Chip card

0001The invention relates to a chip card with a card carrier, On which a data processing circuit as well as a Connection module for the contactless transmission of data Between the data processing circuit and an external one Data processing station.

0002A smart card and an external chip card Data processing station form a data system which is linked to the Billing of cashless purchases, for the monitoring of Or simple administration of fees Access to a telephone network. To this end a User a chip card on which a data processing circuit Is provided, which consists of a microprocessor consists. For the transmission of data between the Data processing circuit and the external data processing station Is used in contactless transmission methods A data generated by the external data processing station Modulated by the chip card. In doing so, For example, provided in the connection module Chip card reel capacitively in a time-variable manner Or resistively loaded, so that their electromagnetic Change properties. This acts on a station coil In the external data processing station. From the Reaction can occur in the data processing circuit Stored data.

0003The smartcard is a plastic card , Which is designed to be large enough to allow it For example, in a wallet Can In the production of the smart card according to the invention, First an integrated circuit on a card carrier Made of plastic. Thereafter, along the External edges of the chip card a transmitting / receiving coil Which are connected to corresponding terminals of the Integrated circuit. Such Chip card is known, for example, from DE 44 10 732 A1. The chip card according to the invention is disadvantageous in that the Production is expensive and expensive. If a chip card Does not work properly, the faulty chip card Destroyed.

0004DE 44 37 721 A1 shows an electronic module for mounting in an electronic module The electronic module comprising a module mounted on a carrier of the module Which is connected in a conducting manner to a coil for the Non-contact data exchange.

0005It is an object of the invention, A module carrier for use in a chip card as well as a Always working properly Chip card and a method for producing the same To provide the chip card Reliably and with little effort.

0006This object is achieved by the subject matter of the independent Requirements solved. Advantageous embodiments are obtained From the subclaims.

0007According to the invention The data processing circuit and the connection module In the region of at least one module carrier, and The card carrier has an area for accommodating the Modul support or the support beam.

0008The invention is based on the basic idea that the disadvantages of the present invention are the following: In the case of the smart cards according to the invention, that Can only be checked if the chip card has been completed Integrated circuit correctly with the transmit / receive coil Together. According to the invention, Function of the chip card essential parts, ie a Functional unit separated from the card carrier on one Modular support and only during the final assembly of Card carriers and module carriers. Thereby It is possible to start the function module on its Function. If it is established that on this The data processing circuit is not correctly connected to the Connection module, then the Function module can be destroyed without a per se Usable cartridges would have to be destroyed. In addition, it is possible to manufacture the Function module to accelerate, since the little space Claiming the provision of smaller and Faster manufacturing devices.

0009According to the invention, the modul support is rigidly connected to the Chip card can be connected, wherein the card carrier is provided on the card carrier Area for accommodating the module carrier also as a recess Can be formed. With appropriate formation of Modular support and recess can be guaranteed Is already in place when the module carrier is inserted into the receptacle A form-locking connection is produced, which only remains fixed must become.

0010A particularly advantageous chip card according to the invention results When the connection module has at least one Transmitting / receiving coil which, with respect to the Main stretching direction of the module carrier also in two Different planes. Thereby In particular, that a region of the transmitting / receiving coil Is arranged on a surface of the module carrier, While another area in a layer inside the Modul support. This is especially true Can be achieved simply by means of a two-layer metallization In particular a sandwich-like construction of the module carrier in Question comes. In this case, the regions of the transmitting / receiving coil On a surface of the module carrier and in the Inside the modal support can be arranged parallel to the planes, wherein The individual areas are connected by contacts are. This can be done particularly easily by Through - connections in the area of ​​connections of the Respective transmit / receive coil regions. Preferably, the individual regions of the transmit / receive coil Connected in series, since then a transmitting / receiving coil Which results in a high efficiency External alternating field. This results in a Particularly high efficiency of the transmitting / receiving coil then, When the transmission device, often a part of the Data processing circuit, is designed such that the Areas of the transmitting / receiving coil in one Resonance phase layer. This can be done, for example By appropriately connecting capacitances and / or Inductances, this preferably being carried out in such a way that, That the resonance frequencies of the regions of the transmitting / receiving coil Respectively.

0011By way of derogation therefrom or in addition to the abovementioned The transmission device can also be operated in such a way In such a way that the regions of the transmitting / receiving coil Synchronized with one another. This can Advantageously in such a way that a reinforcement of the From the transmitting / receiving coil Respectively. This is important for active cards that have a Signal. By applying a phase cutting technique Can be a synchronizing of the flank position on the areas Of the transmitting / receiving coil, That an amplification of the signal transmitted by the transmitting / receiving coil Generated alternating field. For passive cards can A particularly high degree of coupling between the chip card And external data processing station.

