Nova Patents
EP0802637A1

Communication device

Abstract

The influence of high-frequency noise produced from the active surfaces of ICs is suppressed and the sensitivity of a communication device is improved by appropriately arranging the ICs which are noise sources. A high-frequency analog IC (91A) and a digital IC (92A) for processing signals, both of which generate high-frequency noise, are mounted on the back (712) of a circuit board (71) with the faces of the ICs down. Namely, the active surfaces (910A and 920A) of the ICs (91A and 92A) do not face to a loop antenna (4) provided integrally with an arm band on the back side of the circuit board (71), but to a liquid crystal panel provided on the front side of the main body of the communication device. Therefore, even when high-frequency noise is produced from the active surfaces of the ICs (91A and 92A), the actitivity of the communication device is high because noise hardly reaches the loop antenna (4).

EP0802637A1, drawing sheet 1
Sheet 1 of 16

Term

Term ended

Projected expiry passed 5 November 2016, 9.9 years ago.

  1. Priority
  2. Filed
  3. Published
  4. Projected expiry
  5. Today

5 claims: 1 independent, 4 dependent

  1. 1
    A communication apparatus comprising:a board on which an integrated circuit generating high-frequency noise is mounted;and an antenna body the entire or most of which is disposed on one board-surface side of said board, wherein said integrated circuit is mounted on said board such that the active surface thereof directs at the direction opposite the direction where the entire or most of said antenna body is disposed against said board.
  2. 2
    A communication apparatus according to Claim 1, comprising:an apparatus body in which a side on which a display screen is formed is set to a front surface side;and a watchband extending from said apparatus body toward the rear surface side for mounting said apparatus body to the wrist, wherein said antenna body is formed in said watchband, and said board is disposed at the rear surface side of said display screen in said apparatus body.
  3. 3
    A communication apparatus according to one of Claims 1 and 2, wherein said integrated circuit includes at least one of integrated circuits between a high-frequency analog integrated circuit having at least one of functions between a transmission function and a receiving function, and a signal-processing digital integrated circuit driven by a high-frequency driving signal.
  4. 4
    A communication apparatus according to one of Claims 1 to 3, wherein said integrated circuit is face-down-bonded to a board surface where the entire or most of said antenna body is disposed in said board so that said active surface directs at the direction opposite the direction where the entire or most of said antenna body is disposed against said board.
  5. 5
    A communication apparatus according to one of Claims 1 to 3, wherein said integrated circuit is wire-bonded to the board surface opposite the surface where the entire or most of said antenna body is disposed in said board so that said active surface directs at the direction opposite the direction where the entire or most of said antenna body is disposed against said board.