Method and device for authenticating a subscriber for utilizing services in a wireless lan (wlan)

Description of equivalent WO 03005436 A1

The coating material and magnetic Di of the semiconductor chip for magnetic disk drive drive control Coating method of the semiconductor chip for A screen device drive control Technical field

It is A seal about the dust from the semiconductor chip which carries out drive control of the present invention and the magnetic disk drive. For a Stop reason, it is Co 1 of the Akko 1 Tyng material of a semiconductor chip, and a semiconductor chip. It is related with the Tyng method. Rice field background art

in recent years, it follows on the improvement in performance of a computer -- large-scale-izing of a magnetic disk drive -- high -- Memory density-ization is desired strongly. For this reason, the amount of surfacing of the magnetic head from a medium Making it small or super-smoothing the surfacing side of A do to magnetism is performed. It is magnetism about the semiconductor chip which, on the other hand, carries out drive control of the magnetic head for improvement in the speed. Arranging around a head is performed. since [ however, ] the semiconductor chip is made from Fragile silicon -- various causes -- a semiconductor chip to dust it generates -- this dust enters between a magnetic head and a medium -- Friction of a magnetic recording medium Wear happens -- destruction of information arising etc. and various evils occur.

therefore, dust -- a closure To include sake -- a semiconductor chip -- a coating material -- -ed -- To to reverse -- it is made like.

There are various methods in covering with a coating material.

Drawing 2 being shown in 2, and semiconductor chip 1 The method of covering 0 with potting resin it is .

Drawing 2 Being shown in 3, and semiconductor chip 1 0 tops -- mask 1 using 1 -- Co -- Tyng resin is printed -- carrying out heat hardening of this coating resin Or -- ultraviolet rays It is the method of irradiating with and stiffening.

However, semiconductor chip 1 How to cover 0 by potting resin, Potting Drawing 2 since A resin is liquefied as [ show / in 2 ] -- potting resin 1 2 is pulled by surface tension to the substrate side -- semiconductor chip 1 the corner of 0 is exposed -- the subject that sufficient covering effect is not acquired occurs. of course, Pot of sufficient quantity if Tyng resin is used, without it will expose the corner of semiconductor chip 10 -- -ed -- although To to reverse is made, coating area increases -- the request of a miniaturization -- anti-To do. Since he would like to acquire covering effect sufficient with a small quantity of a coating material in short, it is Ah. To.

When based on the above-mentioned printing method, it is squeegee 1 about resin. It is resin 1 in order to supply by 3. Although it is necessary to make viscosity of 4 high, when Co 1 Ting Elia becomes narrow, resin is semiconductor chip 1. 0 and mask 1 There is a possibility that it may not be filled up enough between 1. Indication of an invention

then, the present invention is made that the above-mentioned subject should be solved -- the object Place to carry out, without it exposes the corner of a semiconductor chip -- coating -- line The coating material of the semiconductor chip for magnetic disk drive drive control to obtain, and magnetism It is in providing the coating method of the semiconductor chip for disk device drive control : Namely Cau of the semiconductor chip for magnetic disk drive drive control concerning the present invention Tyng material, the thermosetting resin formed in the one side side of a substrate and this substrate -- from Co 1 Tyng layer of First 1, being formed on the coating layer of this The 1 -- heat hardening it is sex resin resin -- the coating layer of above-mentioned The 1 -- flow nature at the time of softening It consists of a coating layer of The 2 which consists of high resin.

Cau Tin of the semiconductor chip for magnetic disk drive drive control concerning the present invention The A method, The process of carrying out flip chip bonding of the semiconductor chip to a substrate, and a substrate and a half Process of being filled up with underfill material between conductor chips, the one side side of a substrate -- heat the Co 1 Tyng material in which the coating layer which consists of hardening resin was formed -- Kothe a Ting layer is turned to the semiconductor chip side, and it carries on a semiconductor chip -- coating material Pressurize and heat. The above-mentioned coating layer was made to soften, and it this softened. Coating layer fillet of the above-mentioned substrate side or the above-mentioned underfill material it holds with surface tension between a field and the above-mentioned substrate side -- it is characterized by including the pressurization stiffened where the side of a semiconductor chip is covered, and a heating process.

