Production method of anisotropic conductive film

The present invention aims at providing a method of producing a highly reliable anisotropic conductive film having conductive paths disposed at a narrow pitch and comparatively highly protruding from the principal plane of a film substrate, which is free of a short-circuit (contact) of the ends of adjacent conductive paths and an unprotruded conductive path. The production method of the present invention includes preparing a structural precursor wherein plural conductive paths (52) comprising conductive wires penetrate a film substrate (51) made from an insulating polymer in the thickness direction thereof, while being insulated from each other and the end face of each conductive path (52) is present in the same plane as the principal plane of the film substrate (51), and applying a reactive ion etching to the principal plane of the film substrate (51) to allow the ends (52a,52b) of the conductive path (52) to protrude from the principal planes (51a,51b) of the film substrate (51).