EP0773584A3

Device having resin package and method of producing the same

Abstract

A device includes a chip (111), and a resin package (112, 151, 314) sealing the chip, the resin package having resin projections (117, 154, 318) located on a mount-side surface of the resin package. Metallic films (113, 155, 315) are respectively provided to the resin projections. Connecting parts (118, 101, 163, 245, 313, 341, 342) electrically connect electrode pads of the chip and the metallic films.

EP0773584A3, drawing sheet 1
Sheet 1 of 1

Term

Term ended

Projected expiry passed 7 November 2016, 9.9 years ago.

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1 sheet

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