the coating layer which was softened according to this -- a substrate side or Ann D'Urfey Flets of Le material it is held with surface tension between a A side and a substrate side -- this semiconductor Chic Since it hardens as it is where the side of A is covered, the corner of a semiconductor chip is open. It can prevent coming out and carrying out. Brief explanation of the drawings

Drawing 1 is an explanatory view of a coating material -- Drawing 2 -- a figure -- Co 1 Tyng material of 1 It is an explanatory view in the state where Semiconductor chip was coated. Drawing 3 is semiconductor Chic. It is an explanatory view in the state where it cuted off the corners to A, and Drawing 4 is a level difference part to the edge of a semiconductor chip. It is an explanatory view in the state where it formed, Figure 5 A and figure 5 B are folded in a F P C sheet. It is an explanatory view showing the example which bent, formed A piece and was used as the substrate, Cau to whom Drawing 6 does not have a substrate it is an explanatory view of the Tyng material -- Drawing 7 -- a figure -- the Co 1 Tyng material of 6 -- semiconductor Chic It is an explanatory view in the state where it acted as Co 1 Tyng of the A. Drawing 8 uses a mask and is a coatee. It is an explanatory view in the state of pouring in Tongue resin, Drawing 9 -- a figure -- in the thing of 8 -- optical diffusion It is an explanatory view in the state of irradiating with ultraviolet rays using a board. Drawing 1 0 -- a figure -- the thing of 8 -- Explanatory view in the state of being, applying light reflex particles to a mask inner wall of hole, and irradiating with ultraviolet rays There, a figure -- 1 1 -- a figure -- example which irradiates with ultraviolet rays with an ultraviolet curing unit in the thing of 8 It is a shown explanatory view. a figure -- 1 2 and figure 12 B is purple on the coating area perimeter. it is an explanatory view showing the example which has arranged the outside line irradiation machine -- a figure -- 13 -- a semiconductor chip -- trapezoid It is an explanatory view showing the example formed in A state. Figure 1 4 is under underfill material and a mask. It is an explanatory view in the state of blowing air 1 between fields, Figure 1 5 is an explanatory view showing the example which ground underfill material and was made flat, Drawing 1 6 is underfill. It is an explanatory view showing the state where the mask was pressed against material, Drawing 1 7 is a semiconductor chip. It is an explanatory view in the state where the ridgeline part was equipped with the cap, Drawing 1 8 A and a figure -- 1 8 B is an explanatory view showing the state where the ridgeline part of the semiconductor chip was cuted off the corners. Drawing 1 Half nine It is an explanatory view in the state where the level difference part was formed in the edge part of a conductor chip, Drawing 2 0 -- fine powder it is an explanatory view in the state where the layer was formed at last -- a figure -- 2 1 irradiates a fine powder layer with infrared rays. It is an explanatory view of a state. Drawing 2 2 is semiconductor Chic by the conventional coating method. It is an explanatory view showing the state where the corner of A was exposed, and is Drawing 2. 3 uses a mask and is Cau. It is an explanatory view showing the method filled up with Tyng resin by a squeegee. The best form for inventing

The suitable example of the present invention is described in detail based on an accompanying drawing below.

(The 1st example)

Drawing 1 -- it is an explanatory view of a coating material.

Coating material 2 0 and substrate 2 1 and this substrate 2 It was formed in the one side side of 1. Co 1 Tyng layer 2 of The 1 which consists of thermosetting resin 2, Co 1 Tyng of this The 1 Layer 2 It is formed on two, it is thermosetting resin, and is the 1st coating layer 2. Coating layer 2 of The 2 which consists of resin whose flow nature at the time of softening is higher than 2 From 3 It becomes.

Substrate 2 1, for example, Polyimi, Do resin to thickness is 5. 0 m grade is preferred. It is. Substrate 2 The quality of the material of 1 is not necessarily limited to resin.

The 1st coating layer 2 It is considered as a 2 and heat hardening type epoxy resin and a binder. Mixed resin of the acrylic resin of The can be used. It is further to this mixed resin. Ultraviolet curing type resin may be mixed. however, it is limited to these -- things -- it is -- .

