EP0773584A3
Device having resin package and method of producing the same
Abstract
A device includes a chip (111), and a resin package (112, 151, 314) sealing the chip, the resin package having resin projections (117, 154, 318) located on a mount-side surface of the resin package. Metallic films (113, 155, 315) are respectively provided to the resin projections. Connecting parts (118, 101, 163, 245, 313, 341, 342) electrically connect electrode pads of the chip and the metallic films.

Term
Term ended
Projected expiry passed 7 November 2016, 9.9 years ago.
- Priority
- Filed
- Published
- Projected expiry
- Today
1 sheet
Sheet 1
Every citation, both ways
| Document | Relation | Office | Category | Cited during | Relevant claims |
|---|---|---|---|---|---|
| EP0638933A1 | Cites | European Patent Office (EPO) | A | Search report | 27 |
| FR2691836A1 | Cites | France | XA | Search report | 1,2,4,6,14,15,17,19-21,23 |
| WO9526047A1 | Cites | World Intellectual Property Organization (WIPO) | X | Search report | 34-36,39,54 |
| WO9609646A1 | Cites | World Intellectual Property Organization (WIPO) | PX | Search report | 1,2,4,7,10 |
| PATENT ABSTRACTS OF JAPAN vol. 095, no. 002 31 March 1995 (1995-03-31) | Non-patent | – | – | Search report | – |
| PATENT ABSTRACTS OF JAPAN vol. 095, no. 009 31 October 1995 (1995-10-31) | Non-patent | – | – | Search report | – |
| PATENT ABSTRACTS OF JAPAN vol. 018, no. 008 (E - 1486) 7 January 1994 (1994-01-07) | Non-patent | – | – | Search report | – |
| PATENT ABSTRACTS OF JAPAN vol. 096, no. 003 29 March 1996 (1996-03-29) | Non-patent | – | – | Search report | – |
| PATENT ABSTRACTS OF JAPAN vol. 1996, no. 01 31 January 1996 (1996-01-31) | Non-patent | – | – | Search report | – |
| PATENT ABSTRACTS OF JAPAN vol. 010, no. 329 (E - 452) 8 November 1986 (1986-11-08) | Non-patent | – | – | Search report | – |
| PATENT ABSTRACTS OF JAPAN vol. 014, no. 336 (E - 0953) 19 July 1990 (1990-07-19) | Non-patent | – | – | Search report | – |
| PATENT ABSTRACTS OF JAPAN vol. 009, no. 069 (E - 305) 29 March 1985 (1985-03-29) | Non-patent | – | – | Search report | – |
| PATENT ABSTRACTS OF JAPAN vol. 013, no. 459 (E - 832) 17 October 1989 (1989-10-17) | Non-patent | – | – | Search report | – |
| PATENT ABSTRACTS OF JAPAN vol. 013, no. 433 (E - 824) 27 September 1989 (1989-09-27) | Non-patent | – | – | Search report | – |
| PATENT ABSTRACTS OF JAPAN vol. 015, no. 277 (E - 1089) 15 July 1991 (1991-07-15) | Non-patent | – | – | Search report | – |
| PATENT ABSTRACTS OF JAPAN vol. 017, no. 504 (E - 1430) 10 September 1993 (1993-09-10) | Non-patent | – | – | Search report | – |
| PATENT ABSTRACTS OF JAPAN vol. 018, no. 461 (E - 1597) 26 August 1994 (1994-08-26) | Non-patent | – | – | Search report | – |
| PATENT ABSTRACTS OF JAPAN vol. 015, no. 277 (E - 1089) 15 July 1991 (1991-07-15) | Non-patent | – | – | Search report | – |
42 members in 6 offices; this record represents the family
Priority claims10
| Document | Office | Kind | Date |
|---|---|---|---|
| 29013595 | Japan | – | |
| 29013595 | Japan | A | |
| 32280395 | Japan | – | |
| 32280395 | Japan | A | |
| 18383896 | Japan | – | |
| 18383896 | Japan | A | |
| 25070796 | Japan | – | |
| 25070796 | Japan | A | |
| 26760796 | Japan | – | |
| 26760796 | Japan | A |
Members42
| Document | Office | Kind | |
|---|---|---|---|
| TW302529B | Taiwan Province of China | B | |
| EP0773584A2 | European Patent Office (EPO) | A2 | |
