Package for a semiconductor light emitting device

A semiconductor light emitting device package includes a substrate (30) with a core (24) and a copper layer (25,29) overlying the core. The light emitting device (20) is connected to the substrate directly or indirectly through a wiring substrate. The core (24) of the substrate (30) may be, for example, ceramic, Al2O3, AlN, alumina, silicon nitride, or a printed circuit board. The copper layer (25,29) may be bonded to the core by a process such as direct bonding of copper or active metal brazing.