Device for electrically and mecanically connnecting two printed circuit boards situated at a distance from each other and apparatus comprising two printed circuit boards situated at a distance from each other connected with such a device

The invention relates to an apparatus for electrically and mechanically Connecting two spaced apart arranged printed circuit boards, especially a hybrid module with a base support board, the apparatus connecting elements each having a solder pin having, and arranged another means having two spaced Printed circuit boards connected by a such a device are.

From the prior art it is known to connect two printed circuit boards to use connection combs. Here, the connection combs composed of a number of individual contact elements that clamp-like engage around the side edges of a first circuit board and continue with their solder pins with a second circuit board, for example by wave soldering are electrically and mechanically connected. A disadvantage here is, that the connecting electric combs at a high number of required Compounds (eg, greater than 40), the minimum size of the module plate pretending that all connections can be accommodated.

The object of the invention is therefore to provide a device for connecting two circuit boards, and a device with such a device specify that takes up less space and so the PCB size does not depend on the required number of connections.

This object is achieved by a device, the connecting elements with a solder pin and a Lötzunge, wherein between the Lötzunge and the solder pin an elastic region is present and the held connecting elements of a common insulating body will.

It is advantageous that simultaneously with other Lötzungen can be fixed surface mount devices and so on an additional soldering process as otherwise in connection combs is required, can be omitted. Further, by Use of the insulating body, the mechanical stability of the compound increased, and the assemblability is further simplified, since the compound of the two circuit boards only a single component is required yet.

Advantageous embodiments of the inventions are in sub-claims and the following description refer to. Characterized in that the Lötzungen such laterally protrude away from the insulating body that they in supervision are available on the insulating body, the solder joints of Lötzungen can be on the board optically controlled so that a waived expensive electrical check of the individual compounds can be.

Due to the design of the insulating body as a frame is a achieved design that can accommodate a large number of fasteners offers, while also achieving mechanical stability, in particular if the frame has approximately the dimensions of the printed circuit board , on which the Lötzungen of the connecting elements are attached. The frame may be a rectangular, square or even a have oval, round or polygonal shape.

In an arrangement of Lötzungen such that it on with a regulatory show the frame in the interior of the frame, it is advantageous that the framework of the forceps of automated assembly system can be taken without running the risk of bending of the connecting elements consists.

An arrangement of Lötzungen such that it frames in view of the are arranged outside of the frame, has the advantage that the Place on the first circuit board can be used optimally and thus even better unbundling of the circuit on the first circuit board is possible.

By the use of positioning aids for the assembly of the device on the first and / or second printed circuit board is a simple assembly reached and an automatic assemblability further improved.

If the positioning is designed as a twist, is turned upside down Mounting excluded.

By using a locking nose is a simple permanent mounting the connecting elements into a prefabricated insulating, having the receiving pockets for the detents possible. It is also possible the connecting elements to be surrounded by the Insulator and then bringing to the final shape, for example by injection molding. This procedure is expensive but overall.

Due to the configuration of the elastic region in such a way that between the Lötzungen and the intermediate area, a narrow area available is connected to the intermediate portion an angle of preferably 90 ° including, this is realized in Readily way. Since the areas have different widths, the narrow region may at a load perpendicular to the solder surfaces well give the Lötzungen, like this as a result of bending due to the different Thermal expansion of connected device through the PCB caused.

Due to the configuration of the narrow area of ​​the connecting element with two opposing bends, each an obtuse angle include an easily manufacturable and durable elasticity also implemented parallel to the soldering surface of Lötzunge.

By insertion of a through opening in the Lötzungen is achieved, that when placing the Lötzungen on the solder paste printed pads, the solder paste not to the side, but in the through opening is pressed and so a good electrical and Mechanical connection is guaranteed without the risk of that excess solder short circuits with adjacent solder joints leads.

Due to the configuration of the connecting element as a tin-plated copper sheet metal stamping is a cost-effective production and assembly in the Insulating possible.

With the device according to the invention it is possible, means specify with two mutually spaced-apart circuit boards, wherein the device having a first circuit board by surface mounting is electrically and mechanically connected and in which the device electrically connected to a second circuit board by through-hole mounting and is mechanically connected.