| JPH09134982A | Japan | A | |
| JPH09162348A | Japan | A | |
| CN1152797A | China | A | |
| KR970030728A | Republic of Korea | A | |
| JPH1079448A | Japan | A | |
| JPH10116935A | Japan | A | |
| TW348306B | Taiwan Province of China | B | |
| JPH11150139A | Japan | A | |
| JPH11150143A | Japan | A | |
| JPH11163204A | Japan | A | |
| JPH11173834A | Japan | A | |
| JPH11186307A | Japan | A | |
| KR100212403B1 | Republic of Korea | B1 | |
| EP0773584A3This record | European Patent Office (EPO) | A3 | |
| JP3007833B2 | Japan | B2 | |
| US6072239A | United States of America | A | |
| JP3074264B2 | Japan | B2 | |
| US6159770A | United States of America | A | |
| JP3129169B2 | Japan | B2 | |
| JP3154684B2 | Japan | B2 | |
| JP3154686B2 | Japan | B2 | |
| JP3181229B2 | Japan | B2 | |
| JP3189703B2 | Japan | B2 | |
| JP3194518B2 | Japan | B2 | |
| US6329711B1 | United States of America | B1 | |
| US2002027265A1 | United States of America | A1 | |
| US6376921B1 | United States of America | B1 | |
| EP1261026A1 | European Patent Office (EPO) | A1 | |
| US2003006503A1 | United States of America | A1 | |
| EP1284501A1 | European Patent Office (EPO) | A1 | |
| EP1284502A1 | European Patent Office (EPO) | A1 | |
| EP1291911A1 | European Patent Office (EPO) | A1 | |
| US6573121B2 | United States of America | B2 | |
| US2004219719A1 | United States of America | A1 | |
| CN1549317A | China | A | |
| US6856017B2 | United States of America | B2 | |
| CN1215537C | China | C | |
| US7144754B2 | United States of America | B2 | |
| CN1307698C | China | C | |
| EP0773584B1 | European Patent Office (EPO) | B1 |
53 legal events, as 4 offices reported them to INPADOC
Over the term
Point at a mark for the eventEvents
| Event | Code | Office | |
|---|---|---|---|
| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
| Patent expired after termination of 20 yearsExpiredPE20 | PE20 | GB | |
| Expiry of rightR071 | R071 | DE | |
| No opposition filedOpposition26N | 26N | EP | |
| Annual fee paid to national office [announced via postgrant information from national office to epo]GrantedPGFP | PGFP | EP | |
| No opposition filed within time limitOppositionORIGINAL CODE: 0009261PLBE | PLBE | EP | |
| Information on the status of an ep patent application or granted ep patentGrantedSTATUS: NO OPPOSITION FILED WITHIN TIME LIMITSTAA | STAA | EP | |
| Annual fee paid to national office [announced via postgrant information from national office to epo]GrantedPGFP | PGFP | EP | |
| No opposition filed against granted patent, or epo opposition proceedings concluded without decisionGrantedR097 | R097 | DE | |
| Annual fee paid to national office [announced via postgrant information from national office to epo]GrantedPGFP | PGFP | EP | |
| Fee paymentPLFP | PLFP | FR | |
| Change of applicant/patenteeR081 | R081 | DE | |
| Change of applicant/patenteeR081 | R081 | DE | |
| Change of representativeR082 | R082 | DE | |
| Party data changed (patent owner data changed or rights of a patent transferred)RAP2 | RAP2 | EP | |
| Change of applicant/patenteeR081 | R081 | DE | |
| Change of representativeR082 | R082 | DE | |
| Dpma publication of mentioned ep patent grantGrantedR096 | R096 | DE | |
| Change of applicant/patenteeR081 | R081 | DE | |
| Change of applicant/patenteeR081 | R081 | DE | |
| Designated contracting statesAK | AK | EP | |
| European patent grantedGrantedFG4D | FG4D | GB | |
| (expected) grantORIGINAL CODE: 0009210GRAA | GRAA | EP | |