2nd Co 1 Tyng layer 2 3 and heat hardening type epoxy resin, for example, Bis Hye, A thermosetting Knoll A type epoxy resin and resin, such as Dicyclopentene evening Gen A mixture can be used.

the 1st coating layer 2 Coating layer 2 of 2 and The 2 3 -- compounded resin a combination rate is adjusted -- flow nature when once softening the time of carrying out heat hardening -- The 1 Coating layer 2 2 -- coating layer 2 of The 2 the direction of 3 becomes high -- as -- It adjusts.

It is an elastic modulus about flow nature. (Young's modulus) It will be 1 if it sees. 0 The elastic modulus of 0, The 1 Co 1 Tyng layer 2 At 2, it is 6. 0 0*9 0 It flows by slight 0 P a grade and hardness, and a sex is low. A thing is preferred and it is coating layer 2 of The 2. At 3, it is 3. 0*1 0 0 P a grade and the soft good thing of flow nature were preferred. Especially an elastic modulus is the 1st Co. -- Tyng layer 2 At 2, the thing before and behind 8 O O P a is the 2nd coating layer 2. At 3, it is 4. The thing before and behind 0 P a is preferred.

Next, it is the above-mentioned coating material 2 about a semiconductor chip. It is One to the method of coating with 0. Are and it explains.

it is shown in Drawing 2 -- as -- first -- semiconductor chip 2 4 -- substrate 2 5 -- flip chip Connection is carried out and it carries. Substrate 2 It is Limit at 5, a wiring board, a package, especially F P C, etc. There is no law.

next, semiconductor chip 2 4 and substrate 2 between 5 -- flows, such as an epoxy resin, -- a sex -- it is and is filled up with sealing resin (underfill material 2 6) -- it is made to harden

next, the above-mentioned coating material 2 0 -- the 2nd coating layer 2 3 -- semiconductor A tip 2 turning to 4 sides -- semiconductor chip 2 it carries on four -- substrate 2 It pressurizes from 1. It heats and carries out heat hardening of the coating layer.

Curing conditions are 1. 1 It is 3 at 0 °C. It is 1 in the oven after making it harden in about 0 second. 5 0 °C and 3 About [ 0 minute ] post cure To.

the early stage of the above-mentioned heating process -- the 1st coating layer 2 2 and Co 1 tee of The 2 Tongue layer 2 softening both 3 -- substrate 2 as [ show / to Drawing 2 / the pressurization from one ] -- semiconductor chip 2 It is pushed out by the side of 4. It is Co of good The 2 of flow nature that time. One Tyng layer 2 3 and semiconductor chip 2 Four the lower parts of the side and underfill material 2 Six Phi Let side 2 6 a (slope) It flows out in between. On the other hand, it is out of flow nature. Co 1 Tyng layer 2 of The 1 which is not high 2 is semiconductor chip 2. Four side surfaces and substrates 2 It flows out between the fields of 1.

and both resin and Fillet side 2 6 a and semiconductor chip 2 The side of 4, and substrate 2 in contact with the undersurface of 1 -- the surface tension between these sides -- fillet surface 2 It is held between 6 a and a substrate side.

And heat hardening is carried out in this state. Co of The 1 with especially high viscosity 1 Tyng material 2 2, semiconductor chip 2 it flows through the side of 4 and does not fall -- substrate 2 1 -- half--- Conductor chip 2 since heat hardening is held and carried out between the side surfaces of 4 -- the former -- a corner is not exposed to obtaining -- semiconductor chip 2 the dust of the 4 surface -- Perfect -- closure To include.

Drawing 2 shows -- as -- substrate 2 1 -- semiconductor chip 2 it is larger than 4 -- half-Guiding if it is made to make the method of outside project from the edge of a body chip -- surface tension -- an operation -- To -- I am easy -- since -- it is suitable.

The 1st coating layer 2 Coating layer 2 of 2 and The 2 The thickness of 3, and the above It is 4 like. : 1*3 : It is preferred to use about one. coating layer 2 of The 2 in which this of flow nature is good if quantity of 3 is made not much large, it will flow and fall -- semiconductor Chip 2 It is because there is a possibility that the side of 4 may be exposed.