The invention will be of particularly preferred embodiments explained in more detail with reference to FIGS:

Show it:<dl tsize="9"><dt>Figure 1:</dt><dd>The views of a particularly preferred fastener.</dd><dt>Figure 2:</dt><dd>The partial section through a particularly preferred insulator with an inserted connecting member of FIG 1.</dd><dt>Figure 3:</dt><dd>The partial section of a particularly preferred apparatus between two conductors to be connected plates.</dd><dt>Figure 4:</dt><dd>The view of a preferred device in frame shape.</dd><dt>Figure 5:</dt><dd>The top view of another preferred device in frame shape, which is mounted on a first circuit board.</dd></dl>

In figure 1 is the front view of a particularly preferred according to the invention The connecting element 1 with a), the corresponding side view designated b) and the corresponding bottom view of c). The connecting element 1 is advantageously tinned as a stamped bent part of run copper sheet and has a solder pin 11, a narrow range 13 and a Lötzunge 14. Advantageously, between the narrow region 13 and the solder pin 11, an intermediate region 12 with Locking lug 121 belongs. The narrow region 13 includes the intermediate region 12 an angle α of about 90 °. The required to Curve 130 advantageously has been the width of the narrow region 13. The narrow region 13 further includes two bends 131, 132, the β the obtuse angle γ include. If the angle α between the intermediate region 12 and the narrow region 13 90 ° is, the angles β, γ same as the intermediate region 12 and the Solder pin 11 advantageously perpendicular to the conductors to be connected plates to stand.

2 shows a connecting element 1 is in Figure 1 in a partial section a particularly preferred insulator 2 shown. The insulating body 2 has a guide groove 21 and a receiving pocket 22nd The guide groove 22 guides the connecting element 1 in the area of ​​the intermediate region 12. It is the detent 121 in the receiving pocket 22 engaged and prevents the connecting member from one of the can remove guide 21st The space 25 of the insulating body 2 is not required for the function of the device according to the invention, but simplifies the production of the insulating body 2 and saves further Material a.

Figure 3 shows a partial section of a device between two conductors to be connected plates 3, 4. The frame 20 has additionally Positioning aids 23, 24 which engage in corresponding recesses engaged 32, 42 of the circuit boards 3, 4 and so the exact position of the frame 20 determined on the circuit boards 3 4. Advantageously, the Compounds prepared so that first the top 33 of the printed circuit board 3 is printed with Reflowlötpaste, then the not shown placed on the top surface 33 components to be mounted and Finally, the frame 20 with the connecting elements previously used 1 is placed and then in a single operation, the components and Lötzungen 14 of the connecting elements 1 through reflow electrically and mechanically to the electrical leads, not shown, the circuit board 3 are connected. In the continuous Opening 141 may accumulate excess solder of the solder joint 31, so that the solder is not short-circuited with the adjacent solder joints becomes. After a visual inspection of the solder joints 31 can without special Effort be carried out.

Then the frame with the positioning aids 24 can on top the circuit board 4 are placed and the soldering pins 11 preferably electrically in a wave soldering to the circuit board 4 and mechanically are joined by the solder 41st It can simultaneously the other by the assembly on the top 43 of the circuit board 4 soldered components to be mounted. Here too is a visual inspection of the solder joints 41 after soldering possible.

is represented by the above-described bends 130, 131, 132, such a achieved elasticity that tearing the Lötzungen 14 of the soldering points 31 even when a bending of the printed circuit board 3 due to the different is thermal expansion of the printed circuit boards 3, 4 is prevented.

In view of the present invention particularly preferred device recognizes in Figure 4 is designed as the frame 20 Insulator 2, under which the Lötzungen 14 project into the interior of the frame 20th Thus, the solder joints of the supernatant Lötzungen 14 are easily visually check. The frame has on its upper side three locators 24 and on its underside two locators 23. The illustrated Arrangement of the positioning is accidental twisting the PCBs 3,4 to today excluded. The frame 20 advantageously has about the same outer dimensions as the first PCB 3, connected to the he by surface mount (reflow soldering) becomes. This is a particularly stable and easy to assemble Compound of the printed circuit boards 3, 4 realized. In the selection of a suitable Material for the insulating body 2, in particular a plastic, is to take particular care that the insulating the required reflow soldering withstands without deformation.

recognizes when plan view of another preferred device in Figure 5 is believed that the Lötzungen 14 all to the outside of the frame 20 show and the solder joints 31 on the first circuit board 3 is also of can be optically up checks. is This configuration a placement of multiple circuit boards 3 in benefits with frame 20 and electronic components 5 and subsequent reflow the solder joints 34, 31 all to be mounted on the circuit board 3 components 5, 20 possible and optimal utilization of the space on the first circuit board 3 possible. Naturally, it is also possible for the Lötzungen 14 to arrange both inside and outside of a single frame 20th