EP1538666A4
Semiconductor integrated circuit device
Abstract
This record has no abstract on file.
Term
Term ended
Projected expiry passed 14 July 2023, 3.2 years ago.
- Priority
- Filed
- Published
- Projected expiry
- Today
13 sheets
Sheet 1 Sheet 2 Sheet 3 Sheet 4 Sheet 5 Sheet 6 Sheet 7 Sheet 8 Sheet 9 Sheet 10 Sheet 11 Sheet 12 Sheet 13
Every citation, both ways
| Document | Relation | Office | Category | Cited during | Relevant claims |
|---|---|---|---|---|---|
| WO0028399A1 | Cites | World Intellectual Property Organization (WIPO) | XY | Search report | 2,4 |
| WO03015169A1 | Cites | World Intellectual Property Organization (WIPO) | PX | Search report | 4 |
| EP0874401A2 | Cites | European Patent Office (EPO) | – | Search report | – |
| EP0940851A1 | Cites | European Patent Office (EPO) | – | Search report | – |
| JP2001244414A | Cites | Japan | – | Search report | – |
| US5723908A | Cites | United States of America | – | Search report | – |
| WO0028399A | Cites | World Intellectual Property Organization (WIPO) | – | – | – |
| WO03015169A | Cites | World Intellectual Property Organization (WIPO) | – | – | – |
| See also references of WO 2004070832A1 | Non-patent | – | – | Search report | – |
15 members in 6 offices; this record represents the family
Priority claims3
| Document | Office | Kind | Date |
|---|---|---|---|
| 2003027539 | Japan | – | |
| 2003027539 | Japan | A | |
| 0308884 | Japan | W |
Members15
| Document | Office | Kind | |
|---|---|---|---|
| WO2004070832A1 | World Intellectual Property Organization (WIPO) | A1 | |
| EP1538666A1 | European Patent Office (EPO) | A1 | |
| CN1703775A | China | A | |
| US2005280038A1 | United States of America | A1 | |
| US6998654B2 | United States of America | B2 | |
| JPWO2004070832A1 | Japan | A1 | |
| CN1321451C | China | C | |
| EP1538666A4This record | European Patent Office (EPO) | A4 | |
| EP1968112A2 | European Patent Office (EPO) | A2 | |
| EP1968112A3 | European Patent Office (EPO) | A3 | |
| JP4242844B2 | Japan | B2 | |
| EP2048708A1 | European Patent Office (EPO) | A1 | |
| EP2048708B1 | European Patent Office (EPO) | B1 | |
| DE60335756D1 | Germany | D1 | |
| EP1538666B1 | European Patent Office (EPO) | B1 |
33 legal events, as 4 offices reported them to INPADOC
Over the term
Point at a mark for the eventEvents
| Event | Code | Office | |
|---|---|---|---|
| Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal feeWithdrawnR119 | R119 | DE | |
| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
| Notification of lapseLapsedST | ST | FR | |
| Gb: european patent ceased through non-payment of renewal feeCeasedGBPC | GBPC | EP | |
| No opposition filed against granted patent, or epo opposition proceedings concluded without decisionGrantedR097 | R097 | DE | |
| No opposition filedOpposition26N | 26N | EP | |
| No opposition filed within time limitOppositionORIGINAL CODE: 0009261PLBE | PLBE | EP | |
| Information on the status of an ep patent application or granted ep patentGrantedSTATUS: NO OPPOSITION FILED WITHIN TIME LIMITSTAA | STAA | EP | |
| Dpma publication of mentioned ep patent grantGrantedR096 | R096 | DE | |
| Designated contracting statesAK | AK | EP | |
| European patent grantedGrantedFG4D | FG4D | GB | |
| (expected) grantORIGINAL CODE: 0009210GRAA | GRAA | EP | |
| Grant fee paidORIGINAL CODE: EPIDOSNIGR3GRAS | GRAS | EP | |
| Despatch of communication of intention to grant a patentORIGINAL CODE: EPIDOSNIGR1GRAP | GRAP | EP | |
| Party data changed (applicant data changed or rights of an application transferred)RAP1 | RAP1 | EP | |
| Information on inventor provided before grant (corrected)RIN1 | RIN1 | EP | |
| Information on inventor provided before grant (corrected)RIN1 | RIN1 | EP | |
| Information on inventor provided before grant (corrected)RIN1 | RIN1 | EP | |
| First examination report despatched17Q | 17Q | EP | |
| Supplementary search report drawn up and despatchedA4 | A4 | EP | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | EP | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | EP | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | EP | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | EP | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | EP | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | EP | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | EP | |
| Designated contracting states (corrected)RBV | RBV | EP | |
| Request for examination filed17P | 17P | EP | |
| Designated contracting statesAK | AK | EP | |
| Public reference made under article 153(3) epc to a published international application that has entered the european phaseORIGINAL CODE: 0009012PUAI | PUAI | EP |
Numbers
- Publication
- 1538666
- Application
- 38157376
Titles3
- German
- INTEGRIERTES HALBLEITERSCHALTUNGSBAUELEMENT
- English
- SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- French
- DISPOSITIF DE CIRCUIT INTEGRE A SEMICONDUCTEUR
Classification
- CPC, 5
- H10W42/405
- Y10S257/922
- H10W20/495
- H10W20/423
- H10W20/43
- IPC, 11
- H01L21 82
- H01L27 04
- H01L21 3205
- G06F1 04
- H01L23 58
- H01L23 498
- H01L23 538
- H10D84 00
- H10D84 03
- H01L23 522
- H01L23 528
Designated states1
- Contracting states, 1
- United Kingdom