Circuit board with a metal substrate

An improved circuit board apparatus configured for mounting electronic components in a circuit arrangement comprises a metal substrate (22) having a first side (24) and a second side (26), a first-side laminar structure and a second-side laminar structure. The first-side laminar structure includes at least one first-side conductive stratum (32) alternated with at least one first-side dielectric stratum (28) affixed at the first side The second-side laminar structure includes at least one second-side conductive stratum (34) alternated with at least one second-side dielectric stratum (30) affixed at the second side of the metal substrate. The apparatus further comprises a plurality of electrically conductive interside courses (46, 48) intermediate selected first-side strata of the at least one first-side conductive stratum and selected second-side strata of the at least one second-side conductive stratum.