Electronic device

0001The present invention relates to an electrical device spaced with a housing and arranged therein from each other, electrical assemblies.

0002Until now, heat sinks are attached to the housing, for deriving the of the assemblies entw serve ickelten heat. Of the Heat conduction path from the individual component of an assembly on the module board to the housing is long, which resulted has that the dissipation of heat is insufficient. Further additional electromagnetic shielding means are provided, the electrical components of HF technology apart isolate. It is powered by convection internal circuit and external air circuit available. The heat from the The internal circuit is via a heat exchanger to the outside air leave.

0003The object of the present invention is that generic Device further in such a way that an improved Heat dissipation stating shortest possible Wärmeleitstrekken is realized.

0004This is inventively achieved by an electrical A device with a housing and arranged therein from each other, spaced electrical assemblies, each between two adjacent electrical modules, a cooling device is arranged, which is a part of the housing (Sandwitch construction).

0005This is any electrical assembly in a by adjacent cooling means in communication with the housing chamber formed thermally insulated and cooled. The adjacent cooling devices absorb the heat and run them via the housing. A shortest possible route from the Component of each module to the outside is ensured. Further, a hermetically sealed structure is stated as the Cooling devices are connected without a gap to a housing. Due to the arbitrary sequence of modules and Cooling equipment is a flexible structure allows.

0006In the electric device of the invention is therefore particularly advantageous that the cooling devices at the same time the RF shielding take over, and that just one external air circuit is available. In this context, it is further important that all cooling devices a good thermal Have contact.

0007It is preferred that the cooling means plate-shaped and each formed substantially parallel to the adjacent Modules are arranged. This is the heat loss extensively absorbed and dissipated. Further yield to manufacturing advantages due to the parallel arrangement.

0008The cooling devices are formed of a material that is suitable for the RF shield. Thus, the cooling devices act same form as an RF shield and facilities RF shield box for each module.

0009It is preferred that individual elements of an assembly with the adjacent cooling means by releasable heat-conducting elements are connected. Such heat-conducting elements, for example, be Wärmeleitmatten or Wärmeleitfedern. by virtue of the heat-conducting elements which the component with the cooling device connect, the thermal resistance of the component to cooler small and the component temperature also low.

0010It is also preferred that individual cooling devices to an outer surface formed with several recesses, which are separated by webs. The wells forming additional box, the HF technology isolate and an additional cooling effect due to the increased surface the cooler unfold. By forming a plurality of Depressions specific components of an assembly enclose, heat dissipation is increased.

0011There are preferred cooling means provided with a facing away from the components of a group outside a Assembly is clearly visible substantially in contact. These coolers cool the modules to directly its back.

0012It is further preferred that one behind the other alternately arranged Assemblies and cooling devices through one or mehere Screw (s) are connected. Thereby, the holder improved and an additional thermal equipment connection provided.

0013Finally, it is preferred that in the electrical device Cooling, RF shielding and hermetic package is realized in one.

0014Embodiments of the invention will become apparent from the following Description taken in conjunction with the drawings.<dl tsize="8"><dt>figure 1</dt><dd>shows a perspective view of an embodiment an electrical device according to the invention.</dd><dt>figure 2</dt><dd>shows a cross section through a further embodiment an electrical device according to the Invention.</dd></dl>

0015In Figure 1 are shown in perspective a front Cooling device 12, behind the one to be cooled module 4 is arranged. Background of the assembly 4 is another cooling device 6 is arranged, in turn, an assembly 10 follows. Finally, a cooling device 8 is arranged. The cooling device 8 is at its side facing the module 10 Front with four substantially square depressions 22 which for receiving prominent components serve the assembly 10th The wells 22 are separated by lands 20 from one another.

0016A similar structure was the cooling device 12, which in Figure 1 shown from their back side. is schematically a device 16 is shown, which during assembly of the apparatus engages in a depression of the cooler 12th to Reinforcing the heat dissipation is a heat-conducting element 18 in Form a Wärmeleitfeder provided which resiliently the component with the bottom of a recess of the cooling device 12 connects. Instead of Wärmeleitfedern is the use provided by Wärmeleitmatten.

0017In the cooling devices 12, 6 and 8, the assemblies 4, 10 are peripherally through holes formed to Passage of a screw 14 shown as an example or a corresponding bolt serve. Thereby, the holder improved and an additional thermally conductive contact is provided. There are also through holes for cables, connectors and the like are provided.

0018Cooling devices and assemblies are alternately arranged consecutively to each module individually in contact hermetically sealing off the housing and separated from to cool the other components. Further, the cooling means 8, 6, 12 made of a technical-HF shielding material formed so that each assembly relative to the other modules also RF shielded is. The plate-shaped cooling devices 6, 8, 12 are connected without a gap with the housing 2 or forming the outer wall.

0019In Figure 2 is a cross-section through a further embodiment a device according to the invention is shown. The 2 summarizes the housing one behind the other alternately arranged Cooling devices and assemblies a. located on modules Prominent elements 16 into the gap between device and cooling device, here for example, 26, protrude.

0020Heat-conducting elements 18 connecting the device 16 to the cooling device 26. In the assembled state is a rear the cooling device 26 arranged assembly 24 in an all over Contact therewith. Thereby, the heat dissipation performance increased.

0021As seen in Figure 2, forms the cooling device 28 at the same time an outer wall of the housing 2. The recesses 22 are formed so that respective prominent components the adjacent module 30 are covered and enclosed. The heat dissipation is characterized by additional heat-conducting and improved between device and cooling device.