EP0961533A3
Circuit board and method of manufacturing the same
Abstract
Through holes (104) formed in an electrical insulating substrate (102) having adhesive layers (101) on its both surfaces are filled with a conductor (105). Then, supporting bases (106) having wiring layers (107) with a predetermined pattern are laminated on both the surfaces of the electrical insulating substrate (102), which are then heated and pressurized. After that, the supporting bases (106) are removed, thus obtaining a circuit board in which the wiring layers (107) have been embedded in the adhesive layers (101). The conductor (105) within the through holes (104) are compressed sufficiently, thus forming minute via holes with high reliability.
Term
Term ended
Projected expiry passed 12 May 2019, 7.4 years ago.
- Priority
- Filed
- Published
- Projected expiry
- Today
3 sheets
Sheet 1 Sheet 2 Sheet 3
Every citation, both ways
| Document | Relation | Office | Category | Cited during | Relevant claims |
|---|---|---|---|---|---|
| EP0568930A2 | Cites | European Patent Office (EPO) | AY | Search report | 1-3,8,18,19,26 |
| US5407511A | Cites | United States of America | AX | Search report | 1-3,6,9,19,27 |
| PATENT ABSTRACTS OF JAPAN vol. 1998, no. 08 30 June 1998 (1998-06-30) | Non-patent | – | – | Search report | – |
| PATENT ABSTRACTS OF JAPAN vol. 018, no. 230 (E - 1542) 26 April 1994 (1994-04-26) | Non-patent | – | – | Search report | – |
| PATENT ABSTRACTS OF JAPAN vol. 1995, no. 09 31 October 1995 (1995-10-31) | Non-patent | – | – | Search report | – |
18 members in 6 offices; this record represents the family
Priority claims6
| Document | Office | Kind | Date |
|---|---|---|---|
| 13173198 | Japan | – | |
| 13173198 | Japan | A | |
| 15958698 | Japan | – | |
| 15958698 | Japan | A | |
| 16814398 | Japan | – | |
| 16814398 | Japan | A |
Members18
| Document | Office | Kind | |
|---|---|---|---|
| EP0961533A2 | European Patent Office (EPO) | A2 | |
| JPH11354909A | Japan | A | |
| JP2000036664A | Japan | A | |
| JP2000077800A | Japan | A | |
| US6197407B1 | United States of America | B1 | |
| EP0961533A3This record | European Patent Office (EPO) | A3 | |
| JP3172711B2 | Japan | B2 | |
| US2001005545A1 | United States of America | A1 | |
| JP3215090B2 | Japan | B2 | |
| SG86345A1 | Singapore | A1 | |
| TW507508B | Taiwan Province of China | B | |
| US6532651B1 | United States of America | B1 | |
| US6565954B2 | United States of America | B2 | |
| US2003180512A1 | United States of America | A1 | |
| US6748652B2 | United States of America | B2 | |
| EP0961533B1 | European Patent Office (EPO) | B1 | |
| DE69931212D1 | Germany | D1 | |
| DE69931212T2 | Germany | T2 |
38 legal events, as 5 offices reported them to INPADOC
Over the term
Point at a mark for the eventEvents
| Event | Code | Office | |
|---|---|---|---|
| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
| Notification of lapseLapsedST | ST | FR | |
| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
| Gb: european patent ceased through non-payment of renewal feeCeasedGBPC | GBPC | EP | |
| Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal feeWithdrawnR119 | R119 | DE | |
| Annual fee paid to national office [announced via postgrant information from national office to epo]GrantedPGFP | PGFP | EP | |
| Annual fee paid to national office [announced via postgrant information from national office to epo]GrantedPGFP | PGFP | EP | |
| Annual fee paid to national office [announced via postgrant information from national office to epo]GrantedPGFP | PGFP | EP | |
| Annual fee paid to national office [announced via postgrant information from national office to epo]GrantedPGFP | PGFP | EP | |
| Annual fee paid to national office [announced via postgrant information from national office to epo]GrantedPGFP | PGFP | EP | |
| No opposition filedOpposition26N | 26N | EP | |
| No opposition filed within time limitOppositionORIGINAL CODE: 0009261PLBE | PLBE | EP | |
| Information on the status of an ep patent application or granted ep patentGrantedSTATUS: NO OPPOSITION FILED WITHIN TIME LIMITSTAA | STAA | EP | |
| Fr: translation filedET | ET | EP | |
| Corresponds to:REF | REF | EP | |
| Translation of granted ep patentGrantedTRGR | TRGR | SE | |
| Designated contracting statesAK | AK | EP | |
| European patent grantedGrantedFG4D | FG4D | GB | |
| (expected) grantORIGINAL CODE: 0009210GRAA | GRAA | EP | |
| Grant fee paidORIGINAL CODE: EPIDOSNIGR3GRAS | GRAS | EP | |
| Despatch of communication of intention to grant a patentORIGINAL CODE: EPIDOSNIGR1GRAP | GRAP | EP | |
| Designation fees paidDE FI FR GB SEAKX | AKX | EP | |
| First examination report despatched17Q | 17Q | EP | |
| Request for examination filed17P | 17P | EP | |
| Information on inventor provided before grant (corrected)RIN1 | RIN1 | EP | |
| Information on inventor provided before grant (corrected)RIN1 | RIN1 | EP | |
| Information on inventor provided before grant (corrected)RIN1 | RIN1 | EP | |
| Information on inventor provided before grant (corrected)RIN1 | RIN1 | EP | |
| Information on inventor provided before grant (corrected)RIN1 | RIN1 | EP | |
| Designated contracting statesAK | AK | EP | |
| Request for extension of the european patentAL;LT;LV;MK;RO;SIAX | AX | EP | |
| Search report despatchedORIGINAL CODE: 0009013PUAL | PUAL | EP | |
| Designated contracting statesAK | AK | EP | |
| Request for extension of the european patentAL;LT;LV;MK;RO;SIAX | AX | EP | |
| Public reference made under article 153(3) epc to a published international application that has entered the european phaseORIGINAL CODE: 0009012PUAI | PUAI | EP |
Numbers
- Publication
- 0961533
- Application
- 991086323
Titles3
- German
- Leiterplatte und Verfahren zu deren Herstellung
- English
- Circuit board and method of manufacturing the same
- French
- Plaque à circuit et son procédé de fabrication
Classification
- CPC, 23
- H05K3/20
- H05K3/007
- H05K3/205
- H05K3/386
- H05K3/4069
- H05K3/4614
- H05K3/4617
- H05K3/4623
- H05K3/4658
- H05K3/4688
- H05K2201/0116
- H05K2201/0195
- H05K2201/10378
- H05K2203/0152
- H05K2203/0384
- H05K2203/061
- H05K2203/1461
- Y10S428/901
- Y10T29/49155
- Y10T428/24917
- Y10T29/49126
- Y10T29/49165
- Y10T428/2804
- IPC, 6
- H01R12 04
- H05K3 00
- H05K3 20
- H05K3 38
- H05K3 40
- H05K3 46
Designated states25
- Contracting states, 19
- Austria
- Belgium
- Switzerland
- Cyprus
- Germany
- Denmark
- Spain
- Finland
- France
- United Kingdom
- Greece
- Ireland
- Italy
- Liechtenstein
- Luxembourg
- Monaco
- Netherlands (Kingdom of the)
- Portugal
- Sweden
- Extension states, 6
- Albania
- Lithuania
- Latvia
- North Macedonia
- Romania
- Slovenia