Nova Patents
EP0514548A1

Multi-layer laminated molding.

Abstract

A multi-layer laminated molding having a layer structure, in which there are laminated a main material layer having as its main component polyethylene resin on the outside and a saponified material layer of ethylene-vinyl acetate copolymer or a layer of polyamide resin on the inside via at least a bonding material layer, is disclosed. Said bonding material layer comprises: A) a resin selected from the group consisting of: 1) a high density polyethylene resin having specific physical properties, 2) a linear low density polyethylene resin having specific physical properties, 3) a sophisticated high density polyethylene resin obtained by grafting an unsaturated carboxylic acid and the like with said resin (1), and 4) a modified linear low density polyethylene resin obtained by grafting an unsaturated carboxylic acid and the like to the said resin (2), which resin has 60-95 wt.% of polyethylene resin containing 0.1 wt% or more of the resin (3) and/or the resin (4); and B) a resinous composition containing 40-5 wt.% of a linear ultra low density polyethylene resin having specific physical properties, having a density of 0.925 g/cm³ or thereabove and containing 0.001-5.0 wt% of grafted unsaturated carboxylic acid and the like; whereby the difference in acoustic impedance between the main material layer and the bonding material layer is 8.5 x 10⁻³ g/cm².µsec or thereabove. This multilayer laminated molding is high in barrier properties, and non-destructive detection of the bonding material layer can be easily performed by an ultrasonic wave reflection method.

EP0514548A1, drawing sheet 1
Sheet 1 of 15

Term

Term ended

Projected expiry passed 4 September 2011, 15.1 years ago.

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6 claims: 1 independent, 5 dependent

  1. 1
    A multi-layer laminate molding having a layer structure that a main material layer made mainly of a polyethylenic resin at the outer side and an ethylene-vinyl acetate copolymer saponified product layer or polyamide resin layer at the inner side are laminated through at least an adhesive material layer, wherein the adhesive material layer comprises a resin composition containing:(A) 60 to 95% by weight of a polyethylenic resin which is at least one resin selected from the group consisting of (1) a high density polyethylenic resin having a density of at least 0.930 g/cm³, a number of short chain branches per 1000 carbon atoms of the main chain of not more than 20, and a melt flow rate of at least 0.01 g/10 min, (2) a linear low density polyethylenic resin having a density of from 0.910 g/cm³ to less than 0.935 g/cm³, a melt flow rate of 0.1 to 50 g/10 min, a melting point as determined with a differential scanning calorimeter of 115 to 130°C, and a number of short chain branches per 1000 carbon atoms of the main chain of 5 to 30, (3) a modified high density polyethylenic resin obtained by grafting unsaturated carboxylic acid and/or its derivative onto the above high density polyethylenic resin (1), and (4) a modified linear low density polyethylenic resin obtained by grafting unsaturated carboxylic acid and/or its derivative onto the above linear low density polyethylenic resin (2), and containing at least 0.1% by weight of the modified high density polyethylenic resin (3) and/or the modified linear low density polyethylenic resin (4), and (B) 40 to 5% by weight of a linear ultra low density polyethylenic resin having a density of from 0.890 g/cm³ to less than 0.910 g/cm³, a number of short chain branches per 1000 carbon atoms of the main chain of 18 to 60, a melt flow rate of 0.1 to 30 g/10 min, and a melting point as determined by the differential scanning calorimeter of 110 to 125°C, and    having a density of at least 0.925 g/cm³ and a proportion of the unsaturated carboxylic acid and/or its derivative grafted of 0.001 to 5.0% by weight, and    has a difference in acoustic impedance between the main material layer and adhesive material layer as determined using a supersonic wave of 20 to 25 MHz of at least 8.5x10⁻³ g/cm²·µsec.