System and method of manufacturing semicustom integrated circuits using reticle primitives and interconnect reticles
Abstract
A system for, and method of, manufacturing an integrated circuit (IC) and an IC manufactured by the method. In one embodiment, the system includes: (1) a library of reticle primitives, at least two of the reticle primitives containing patterns corresponding to circuit modules to be contained in the IC, (2) an interconnect reticle containing patterns corresponding to interconnecting conductors for electrically coupling the circuit modules and (3) lithographic equipment that employs the at least two of the recticle primitives and the interconnect reticle to create a lithograph of the circuit modules and the interconnecting conductors.

Term
Term ended
Projected expiry passed 10 May 2019, 7.4 years ago.
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1 sheet
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Every citation, both ways
| Document | Relation | Office | Category | Cited during | Relevant claims |
|---|---|---|---|---|---|
| US5652163A | Cites | United States of America | X | Search report | 1-17 |
8 members in 6 offices; this record represents the family
Priority claims5
| Document | Office | Kind | Date |
|---|---|---|---|
| 82924 | United States of America | – | |
| 8292498 | United States of America | A | |
| 8292498 | United States of America | A | |
| 82924 | – | – | – |
| US19980082924 | – | – | – |
Members8
| Document | Office | Kind | |
|---|---|---|---|
| EP0959501A2 | European Patent Office (EPO) | A2 | |
| CN1236988A | China | A | |
| KR19990088432A | Republic of Korea | A | |
| JP2000003859A | Japan | A | |
| US6192290B1 | United States of America | B1 | |
| KR100312354B1 | Republic of Korea | B1 | |
| TW470999B | Taiwan Province of China | B | |
| EP0959501A3This record | European Patent Office (EPO) | A3 |
17 legal events, as the office reported them to INPADOC
Over the term
Point at a mark for the eventEvents
| Event | Code | |
|---|---|---|
| Application refused18R | 18R | |
| Information on the status of an ep patent application or granted ep patentGrantedSTATUS: THE APPLICATION HAS BEEN REFUSEDSTAA | STAA | |
| Appeal procedure closedAppealORIGINAL CODE: EPIDOSNNOA9EAPBT | APBT | |
| Party data changed (applicant data changed or rights of an application transferred)RAP3 | RAP3 | |
| Appeal reference modifiedAppealORIGINAL CODE: EPIDOSCREFNEAPAF | APAF | |
| Date of receipt of notice of appeal recordedAppealORIGINAL CODE: EPIDOSNNOA2EAPBN | APBN | |
| Date of receipt of statement of grounds of appeal recordedAppealORIGINAL CODE: EPIDOSNNOA3EAPBR | APBR | |
| First examination report despatched17Q | 17Q | |
| First examination report despatched17Q | 17Q | |
| Designation fees paidAKX | AKX | |
| Request for examination filed17P | 17P | |
| Designated contracting statesAK | AK | |
| Request for extension of the european patentAX | AX | |
| Search report despatchedORIGINAL CODE: 0009013PUAL | PUAL | |
| Designated contracting statesAK | AK | |
| Request for extension of the european patentAL;LT;LV;MK;RO;SIAX | AX | |
| Public reference made under article 153(3) epc to a published international application that has entered the european phaseORIGINAL CODE: 0009012PUAI | PUAI |
Numbers
- Publication
- 0959501
- Publication, DOCDB
- 0959501
- Publication, EPODOC
- EP0959501
- Application
- 99303641
- Application, DOCDB
- 99303641
- Application, EPODOC
- EP19990303641
Titles3
- German
- System und Herstellungsverfahren von Semikundenschaltkreisen unter Verwendung eines Einfachnetzmusters und Verbindungsnetzmustern
- English
- System and method of manufacturing semicustom integrated circuits using reticle primitives and interconnect reticles
- French
- Système et procédé de fabrication de circuits intégrés de type pré-diffusé utilisant réticule primitif et réticules d'interconnexion
Classification
- CPC, 4
- G03F7/70466
- H10P76/00
- G03F7/70433
- G03F7/70741
- IPC, 4
- H01L21 027
- G03F1 08
- G03F7 20
- H01L27 10
Designated states2
- Contracting states, 1
- Sweden
- Extension states, 1
- Slovenia