MEMS device and method of forming MEMS device

A method of forming a MEMS device includes depositing a conductive material (224) on a substructure (200), forming a first sacrificial layer (230) over the conductive material, including forming a substantially planar surface (232) of the first sacrificial layer, and forming a first element (141) over the substantially planar surface of the first sacrificial layer, including communicating the first element with the conductive material through the first sacrificial layer. In addition, the method includes forming a second sacrificial layer (270) over the first element, including forming a substantially planar surface (272) of the second sacrificial layer, forming a support (290) through the second sacrificial layer to the first element after forming the second sacrificial layer, including filling the support, and forming a second element (142) over the support and the substantially planar surface of the second sacrificial layer. As such, the method further includes substantially removing the first sacrificial layer and the second sacrificial layer, thereby supporting the second element relative to the first element with the support.