It is substrate 3 in this case. 1 and semiconductor chip 3 It is underfill material between 0. There is no About with which it is filled up beforehand, Semiconductor chip 3 It is performed directly above to 0. Coating material 2 It acts as Co 1 Tyng of 0, the time of this coating -- substrate 3 1 and semiconductor chip 3 the air between 0 -- suction implement (not shown) etc. -- drawing in and exhausting Co 1 Tyng layer 2 of good The 2 of While and flow nature making 3 into underfill material -- Filling up can be carried out. Namely, a coating material and Ann D'Urfey It serves as Le material.

By the above, it is a coating layer. Although it had two-layer composition, even if it is one layer Les ^ It is coating layer 2 of The 1 as the quality of the material of a coating layer in this case. Co 1 Tyng layer 2 of 2 and The 2 Resin of the middle flow nature of 3 is chosen. It becomes.

ultraviolet curing type resin is used for a coating layer -- substrate 2 1 -- transparent material It irradiates with ultraviolet rays and may make it make it harden, using and pressurizing. Drawing 3 -- the ridgeline part of semiconductor chip 24 -- camfering part 2 The example in which 7 was formed is shown. thus, in size, the angle of a corner part should not hear by cutting off a ridgeline part the corners To to the above-mentioned coating material 2 0 (a coating layer also contains the thing of one layer) Exposure of a corner can be further prevented from using. Camfering It may go to all the ridgeline parts, and they may be only some ridgeline parts.

Drawing 4 -- semiconductor chip 2 the ridgeline part of 4 -- level difference part 2 The example in which 8 was formed is shown. This Also by Re, it is the above-mentioned coating material 2. 0 ( a coating layer also contains the thing of one layer) Exposure of a corner can be further prevented from using. Even if a level difference part may be formed in all the ridgeline parts and it forms only in some ridgeline parts It is good.

Drawing 5 A and figure 5 B show the example of further others.

At this example, it is semiconductor chip 2. It is Polyimi about 4. F P C (flexible print circuit) which consists of A films etc. Sheet 3 It carries on one, coating layer of the above [ a / this semiconductor Chi 1 ] A 2 F PC sheet near 4 -- piece 3 of bending 1 a is formed -- this -- bending (one layer and two-layer are included.) Piece 3 not illustrating -- forming Keep it. and piece 3 of bending 1 a -- semiconductor chip 2 it bends on four -- pressurization and heating It carries out and carries out heat hardening of the coating layer. It will very be Easy if it does in this way. With a single method, it is semiconductor chip 2. Exposure of the corner of 4 can be prevented.

Drawing 6 and Drawing 7 show other examples.

this example -- substrate 2 it does not have 1 -- two-layer Co 1 Tyng material 2 0 is used. Namely, coating material 2 Coating layer 2 of the same The 1 as 0 and the above Coating layer 2 of 2 and The 2 3 is only laminated.

this coating material 2 as [ show / in Drawing 6 / 0 ] -- substrate 3 it mounted on one -- half--- Conductor chip 3 0 tops -- coating layer 2 of The 2 turning 3 to the semiconductor chip side -- Put on, next a figure -- it is shown in 7 -- as It is 1, without pressurizing. 5 Heat of the temperature about 0 °C It is coating material 2 about a wind. It blows to 0, as -- Si 1 ♪-like Chee as [ fascinate / A ] -- coating material 20 is softened -- semiconductor chip 3 the side of 0 is also made to cover -- heat hardening is carried out in this state. The 1st coating layer 2 Since resin with low flow nature at the time of softening is used for 2, it is semiconductor chip 3. The corner of 0 is not necessarily exposed.

It is substrate 3 in this case. 1 and semiconductor chip 3 It is underfill material between 0. Without it is filled up beforehand, Semiconductor chip 3 It is performed directly above to 0. Coating material 2 0 is coated, the time of this coating -- substrate 3 1 and semiconductor chip 3 the air between 0 -- suction implement (not shown) etc. -- drawing in and exhausting Co 1 Tyng layer 2 of good The 2 of While and flow nature making 3 into underfill material -- Filling up can be carried out. namely, a coating process and Underfu it serves as the restoration process of A ring material -- again -- a coating material and underfill material -- and It kneads.

Drawing 8 shows the example of further others.