| Grant fee paidORIGINAL CODE: EPIDOSNIGR3GRAS | GRAS | EP | |
| Intention to grant announcedINTG | INTG | EP | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | EP | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | EP | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | EP | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | EP | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | EP | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | EP | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | EP | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | EP | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | EP | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | EP | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | EP | |
| Despatch of communication of intention to grant a patentORIGINAL CODE: EPIDOSNIGR1GRAP | GRAP | EP | |
| Amendment of ipc main classPREVIOUS MAIN CLASS: H01L0023310000R079 | R079 | DE | |
| Appeal procedure closedAppealORIGINAL CODE: EPIDOSNNOA9EAPBT | APBT | EP | |
| Appeal reference modifiedAppealORIGINAL CODE: EPIDOSCREFNEAPAF | APAF | EP | |
| Date of receipt of statement of grounds of appeal recordedAppealORIGINAL CODE: EPIDOSNNOA3EAPBR | APBR | EP | |
| Party data changed (applicant data changed or rights of an application transferred)RAP1 | RAP1 | EP | |
| Appeal reference recordedAppealORIGINAL CODE: EPIDOSNREFNEAPBK | APBK | EP | |
| Date of receipt of notice of appeal recordedAppealORIGINAL CODE: EPIDOSNNOA2EAPBN | APBN | EP | |
| Party data changed (applicant data changed or rights of an application transferred)RAP1 | RAP1 | EP | |
| First examination report despatched17Q | 17Q | EP | |
| First examination report despatched17Q | 17Q | EP | |
| Request for examination filed17P | 17P | EP | |
| Designated contracting statesAK | AK | EP | |
| Information provided on ipc code assigned before grant7H 01L 23/31 A, 7H 01L 21/56 BRIC1 | RIC1 | EP | |
| Search report despatchedORIGINAL CODE: 0009013PUAL | PUAL | EP | |
| Designated contracting statesAK | AK | EP | |
| Public reference made under article 153(3) epc to a published international application that has entered the european phaseORIGINAL CODE: 0009012PUAI | PUAI | EP |
Numbers
- Publication
- 0773584
- Application
- 963080932
Titles3
- German
- Anordnung bestehend aus einer Harzpackung und Herstellungsverfahren dafür
- English
- Device having resin package and method of producing the same
- French
- Dispositif comprenant un empaquetage en résine et procédé de fabrication
Classification
- CPC, 53
- H10W70/042
- H10W72/00
- H05K1/181
- H05K3/303
- H05K3/305
- H05K3/3436
- H05K3/3442
- H05K2201/09045
- H05K2201/10727
- H05K2201/10977
- Y02P70/50
- H10D62/117
- H10P72/0444
- H10P72/722
- H10W74/016
- H10W74/014
- H10W74/019
- H10W74/111
- H10W72/01225
- H10W72/20
- H10W72/012
- H10W72/251
- H10W72/07251
- H10W72/07173
- H10W72/07141
- H10W72/07504
- H10W72/07511
- H10W72/07521
- H10W72/07533
- H10W72/075
- H10W72/952
- H10W99/00
- H10W90/00
- H10W72/932
- H10W90/754
- H10W72/536
- H10W72/5363
- H10W72/5434
- H10W72/59
- H10W72/5522
- H10W72/5449
- H10W90/756
- H10W72/884
- H10W72/073
- H10W72/0198
- H10W70/60
- H10W90/288
- H10W74/142
- H10W74/10
- H10W74/00
- H10W72/522
- H10W72/555
- H10W72/553
- IPC, 10
- H01L23 31
- H01L25 10
- H01L29 06
- H05K1 18
- H05K3 30
- H05K3 34
- H10P72 00
- H10P72 50
- H10P95 00
- H10W74 01
Designated states1
- Contracting states, 1
- United Kingdom