EP1168426A3

Method of plasma depositing a low dielectric constant insulating film

Abstract

The present invention discloses a film forming method for forming an insulating film having a low dielectric constant. This method comprises the steps of adding at least one diluting gas of an inert gas and a nitrogen gas (N2) to a major deposition gas component consisting of siloxane and N2O, converting the resultant deposition gas into plasma, causing reaction in the plasma, and forming an insulating film 25,27, or 28 on a substrate targeted for film formation.

EP1168426A3, drawing sheet 1
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Projected expiry passed 8 June 2021, 5.3 years ago.

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