Tab tape, tab tape package and method of bonding same
Abstract
A TAB tape 10 comprises an insulating tape having a multiplicity of openings 12, each surrounded by metallic leads 14 having inner lead portions 18 projecting into the opening 12. In the corners of the opening 12 on the tape are formed metallic chip pressure members 30 having tips 32 projecting into the opening 12 between groups of inner lead portions 18. A chip 24 is positioned in each opening 12 in turn with chip pads 26 aligned with the inner lead portions 18. A bonding tool 34 is moved downwardly into engagement with the inner lead portions 18 to force them into contact with the chip pads 26 and to thermocompressively attach them thereto. The corners of the tool 34 engage and bend the tips 32 into engagement with the surface of the chip 24, so that when the tool is lifted, the chip is prevented from following due to adhesion of the tool and leads.

Term
Term ended
Projected expiry passed 14 November 2011, 14.9 years ago.
- Priority
- Filed
- Published
- Projected expiry
- Today
1 sheet
Sheet 1
Every citation, both ways
| Document | Relation | Office | Category | Cited during |
|---|---|---|---|---|
| US4641176A | Cites | United States of America | A | Search report |
| PATENT ABSTRACTS OF JAPAN vol. 10, no. 141 (E-406)(2198) 24 May 1986 & JP-A-61 004 263 ( NIPPON KOGYO K.K. ) | Non-patent | – | – | Search report |
6 members in 3 offices; this record represents the family
Priority claims2
| Document | Office | Kind | Date |
|---|---|---|---|
| 32342490 | Japan | – | |
| 32342490 | Japan | A |
Members6
| Document | Office | Kind | |
|---|---|---|---|
| EP0488554A2 | European Patent Office (EPO) | A2 | |
| JPH04196142A | Japan | A | |
| EP0488554A3This record | European Patent Office (EPO) | A3 | |
| US5243141A | United States of America | A | |
| US5394675A | United States of America | A | |
| JPH088282B2 | Japan | B2 |
6 legal events, as the office reported them to INPADOC
Over the term
Point at a mark for the eventEvents
| Event | Code | |
|---|---|---|
| Application deemed to be withdrawnWithdrawn18D | 18D | |
| Information on the status of an ep patent application or granted ep patentGrantedSTATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWNSTAA | STAA | |
| Designated contracting statesAK | AK | |
| Search report despatchedORIGINAL CODE: 0009013PUAL | PUAL | |
| Designated contracting statesAK | AK | |
| Public reference made under article 153(3) epc to a published international application that has entered the european phaseORIGINAL CODE: 0009012PUAI | PUAI |
Numbers
- Publication
- 0488554
- Application
- 913105409
Titles3
- German
- TAB-Trägerleiter, Packung eines TAB-Trägerleiters und Bondverfahren dafür
- English
- Tab tape, tab tape package and method of bonding same
- French
- Bande TAB, boîtier d'une bande TAB et son procédé de fixation
Classification
- CPC, 8
- H10W70/453
- Y10T29/49144
- Y10T29/49121
- H10W72/07251
- H10W72/20
- H10W72/701
- H10W72/0711
- H10W72/077
- IPC, 3
- H01L21 60
- H01L21 603
- H10W70 40
Designated states1
- Contracting states, 1
- United Kingdom