EP0822584A3

Method of surface treatment of semiconductor substrates

Abstract

A method of depositing a side wall passivation layer on an etched feature in a semiconductor substrate, comprising placing the substrate in a vacuum chamber, striking a plasma, and introducing a hydrocarbon deposition gas to deposit a carbon or hydrocarbon layer.

EP0822584A3, drawing sheet 1
Sheet 1 of 1

Term

Term ended

Projected expiry passed 28 July 2017, 9.2 years ago.

  1. Priority
  2. Filed
  3. Published
  4. Projected expiry
  5. Today

1 sheet

  1. Sheet 1