EP0803907A3
Ribbon, bonding wire and microwave circuit package
Abstract
A ribbon (11e, 12e) and a bonding wire (40, 42) are connected respectively to a high-frequency input and output of a microwave circuit, the width of the ribbon and/or the thickness of the bonding wire being varied continuously or discontinuously at a portion other than a portion used for bonding. By applying the ribbon and bonding wire to a microwave circuit package (10) including a metallic substrate (3) and sealing therein an MMIC (11, 12) mounted to the metallic substrate, desired high-frequency characteristics of the MMIC can be obtained.
Term
Term ended
Projected expiry passed 8 April 2017, 9.5 years ago.
- Priority
- Filed
- Published
- Projected expiry
- Today
1 sheet
Sheet 1
Every citation, both ways
| Document | Relation | Office | Category | Cited during | Relevant claims |
|---|---|---|---|---|---|
| US5113161A | Cites | United States of America | Y | Search report | 4-18 |
| US5294751A | Cites | United States of America | A | Search report | 7-18 |
| PATENT ABSTRACTS OF JAPAN vol. 014, no. 457 (E - 0986) 2 October 1990 (1990-10-02) | Non-patent | – | – | Search report | – |
| PATENT ABSTRACTS OF JAPAN vol. 015, no. 343 (E - 1106) 30 August 1991 (1991-08-30) | Non-patent | – | – | Search report | – |
| PATENT ABSTRACTS OF JAPAN vol. 008, no. 127 (E - 250) 14 June 1984 (1984-06-14) | Non-patent | – | – | Search report | – |
| PATENT ABSTRACTS OF JAPAN vol. 004, no. 121 (E - 023) 27 August 1980 (1980-08-27) | Non-patent | – | – | Search report | – |
| PATENT ABSTRACTS OF JAPAN vol. 014, no. 553 (E - 1010) 7 December 1990 (1990-12-07) | Non-patent | – | – | Search report | – |
8 members in 4 offices; this record represents the family
Priority claims2
| Document | Office | Kind | Date |
|---|---|---|---|
| 10281496 | Japan | – | |
| 10281496 | Japan | A |
Members8
| Document | Office | Kind | |
|---|---|---|---|
| EP0803907A2 | European Patent Office (EPO) | A2 | |
| JPH09289404A | Japan | A | |
| EP0803907A3This record | European Patent Office (EPO) | A3 | |
| US5936492A | United States of America | A | |
| US6331806B1 | United States of America | B1 | |
| EP0803907B1 | European Patent Office (EPO) | B1 | |
| DE69738340D1 | Germany | D1 | |
| DE69738340T2 | Germany | T2 |
25 legal events, as 3 offices reported them to INPADOC
Over the term
Point at a mark for the eventEvents
| Event | Code | Office | |
|---|---|---|---|
| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
| Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal feeWithdrawnR119 | R119 | DE | |
| Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal feeWithdrawnR119 | R119 | DE | |
| Annual fee paid to national office [announced via postgrant information from national office to epo]GrantedPGFP | PGFP | EP | |
| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
| Gb: european patent ceased through non-payment of renewal feeCeasedGBPC | GBPC | EP | |
| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
| Annual fee paid to national office [announced via postgrant information from national office to epo]GrantedPGFP | PGFP | EP | |
| No opposition filedOpposition26N | 26N | EP | |
| No opposition filed within time limitOppositionORIGINAL CODE: 0009261PLBE | PLBE | EP | |
| Information on the status of an ep patent application or granted ep patentGrantedSTATUS: NO OPPOSITION FILED WITHIN TIME LIMITSTAA | STAA | EP | |
| Fr: translation not filedEN | EN | EP | |
| Corresponds to:REF | REF | EP | |
| Designated contracting statesAK | AK | EP | |
| European patent grantedGrantedFG4D | FG4D | GB | |
| (expected) grantORIGINAL CODE: 0009210GRAA | GRAA | EP | |
| Grant fee paidORIGINAL CODE: EPIDOSNIGR3GRAS | GRAS | EP | |
| Despatch of communication of intention to grant a patentORIGINAL CODE: EPIDOSNIGR1GRAP | GRAP | EP | |
| Title (correction)METHOD OF REGULATING THE IMPEDANCE OF A MICROWAVE CIRCUIT PACKAGERTI1 | RTI1 | EP | |
| First examination report despatched17Q | 17Q | EP | |
| Request for examination filed17P | 17P | EP | |
| Designated contracting statesAK | AK | EP | |
| Search report despatchedORIGINAL CODE: 0009013PUAL | PUAL | EP | |
| Designated contracting statesAK | AK | EP | |
| Public reference made under article 153(3) epc to a published international application that has entered the european phaseORIGINAL CODE: 0009012PUAI | PUAI | EP |
Numbers
- Publication
- 0803907
- Application
- 971057971
Titles3
- German
- Band, Bonddraht und Packung für Mikrowellenschaltung
- English
- Ribbon, bonding wire and microwave circuit package
- French
- Ruban, fil de connexion et empaquetage pour circuit à micro-onde
Classification
- CPC, 11
- H10W72/851
- H10W44/20
- H10W72/07532
- H10W72/07533
- H10W99/00
- H10W44/206
- H10W90/754
- H10W72/536
- H10W72/5445
- H10W72/534
- H10W72/533
- IPC, 5
- H01P1 04
- H01L21 60
- H01P3 08
- H01P5 02
- H10W44 20
Designated states1
- Contracting states, 1
- United Kingdom