0012A further improvement in the transmission quality of data Between the chip card and the external data processing station Is obtained if the modulator supports at least one element which is embodied as a Coil core for the transmitting / receiving coil Respectively. The module carrier can be made of plastic In the permeable material such as For example ferrite. If the permeable Material as a plurality of ferrite particles These for the purpose of mutual isolation in one Plastic compound, which is provided in the module carrier Is. The winding core thus produced serves to achieve a High field gain factor. By such a dielectric Can have relative magnetic permeabilities in the Order of magnitude of 5,000 and thus high flux densities will.

0013The invention also relates to a method for manufacturing A smart card comprising the steps of:<ul><li>Providing a card carrier with a receptacle for a Modular carriers,</li><li>Providing a modular support according to the invention with a data processing circuit And a connection module, </li><li>Inserting the module carrier into the receptacle, and</li><li>Connect the module carrier to the card carrier.</li></ul>

0014The method according to the invention allows a chip card Particularly simple and inexpensive.

0015The abovementioned manufacturing steps for producing a And / or a chip card according to the invention Modul support with two-layer transmit / receive coil Also for the production of chip cards And / or modul carriers with a single coil layer be applied. In addition, are also Procedural steps which allow the provision of individual or Combinations of features, in particular according to the Claims 1 to 13.

0016The invention is described with reference to an exemplary embodiment in FIG Drawing more closely.<dl tsize="7" compact="compact"><dt>FIG</dt><dd>Shows a modul carrier with one Data processing circuit and a transmitting / receiving coil In plan view,</dd><dt>FIG</dt><dd>Shows a card carrier in top view,</dd><dt>FIG</dt><dd>11 shows a chip card according to the invention with the Modular carrier from FIG. 1 and with the card carrier From FIG. 2 in plan view,</dd><dt>FIG</dt><dd>Shows the module carrier from FIG. 1 in the view From the front, and</dd><dt>FIG</dt><dd>Shows an endless belt for the production of the Modular carrier from FIG. 1 in plan view.</dd></dl>

0017FIG. 1 shows a modulator carrier 1 of the invention Chip card. The module carrier 1 comprises a plastic material Produced base plate 2 with a substantially rectangular shape Cross-section. The corners of the base plate 2 are here Rounded, as can be seen particularly clearly in FIG. On the upper side of the base plate 2 is metallization A transmitting / receiving coil 3 is provided, wherein The windings of the transmitting / receiving coil 3 extending out of a transmitting / receiving coil 3 In the middle of the base plate 2 Terminal 4 substantially helically around the first Terminal contact 4 to a second terminal contact 5.

0018As best seen in FIG. 4, on the first Terminal contact 1 by means of an insulating adhesive layer 6 Integrated circuit 7. The integrated Circuit 7 has a first connection line 8, which is connected to the First connection 4, and a second Connecting line 9, which is connected to the second connection contact 5 connected is. In the view shown in FIG Area between the integrated circuit 7 and the Second connection contact 5 from the module carrier 1 , So that the module carrier 1 can be moved in the Drawing.

0019As can also be seen well in FIG. 4, the module carrier is 1 In the region of the first connection contact 4 and in the region of the Second connection 5 with a covering layer 10 A thermally curable or UV curable mass.

0020FIG. 2 shows a card carrier 11 essentially Rectangular outer shape, which has a rectangular recess 12 For accommodating the module carrier 1 from FIG. Of the Card carrier 11 is made of a plastic plate, Which has substantially the same strength as that Base plate 2 of the module carrier 1. The recess 12 is here In such a way that the module carrier 1 is positively inserted into the Recess 12 can be used.

0021FIG. 3 shows a chip card 13 according to the invention which consists of the Modular carrier 1 according to FIGS. 1 and 4 and from the Card carrier 11 according to FIG. How to-in This view is particularly good, the module carrier 1 is so Is inserted into the recess 12 in such a way that a form-fitting, Compound. In this state, the module carrier is 1 With the card carrier 11 additionally by means of an adhesive bond connected.

0022Both the base plate 2 and the card carrier 11 are From a plastic such as glass fiber reinforced epoxy resin, PVC, PET, PC and / or ABS. The transmit / receive coil 3 is used in etching, wrapping, laying or Printing technique can be applied to the base plate 2.

0023As can be seen particularly well in FIG. 5, According to the invention, in an endless belt process , Wherein an endless belt 14 is made of a plastic material Is provided, which on each longitudinal side has a respective Transport hole 15. Due to the provision of the The endless belt 14 can be particularly adapted Can be obtained simply by the process described in the preparation of the invention Module carrier 1 used machines.

0024After completion of the endless belt 14 with thereon 1, these are individually tested and tested Subsequently by a punching process from the endless belt 14 Released. In a further embodiment, not shown here Process step will be based on their function Checked module carrier 1 into stand-by card carriers 11 And thereby the chip cards according to the invention completed.

0025The transmitter / receiver coil is provided with the modular carrier according to the invention 3 with a semiconductor chip 7 in a single chip Module 1, which is based on mass production Simple manner can be produced. Only in a final The modular bodies 1 according to the invention are used in The card carrier 11 is inserted. The semiconductor chip can be used 7 both by a conventional wire bonding technique as well With a flip-chip technique on the invention Modul support 2.