EP0807369A4
Stackable modules and multimodular assemblies
11 sheets
Sheet 1 Sheet 2 Sheet 3 Sheet 4 Sheet 5 Sheet 6 Sheet 7 Sheet 8 Sheet 9 Sheet 10 Sheet 11
Every citation, both ways
| Document | Relation | Office | Category | Cited during | Relevant claims |
|---|---|---|---|---|---|
| EP0708484A1 | Cites | European Patent Office (EPO) | E | Search report | 1-10 |
| EP0729183A2 | Cites | European Patent Office (EPO) | E | Search report | 1-10 |
| US4574331A | Cites | United States of America | – | Search report | – |
| US5043794A | Cites | United States of America | – | Search report | – |
| US5128831A | Cites | United States of America | – | Search report | – |
| US5182632A | Cites | United States of America | – | Search report | – |
| US5241456A | Cites | United States of America | – | Search report | – |
| US5376825A | Cites | United States of America | – | Search report | – |
| US5432681A | Cites | United States of America | – | Search report | – |
| EP0708484A | Cites | European Patent Office (EPO) | – | – | – |
| EP0729183A | Cites | European Patent Office (EPO) | – | – | – |
| DECARO R E ET AL: "A low cost, compact "user" reconfigurable three-dimensional DSP MCM", PROCEEDINGS OF THE 5TH INTERNATIONAL CONFERENCE ON SIGNAL PROCESSING APPLICATIONS AND TECHNOLOGY, PROCEEDINGS OF 5TH INTERNATIONAL CONFERENCE ON SIGNAL PROCESSING APPLICATIONS AND TECHNOLOGY, DALLAS, TX, USA, 18-21 OCT. 1994, 1994, Waltham, MA, USA, DSP Associates, USA, pages 848 - 853 vol.1, XP002115408 | Non-patent | – | – | Search report | – |
| See also references of WO 9623396A1 | Non-patent | – | – | Search report | – |
4 members in 3 offices
Priority claims3
| Document | Office | Kind | Date |
|---|---|---|---|
| 19950376799 | United States of America | – | |
| 37679995 | United States of America | A | |
| 9600746 | United States of America | W |
Members4
| Document | Office | Kind | |
|---|---|---|---|
| WO9623396A1 | World Intellectual Property Organization (WIPO) | A1 | |
| EP0807369A1 | European Patent Office (EPO) | A1 | |
| US5701233A | United States of America | A | |
| EP0807369A4This record | European Patent Office (EPO) | A4 |
9 legal events, as the office reported them to INPADOC
Over the term
Point at a mark for the eventEvents
| Event | Code | |
|---|---|---|
| Application deemed to be withdrawnWithdrawn18D | 18D | |
| Information on the status of an ep patent application or granted ep patentGrantedSTATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWNSTAA | STAA | |
| First examination report despatched17Q | 17Q | |
| Supplementary search report drawn up and despatchedA4 | A4 | |
| Designated contracting statesAK | AK | |
| Information provided on ipc code assigned before grant6H 05K 7/00 A, 6H 05K 7/10 B, 6H 05K 7/12 B, 6H 01R 9/09 B, 6H 01R 23/70 B, 6H 01R 23/72 B, 6H 01L 23/02 B, 6H 01L 23/053 B, 6H 01L 23/10 B, 6H 01L 25/065 BRIC1 | RIC1 | |
| Request for examination filed17P | 17P | |
| Designated contracting statesAK | AK | |
| Public reference made under article 153(3) epc to a published international application that has entered the european phaseORIGINAL CODE: 0009012PUAI | PUAI |
Numbers
- Publication
- 0807369
- Application
- 969027330
Titles3
- English
- STACKABLE MODULES AND MULTIMODULAR ASSEMBLIES
- French
- MODULES EMPILABLES ET ENSEMBLES MULTIMODULAIRES
- German
- STAPELMODULE UND MEHRFACHMODUL-ZUSAMMENBAU
Classification
- CPC, 15
- H05K7/023
- H01R12/523
- H10W90/734
- H10W90/00
- H10W72/5473
- H10W72/07554
- H10W72/547
- H10W90/754
- H10W72/5449
- H10W72/884
- H10W70/685
- H10W70/682
- H10W72/5522
- H10W72/5524
- H10W72/552
- IPC, 6
- H01L23 04
- H01L23 055
- H01L25 065
- H05K7 02
- H10W76 12
- H10W76 153
Designated states1
- Contracting states, 1
- Italy