At this example, it is substrate 3 first. Semiconductor chip 3 mounted in 1 He is Ma about the side of 0. A screen 3 It covers by 5, Mask 3 Five holes 3 In six, it is mask hole 3. It is surface tension to the wall in six. It creeps up. (getting wet going up) Coating resin 3 only with arising low viscosity 7 is poured in and semiconductor chip 30 is covered. subsequently, poured-in coating tree Fat 3 7 -- heat hardening -- or ultraviolet curing is carried out.

Since Co 1 Tyng resin with low viscosity is poured in, Co 1 Ting Elia is narrow. Even if it is a case, it can be certainly filled up with coating resin. It is Hard as it is. By making it turn, it is coating resin 3. In 7, a circumference part becomes high from the central part. Since it hardens in the state, it is semiconductor chip 3. The corner of 0 is certainly prevented from being exposed. It can do. It may be filled up separately beforehand and underfill material is Co 1. Tyng resin 3 It is filled up with 7 and can be made to harden.

Drawing 9 -- Drawing 8 -- setting -- coating resin 3 Case where ultraviolet curing of 7 is carried out setting -- ultraviolet exposure lamp 3 9 and Co 1 Tyng resin 3 between 7 -- optical diffusion board 3 The example which arranged 8 is shown. if it does in this way -- ultraviolet rays -- optical diffusion board 3 8 it is spread -- coating resin 3 7 is irradiated equally -- mask hole 3 6 is narrow. a part will also be irradiated with ultraviolet rays -- it comes out to prevent generating of an unhardened portion Last .

Drawing 1 0 is set to Drawing 8 -- Co 1 Tyng resin 3 Case where ultraviolet curing of 7 is carried out setting -- mask hole 3 The wall surface and semiconductor chip 3 of 6 the side of 0 -- binder Light reflex particles 4, such as hardened glass, The example which applied 0 is shown. if it does in this way, diffused reflection of the ultraviolet rays will be carried out by light reflex particles -- ultraviolet rays -- mask hole 3 the inside of six -- deep -- until it glares -- generating of an unhardened portion can be prevented.

Drawing 1 1 is set to Drawing 8 -- coating resin 3 Case where ultraviolet curing of 7 is carried out Set. ultraviolet curing unit 4 1 -- the tip -- mask hole 3 It is located in the lower part of 6. it inserts for obtaining -- mask hole 3 Irradiation machine 4 after stiffening resin of the 6 lower part It is raising about 1. irradiating Kicking and the whole with ultraviolet rays -- coating resin 3 The example which has 7 hardened is shown. Generating of an unhardened portion can be prevented also by this.

Drawing 1 2 A and a figure -- 1 2 B and ultraviolet curing unit 4 1 -- the coating Eria perimeter more than one are arranged beltlike -- Co 1 Tyng resin is supplied, irradiating with ultraviolet rays while preventing a projection of resin to the outside of Eria by things -- generating of an unhardened portion The example to prevent is shown.

Drawing 1 3 is set to Drawing 8 -- coating resin 3 Case where ultraviolet curing of 7 is carried out Set. semiconductor chip 3 forming the shape of 0 in a trapezoid -- ultraviolet rays Mask hole 3 even the bottom of 6 is irradiated -- Co 1 Tyng resin 3 Unhardened portion of 7 The example which prevents generating is shown.

Drawing 1 in the case of Drawing 8, 4 is set -- underfill material 2 6 and mask hole 3 6 in order to prevent resin from flowing out of the crevice between it and a bottom -- the inside of the crevice from the side -- A nozzle 4 while blowing air 1 from 2 -- Co 1 Tyng resin 3 the example which pours in 7 -- To indicate.

Drawing 1 5 and underfill material 2 the surface of 6 becomes even -- as -- beforehand -- Founder 1 philharmonic material 2 Mask 3 after grinding 6 it is arranging 5 -- undershirt a philharmonic -- material -- 2 6 and mask hole 3 the example which prevented the crevice from producing between six bottoms -- To indicate. Thereby, it is coating resin 3. 7 can be prevented from flowing out.

