprise an electrode array;a plurality of conductor wires (202) embedded in the carrier, each conductor wire connected to at least one electrode contact (200) ;and a longitudinal stylet insertion channel (40) in the carrier extending into at least a part of the distal, pre-curved lead section (71 ).
  2. 14
    A method of manufacturing an implantable stimulating lead (150) comprising:(a) attaching a plurality of inert electrode contacts (200) onto chemically dissolvable strip substrate (100) having a first, distal end and a second, proximal end;(b) coupling each electrode contact (200) to a conductor wire (202) to create an electrode array assembly;(c) attaching the first, distal end of substrate (100) to a revolving dowel, which dowel is integrated into a mold having a cavity, the dowel placed inside the cavity;(d) attaching the proximal, second end of the substrate (100) to a restraint (102) which applies tension to the electrode array assembly (79);(e) turning the dowel (104) to create a predetermined curvature on the distal end of the electrode array assembly (79);(f) delivering a body-compatible carrier material into the cavity (115) and around the electrode array assembly (79) to create a carrier/covering (60);(g) releasing the formed lead from the mold (105);and (h) applying a weak acid and heat to the chemically active substrate to dissolve away the substrate (100) and expose the inert, electrode contact (200) on the surface of the lead (150).