Nova Patents
EP0484906A2

Head mounting device.

Abstract

A head mounting assembly utilizing a specially designed printed circuit board ("PCB") for supporting a read/write head (235) for a floppy disk drive computer memory unit is presented. The PCB flexure replaces the metal flexure of the prior art. The PCB flexure is configured so as to provide a similar degree of flexibility as the metal flexure of the prior art. The electrical leads of the read/write head (235) are connected to first ends (295) of conductive strips (280) formed on the surface of the PCB flexure. The other ends (280) of the conductive strips are connected to the disk drive's electronics package by means of a single flexible circuit. Additional electronic components such as preamplifier may be mounted on the PCT flexure itself or on the flexible circuit limiting the amount of noise and other interference that may degenerate the signals passing from the read/write head to the disk drive's electronics.

EP0484906A2, drawing sheet 1
Sheet 1 of 6

Term

Term ended

Projected expiry passed 6 November 2011, 14.9 years ago.

  1. Priority
  2. Filed
  3. Published
  4. Projected expiry
  5. Today

16 claims: 10 independent, 6 dependent

  1. 1
    A flexure (275) for supporting a transducer (235) adjacent to a memory medium (220) characterized by    a low conductivity resilient substrate;and    a high conductivity region (280, 290, 295) formed on said subtrate.
  2. 4
    An assembly for supporting a read/write head (235) adjacent to a memory medium (220) characterized by:a support arm (225, 230) movable adjacent to said memory medium (220);a flexure (275) affixed to said support arm (225, 230) for supporting said read/write head (235) adjacent to said memory medium (220), said flexure comprising:    a low conductivity resilient substrate;and    a high conductivity region (280, 290, 295) formed on said substrate.
  3. 7
    The device according to any of claims 1 to 6 characterized in that said substrate comprises a wafer of resin impregnated fiberglass.
  4. 8
    The device according to any of claims 1 to 6 characterized in that said substrate comprises a ceramic wafer.
  5. 9
    The device according to any of claims 1 to 6 characterized in that said substrate comprises a wafer of PCB material.
  6. 10
    The device according to claims 1 to 9 characterized by electrical component means (260) connected to said high conductivity region.
  7. 12
    The device according to any of claims 2 to 11 characterized in that said read/write head (235) comprises electromagnetic read/write head means.
  8. 13
    The device according to any of claims 2 to 11 characterized in that said read/write head comprises optical read/write head means.
  9. 14
    The device according to any of claims 4 to 13 characterized by carriage means for supporting said support arm.
  10. 16
    A flexure (275) for resiliently supporting a component (235) requiring external electrical connections (280) characterized by    a low conductivity resilient substrate;and    a high conductivity region formed on said substrate for providing electrical connections.