Chip type light emitting diode and method of manufacture thereof
Abstract
A chip type light emitting diode and a method of manufacture thereof are disclosed. The chip type light emitting diode can be mounted together with other electronic components on a mother board in the same process at one time and which is very useful as a light source for a liquid crystal backlight. The chip type light emitting diode has a base portion mounted to one surface side of the mother board, a body portion extending from the base portion and adapted to pass through a hole in the mother board, and a light emitting portion provided on the body portion to emit light on the other surface side of the mother board. The base portion is provided with a pair of external connection electrodes electrically connected to the light emitting portion. The light emitting portion is sealed with a resin sealant block. In one example, when the base portion is mounted to the back surface side of the mother board, the light emitting portion is so arranged that its light emitting direction matches the light conduction direction of the liquid crystal backlight arranged on the mother board. The method of manufacturing a chip type light emitting diode performs a plurality of steps to form a plurality of chip type light emitting diodes on a single collective circuit board and a final step of dividing the collective circuit board into individual chip type light emitting diodes.

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Projected expiry passed 5 September 2021, 5.1 years ago.
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1 sheet
Sheet 1
Every citation, both ways
| Document | Relation | Office | Category | Cited during | Relevant claims |
|---|---|---|---|---|---|
| US4742432A | Cites | United States of America | X | Search report | 1-3,6-8 |
| US5331512A | Cites | United States of America | A | Search report | 1,4 |
| PATENT ABSTRACTS OF JAPAN vol. 004, no. 157 (E - 032) 4 November 1980 (1980-11-04) | Non-patent | – | – | Search report | – |
| PATENT ABSTRACTS OF JAPAN vol. 014, no. 401 (E - 0971) 30 August 1990 (1990-08-30) | Non-patent | – | – | Search report | – |
| PATENT ABSTRACTS OF JAPAN vol. 017, no. 313 (E - 1381) 15 June 1993 (1993-06-15) | Non-patent | – | – | Search report | – |
| PATENT ABSTRACTS OF JAPAN vol. 017, no. 476 (E - 1424) 30 August 1993 (1993-08-30) | Non-patent | – | – | Search report | – |
| PATENT ABSTRACTS OF JAPAN vol. 018, no. 144 (E - 1521) 10 March 1994 (1994-03-10) | Non-patent | – | – | Search report | – |
| PATENT ABSTRACTS OF JAPAN vol. 1995, no. 02 31 March 1995 (1995-03-31) | Non-patent | – | – | Search report | – |
10 members in 6 offices; this record represents the family
Priority claims4
| Document | Office | Kind | Date |
|---|---|---|---|
| 2000278087 | Japan | – | |
| 2000278087 | Japan | A | |
| 2001210604 | Japan | – | |
| 2001210604 | Japan | A |
Members10
| Document | Office | Kind | |
|---|---|---|---|
| US2002030445A1 | United States of America | A1 | |
| KR20020021004A | Republic of Korea | A | |
| EP1189291A2 | European Patent Office (EPO) | A2 | |
| CN1344036A | China | A | |
| JP2002164583A | Japan | A | |
| TW508843B | Taiwan Province of China | B | |
| KR100454777B1 | Republic of Korea | B1 | |
| CN1187844C | China | C | |
| EP1189291A3This record | European Patent Office (EPO) | A3 | |
| JP3930710B2 | Japan | B2 |
10 legal events, as 2 offices reported them to INPADOC
Over the term
Point at a mark for the eventEvents
| Event | Code | Office | |
|---|---|---|---|
| Application deemed to be withdrawnWithdrawn18D | 18D | EP | |
| Information on the status of an ep patent application or granted ep patentGrantedSTATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWNSTAA | STAA | EP | |
| Designated country de not longer valid8566 | 8566 | DE | |
| Designation fees paidAKX | AKX | EP | |
| Designated contracting statesAK | AK | EP | |
| Request for extension of the european patentAX | AX | EP | |
| Search report despatchedORIGINAL CODE: 0009013PUAL | PUAL | EP | |
| Designated contracting statesAK | AK | EP | |
| Request for extension of the european patentAL;LT;LV;MK;RO;SIAX | AX | EP | |
| Public reference made under article 153(3) epc to a published international application that has entered the european phaseORIGINAL CODE: 0009012PUAI | PUAI | EP |
Numbers
- Publication
- 1189291
- Application
- 13075411
Titles3
- German
- Lichtemittierende Diode in Chipbauweise und Herstellungsverfahren
- English
- Chip type light emitting diode and method of manufacture thereof
- French
- Diode émettrice de lumière de type puce et méthode de fabrication
Classification
- CPC, 6
- H10H20/853
- G02B6/4202
- H05K1/182
- H10H20/8506
- H10H20/856
- H10W90/754
- IPC, 7
- H01L33 00
- H10W74 00
- G02B6 42
- H01L33 54
- H01L33 56
- H01L33 60
- H05K1 18
Designated states2
- Contracting states, 1
- Türkiye
- Extension states, 1
- Slovenia