Nova Patents
EP1522385A3

Polishing Pad

Abstract

A polishing pad is useful planarizing semiconductor substrates. The polishing pad comprises a polymeric material having a porosity of at least 0.1 volume percent, a KEL energy loss factor at 40°C and 1 rad/sec of 385 to 750 1/Pa and a modulus E' at 40°C and 1 rad/sec of 100 to 400 MPa.

Term

Term ended

Projected expiry passed 6 October 2024, 2 years ago.

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Citations
DocumentRelationOfficeCategoryCited duringRelevant claims
WO0191971A1CitesWorld Intellectual Property Organization (WIPO)XSearch report1-10
US6239188B1CitesUnited States of AmericaASearch report1,3,6,9
US6454634B1CitesUnited States of AmericaDXSearch report1,3,6,9
US6627671B1CitesUnited States of AmericaASearch report1,3,6,9