Systems and methods for electrically isolating portions of wafers

Systems for electrically isolating portions of wafers are provided. A representative system (200) includes a first wafer (201) and a first conductor (202) formed at least partially through the first wafer. A first conductor insulating layer (204) is formed at least partially through the first wafer. The first conductor insulating layer engages the first conductor and is disposed between the first conductor and material of the first wafer. A first outer insulating layer (210) also is provided that is formed at least partially through the first wafer. The first outer insulating layer is spaced from the first conductor insulating layer. Both the first conductor insulating layer and the first outer insulating layer are formed of dielectric material. Methods and other systems also are provided.