EP1481284A4
Method of passivating of low dielectric materials in wafer processing
8 sheets
Sheet 1 Sheet 2 Sheet 3 Sheet 4 Sheet 5 Sheet 6 Sheet 7 Sheet 8
Every citation, both ways
| Document | Relation | Office | Category | Cited during | Relevant claims |
|---|---|---|---|---|---|
| WO0133613A2 | Cites | World Intellectual Property Organization (WIPO) | Y | Search report | 1-26 |
| WO0201621A2 | Cites | World Intellectual Property Organization (WIPO) | YX | Search report | 1-26 |
| WO0217373A1 | Cites | World Intellectual Property Organization (WIPO) | A | Search report | 1,14 |
| US5804508A | Cites | United States of America | – | Search report | – |
| WO0201621A | Cites | World Intellectual Property Organization (WIPO) | – | – | – |
| WO0133613A | Cites | World Intellectual Property Organization (WIPO) | – | – | – |
| WO0217373A | Cites | World Intellectual Property Organization (WIPO) | – | – | – |
| YOKOGAWA H ET AL: "HYDROPHOBIC SILICA AEROGELS", JOURNAL OF NON-CRYSTALLINE SOLIDS, NORTH-HOLLAND PHYSICS PUBLISHING. AMSTERDAM, NL, vol. 186, 1995, pages 23 - 29, XP002058805, ISSN: 0022-3093 | Non-patent | – | – | Search report | – |
| KAWAKAMI N ET AL: "A SUPER LOW-K (K=1.1) SILICA AEROGEL FILM USING SUPERCRITICAL DRYING TECHNIQUE", PROCEEDINGS OF THE IEEE, INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, 2000, pages 143 - 145, XP001037259 | Non-patent | – | – | Search report | – |
| See also references of WO 03077032A1 | Non-patent | – | – | Search report | – |
33 members in 8 offices
Priority claims5
| Document | Office | Kind | Date |
|---|---|---|---|
| 361917P | United States of America | – | |
| 36191702 | United States of America | P | |
| 369052P | United States of America | – | |
| 36905202 | United States of America | P | |
| 0306813 | United States of America | W |
Members33
| Document | Office | Kind | |
|---|---|---|---|
| WO03077032A1 | World Intellectual Property Organization (WIPO) | A1 | |
| AU2003220039A1 | Australia | A1 | |
| TW200305213A | Taiwan Province of China | A | |
| US2003198895A1 | United States of America | A1 | |
| WO03087936A1 | World Intellectual Property Organization (WIPO) | A1 | |
| AU2003226048A1 | Australia | A1 | |
| TW200308051A | Taiwan Province of China | A | |
| US2004018452A1 | United States of America | A1 | |
| EP1481284A1 | European Patent Office (EPO) | A1 | |
| KR20040111507A | Republic of Korea | A | |
| EP1495366A1 | European Patent Office (EPO) | A1 | |
| JP2005519481A | Japan | A | |
| CN1646990A | China | A | |
| JP2005522737A | Japan | A | |
| CN1656425A | China | A | |
| US2005191865A1 | United States of America | A1 | |
| US2005227187A1 | United States of America | A1 | |
| TWI263275B | Taiwan Province of China | B | |
| WO2006104670A2 | World Intellectual Property Organization (WIPO) | A2 | |
| EP1481284A4This record | European Patent Office (EPO) | A4 | |
| CN1296771C | China | C | |
| US7169540B2 | United States of America | B2 | |
| TWI272693B | Taiwan Province of China | B | |
| CN101005024A | China | A | |
| CN100335969C | China | C | |
| US7270941B2 | United States of America | B2 | |
| WO2006104670A3 | World Intellectual Property Organization (WIPO) | A3 | |
| US7387868B2 | United States of America | B2 | |
| JP2008535249A | Japan | A | |
| JP4246640B2 | Japan | B2 | |
| JP4424998B2 | Japan | B2 | |
| KR100969027B1 | Republic of Korea | B1 | |
| CN101005024B | China | B |
22 legal events, as the office reported them to INPADOC
Over the term
Point at a mark for the eventEvents
| Event | Code | |
|---|---|---|
| Application deemed to be withdrawnWithdrawn18D | 18D | |
| Information on the status of an ep patent application or granted ep patentGrantedSTATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWNSTAA | STAA | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Despatch of communication of intention to grant a patentORIGINAL CODE: EPIDOSNIGR1GRAP | GRAP | |
| First examination report despatched17Q | 17Q | |
| First examination report despatched17Q | 17Q | |
| Supplementary search report drawn up and despatchedA4 | A4 | |
| Information on inventor provided before grant (corrected)RIN1 | RIN1 | |
| Information on inventor provided before grant (corrected)RIN1 | RIN1 | |
| Party data changed (applicant data changed or rights of an application transferred)RAP1 | RAP1 | |
| Request for examination filed17P | 17P | |
| Designated contracting statesAK | AK | |
| Request for extension of the european patentAX | AX | |
| Public reference made under article 153(3) epc to a published international application that has entered the european phaseORIGINAL CODE: 0009012PUAI | PUAI |
Numbers
- Publication
- 1481284
- Application
- 37163276
Titles3
- German
- VERFAHREN ZUR PASSIVIERUNG VON MATERIALIEN MIT NIEDRIGEM DIELEKTRIKUM BEI DER WAFERVERARBEITUNG
- English
- METHOD OF PASSIVATING OF LOW DIELECTRIC MATERIALS IN WAFER PROCESSING
- French
- PROCEDE DE PASSIVATION DE MATERIAUX A FAIBLE CONSTANTE DIELECTRIQUE DANS LE TRAITEMENT DE PLAQUETTES
Classification
- CPC, 11
- C23C8/10
- C23C26/00
- C23C30/00
- H10P70/234
- H10P70/80
- H10P14/6926
- H10P14/6922
- H10P14/665
- H10P14/6534
- H10P95/08
- H10P95/00
- IPC, 14
- G03F7 00
- G03F7 16
- G03F7 36
- G03F7 42
- C23C8 00
- C23C14 02
- C25F1 00
- C25F5 00
- C23C8 10
- C23C26 00
- C23C30 00
- H10P14 68
- H10P14 692
- G03F7 40
Designated states1
- Contracting states, 1
- Türkiye
