EP1535168B1

Multi-port high-speed serial fabric interconnect chip in a meshed configuration

Abstract

Multiple boards are connected within a chassis, using a multi-port Target Channel Adapter (TCA). Data is transported from a TCA on a board directly to a TCA on another board through a meshed backplane. The meshed backplane is equipped to mount boards via connectors and may consist of a fabric of copper conductors or optical fibers. Communication from TCA to TCA requires placing ports on each individual TCA along with the appropriate input and output buffering. A multi-port TCA capable of performing multiple bridging functions simultaneously i.e., bridging from a high speed serial meshed backplane to multiple local busses, i.e., Gigabit Ethernet, Fibre Channel, and TCP/IP devices, is referred to as a Fabric Interconnect Chip (FIC).

EP1535168B1, drawing sheet 1
Sheet 1 of 7

Term

Term ended

Expired 29 August 2023, 3.1 years ago.

  1. Priority
  2. Filed
  3. Granted
  4. Expired
  5. Today

13 claims: 2 independent, 11 dependent

  1. 1
    A high speed serial fabric backplane comprising:a plurality of circuit boards (201-218) interconnected to one another through a fabric of conductors (220), each circuit board containing a fabric interface chip, FIC (201-208,400);characterised by : each FIC having a direct individual connection via a conductor of the fabric of conductors to all other FICs, each FIC providing an interface between a conductor of the fabric of conductors on a fabric side and a local node on a local side, each FIC including a plurality of local ports (490) to interface with a plurality of local nodes, and a plurality of destination specific fabric ports (421-436) to interface with a plurality of conductors of the fabric of conductors (220), and each FIC including a plurality of destination specific send queues (460) and a plurality of receive queues (470) to interface with the plurality of local ports (490) and the plurality of destination specific fabric ports (421-436), wherein a destination specific send queue (460) is arranged to interface with both a local port (490) and a destination specific fabric port (421-436), wherein a receive queue (470) is arranged to interface with both a local port (490) and a destination specific fabric port (421-436), and wherein each destination specific fabric port (421-436) is arranged to interface with multiple destination specific send queues (460).
  2. 7
    A multi-port Fabric Interconnect Chip (FIC) comprising:a network processor (450);characterised by : a plurality of local ports (490);a plurality of destination specific fabric ports (421-436);a plurality of destination specific send queues (460);and a plurality of receive queues (470);wherein the plurality of local ports (490) are arranged to interface with a plurality of local nodes and the plurality of destination specific fabric ports (421-436) are arranged to interface with a plurality of conductors of a fabric of conductors (220), wherein the plurality of destination specific send queues (460) and the plurality of receive queues (470) are arranged to interface with the plurality of local ports (490) and the plurality of destination specific fabric ports (421-436), wherein a destination specific send queue (460) is arranged to interface with both a local port (490) and a destination specific fabric port (421-436), wherein a receive queue (470) is arranged to interface with both a local port (490) and a destination specific fabric port (421-436), and wherein each destination specific fabric port (421-436) is arranged to interface with multiple destination specific send queues (460).