EP0903378A1

Dielectric gel for protection of electronic modules

Abstract

Polyorganosiloxane gels prepared using compositions curable by a platinum group metal catalyzed hydrosilation reaction are characterized by the presence of a non-reactive silicone fluid. The gel may contain additional components and may also be formulated into a multi-part system.

EP0903378A1, drawing sheet 1
Sheet 1 of 7

Term

Term ended

Projected expiry passed 16 September 2018, 8 years ago.

  1. Priority
  2. Filed
  3. Published
  4. Projected expiry
  5. Today

9 claims: 6 independent, 3 dependent

  1. 1
    A curable organosiloxane composition comprising:A. a first polyorganosiloxane having terminal siloxane units of the formula R 1 R 2 2 SiO 1/2 and non-terminal organosiloxane units of the formula R 2 2 SiO where R 1 represents an alkenyl radical or a hydrogen atom and each R 2 is independently and individually selected from R 1 or unsubstituted and substituted monovalent hydrocarbon radicals free of ethylenic unsaturation;B. a polyorganosiloxane crosslinking agent containing an average of at least two silicon-bonded hydrogen atoms or alkenyl radicals per molecule, where the remaining silicon-bonded organic groups are monovalent hydrocarbon radicals selected from the same group as R 2 , with the proviso that when the R 1 groups of polyorganosiloxane A are alkenyl radicals, the crosslinking agent has at least two silicon-bonded hydrogen atoms and when the R 1 groups of polyorganosiloxane A are silicon-bonded hydrogen atoms, the crosslinking agent has at least two alkenyl radicals;C. an amount of a hydrosilation catalyst sufficient to promote curing of said composition;and D. a non-reactive silicone fluid which is at least 25% by weight of said composition.
  2. 2
    A multi-part composition comprising:A. a first polyorganosiloxane having terminal siloxane units of the formula R 1 R 2 2 SiO 1/2 and non-terminal organosiloxane units of the formula R 2 2 SiO, where R 1 represents an alkenyl radical or a hydrogen atom and each R 2 is independently and individually selected from R 1 or unsubstituted and substituted monovalent hydrocarbon radicals free of ethylenic unsaturation;B. a polyorganosiloxane crosslinking agent containing an average of at least two silicon-bonded hydrogen atoms or alkenyl radicals per molecule, where the remaining silicon-bonded organic groups are monovalent hydrocarbon radicals selected from the same group as R 2 , with the proviso that when the R 1 groups of polyorganosiloxane A are alkenyl radicals, the crosslinking agent has at least two silicon-bonded hydrogen atoms and when the R 1 groups of polyorganosiloxane A are silicon-bonded hydrogen atoms, the crosslinking agent has at least two alkenyl radicals;C. an amount of a hydrosilation catalyst sufficient to promote curing of said composition;and D. a non-reactive silicone fluid which comprises at least 25% by weight of the composition;with the proviso that when the crosslinking agent contains silicon-bonded hydrogen atoms, the crosslinking agent and hydrosilation catalyst are in separate parts and when the polysilioxane A contains silicon-bonded hydrogen atoms, polysiloxane A and the hydrosilation catalyst are in separate parts.
  3. 4
    A composition according to claims 1 or 2, wherein polyorganosiloxane A is a vinyl-terminated polydimethylsiloxane having a viscosity of 0.45 Pa·s, crosslinking agent B is a methyl-endblocked siloxane polymer having a degree of polymerization of eleven and six silicon-bonded hydrogen units, hydrosilation catalyst C is a platinum catalyst and non-reactive silicone fluid D is a methyl endblocked polydimethylsiloxane having a viscosity of from 0.00065 to 50 Pa·s.
  4. 5
    A composition according to any of the preceding claims 1 - 4 wherein the viscosity of polyorganosiloxane A is between 0.05 and 50 Pa·s.
  5. 8
    An organosiloxane gel obtainable by curing the composition of any of claims 1 - 7.
  6. 9
    Use of the composition of any of claims 1 - 7 as a pottant or encapsulant on a printed circuit board or an electronic component.