Drawing 1 6 and underfill material 2 The undershirt of an uncured state -- the time of heat hardening of 6 -- yet -- fill material 2 6 -- mask 3 5 is pressed -- thereby -- underfill material 2 6 and mask hole 3 The example which prevents a crevice from producing between six bottoms is shown. To this Coating resin 3 The outflow of 7 can be prevented. underfill material 2 the time of hardening of 6 -- simultaneous -- coating resin 3 7 is poured in -- underfill material 2 6 and Co 1 Tyng resin 3 It may be made to stiffen 7 simultaneously. Drawing 1 7 and semiconductor chip 3 Cap 4 which can cover the ridgeline part of the upper surface of 0 It is semiconductor chip 3 beforehand about 5. Coating resin 4 after equipping 0 By 3, it is semiconductor chip 3. The example which coats 0 is shown. Semiconductor chip 3 0 A corner is cap 4. Since it is covered with 5, it does not expose. In this case Coating resin 3 7, old material (thermosetting resin or ultraviolet curing resin) It can use. 4 6 is a vamp.

Drawing 1 8 A and a figure -- 1 8 B and semiconductor chip 3 the ridgeline part of 0 -- Drawing 1 8 B -- To indicate -- like -- camfering part 4 The example in which 7 was formed is shown. Thus, camfering part 4 7 is formed. By carrying out, it is semiconductor chip 3. Since the angle of the corner of 0 becomes an obtuse angle, he is Cau Tin. A resin 4 It is semiconductor chip 3 at 3. A corner is [ the time of coating 0 ] exposed. It can prevent. Coating resin 4 3 is usual resin. (thermosetting resin or ultraviolet curing resin) Coating layer 2 of above-mentioned The 1 Co of 2 and The 2 One Tyng layer 2 It is suitable if the resin which has the middle flow nature of 3 is used. Drawing 1 9 and semiconductor chip 3 To the ridgeline part of the upper surface of 0, it is level difference part 4. Example in which 8 was formed It is shown. thus, level difference part 4 forming 8 -- level difference part 4 8 -- resin Pool since it becomes -- coating resin 4 3 -- semiconductor chip 3 It acted as Co 1 Tyng of 0. the time -- a corner -- exposing -- a thing -- it can prevent . Coating resin 4 3 and usual resin (thermosetting resin or ultraviolet curing resin) Kothe of above-mentioned The 1 Ting layer 2 Co 1 Tyng layer 2 of 2 and The 2 Resin which has the middle flow nature of 3 It is suitable if it uses.

Drawing 2 0 and semiconductor chip 3 Epoxy tree mixed to the binder on the surface of 0 Resin fine powder, such as fat, is sprinkled and it is 5*1. Fine powder layer 5 of about zero thickness 0 is formed. After carrying out, this fine powder layer 5 0 tops -- coating resin 4 3 is applied -- also carrying out heat hardening To shows the example which carried out ultraviolet curing. fine powder layer 5 forming 0 -- surface tension a fall or increase of surface resistance -- coating resin 4 Flow nature of 3 it can be made to fall -- semiconductor chip 3 It comes out to prevent exposure of the corner of 0. It cuts. Coating resin 4 3, usual resin (thermosetting resin or ultraviolet-rays hardening resin) Coating layer 2 of above-mentioned The 1 Coatee of 2 and The 2 Tongue layer 2 It is suitable if the resin which has the middle flow nature of 3 is used.

Drawing 2 1 and semiconductor chip 3 Epoxy tree mixed to the binder on the surface of 0 Resin fine powder, such as fat, is sprinkled and it is 1. 0*1 Fine powder layer 5 of the thickness about 5 / i m It is a form about 0. After accomplishing, infrared irradiation lamp 5 1 -- fine powder layer 5 0 is heated -- it is made to harden An example is shown. what is called -- it burns -- it is hard to produce the flow of resin -- semiconductor chip 3 Exposure of the corner of 0 can be prevented. EFFECT OF THE INVENTION

as mentioned above The present invention Softened coating layer, Also carry out a substrate side. To is held with surface tension between a fillet surface of underfill material, and a substrate side. It hardens, where the side of this semiconductor chip is covered. The sake, Angle of a semiconductor chip A part can be prevented from being exposed. or The present invention Kothe who softened Inge material, As [ melt / sheet shaped cheese ] The upper surface of a semiconductor chip, and side A field is covered. It hardens in the state as it is. The sake, A corner of a semiconductor chip is To expose. That of To can be prevented.