EP0809729A1

Method of applying a photosensitive resin to a substrate for use in papermaking

Abstract

The invention comprises a method for applying a curable resin, such as a photosensitive resin, to a substrate such as a papermaker's dewatering felt. The method comprises the steps of providing a substrate; providing a curable liquid resin; providing a second material different from the curable liquid resin; applying the second material to the substrate to occupy at least some of the voids in the substrate intermediate the first and second surfaces of the substrate; applying the curable resin to the substrate; curing at least some of the resin to provide a resin layer on the substrate; and removing at least some of the second material from the substrate, wherein at least some of the second material is removed from the substrate after applying the curable resin to the substrate.

Term

Term ended

Projected expiry passed 24 January 2016, 10.7 years ago.

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10 claims: 8 independent, 2 dependent

  1. 1
    Claims of equivalent WO 9625547 A1 WHAT IS CLAIMED IS:1. A method of applying a photosensitive resin to a substrate, the method comprising the steps of: providing a substrate having a first surface, a second surface, and a thickness, the substrate having voids intermediate the first and second surfaces;providing a liquid photosensitive resin;providing a second material different from the liquid photosensitive resin;providing a source of actinic radiation;applying the second material to the substrate to occupy at least some of the voids in the substrate intermediate the first and second surfaces of the substrate;applying the liquid photosensitive resin to the substrate;exposing at least some of the liquid photosensitive resin to the actinic radiation;and curing at least some of the photosensitive resin to provide a resin layer on the substrate.
  2. 4
    The method of Claims 1, 2, or 3 further comprising the step of removing some, but not all, of the second material from the substrate before applying the resin to the substrate.
  3. 5
    The method of Claims 1, 3, or 4 further comprising the step of changing the phase of at least some of the second material applied to the substrate before the step of curing the resin.
  4. 6
    The method of Claims 1, 3, 4, or 5 further comprising the step of solidifying at least some of the second material applied to the substrate at a temperature between about 50 degrees Fahrenheit and about 150 degrees Fahrenheit prior to applying the resin to the substrate.
  5. 7
    The method of Claims 1, 2, 3, 4, 5, or 6 further comprising the step of cooling at least some of the second material applied to the substrate before the step of curing the resin, and the step of heating at least some of the second material applied to the substrate before the step of removing second material from the substrate.
  6. 8
    The method of Claims 1, 2, 3, 4, 5, 6, or 7 characterized in that the second material comprises water.
  7. 9
    The method of Claims 1, 2, 3, 4, 5, 6, 7, or 8 characterized in that the second material comprises a component selected from the group consisting of glycerol, polyoxyethylene glycol, polyoxypropylene glycol, and combinations thereof.
  8. 10
    The method of Claims 1, 2, 3, 4, 5, 6, 7, 8, or 9 characterized in that the second material comprises a gel forming agent selected from the group consisting of sodium laurate, sodium myristate, sodium palmitate, sodium stearate, potassium laurate, potassium myristate, potassium palmitate, potassium stearate, and mixtures thereof.