EP0476971A3
Ceramic packages and ceramic wiring board
Abstract
A ceramic package for containing a semiconductor chip (3) including a heat radiating plate (1) and a base plate for wiring, and a ceramic package for containing a semi-conductor chip including a ceramic board (4), a ceramic cap (9) and a metal lead frame; in these packages the heat radiating plate and the ceramic board are made of silicon nitride sintering body. And, a ceramic wiring board, in which a ceramic used as a material of the ceramic base plate is made of polycrystal body of silicon nitride characterized in that the number of grain boundaries of silicon nitride per 10 µm of a straight line drawn in an arbitrary section of the polycrystal body is 20 or fewer.
Term
Term ended
Projected expiry passed 17 September 2011, 15 years ago.
- Priority
- Filed
- Published
- Projected expiry
- Today
1 sheet
Sheet 1
Every citation, both ways
| Document | Relation | Office | Category | Cited during |
|---|---|---|---|---|
| US4780572A | Cites | United States of America | X | Search report |
| JOURNAL OF THE AMERICAN CERAMIC SOCIETY vol. 56, no. 10, October 1973, COLUMBUS,US pages 518 - 522; LANGE: 'Relation Between Strength, Fracture Energy and Microstructure of Hot-Pressed Si3N4' | Non-patent | – | – | Search report |
| PATENT ABSTRACTS OF JAPAN vol. 14, no. 412 (C-0755)6 September 1990 & JP-A-2 157 160 ( KYOCERA CORP ) 15 June 1990 | Non-patent | – | – | Search report |
11 members in 4 offices; this record represents the family
Priority claims8
| Document | Office | Kind | Date |
|---|---|---|---|
| 24602290 | Japan | – | |
| 24602390 | Japan | – | |
| 24602490 | Japan | – | |
| 24602290 | Japan | A | |
| 24602390 | Japan | A | |
| 24602490 | Japan | A | |
| 5557991 | Japan | – | |
| 5557991 | Japan | A |
Members11
| Document | Office | Kind | |
|---|---|---|---|
| EP0476971A2 | European Patent Office (EPO) | A2 | |
| JPH04125950A | Japan | A | |
| JPH04125952A | Japan | A | |
| EP0476971A3This record | European Patent Office (EPO) | A3 | |
| JPH04212441A | Japan | A | |
| US5294750A | United States of America | A | |
| JPH0727995B2 | Japan | B2 | |
| EP0476971B1 | European Patent Office (EPO) | B1 | |
| DE69115408D1 | Germany | D1 | |
| JPH0810735B2 | Japan | B2 | |
| DE69115408T2 | Germany | T2 |
31 legal events, as 3 offices reported them to INPADOC
Over the term
Point at a mark for the eventEvents
| Event | Code | Office | |
|---|---|---|---|
| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
| Notification of lapseLapsedST | ST | FR | |
| Annual fee paid to national office [announced via postgrant information from national office to epo]GrantedPGFP | PGFP | EP | |
| Annual fee paid to national office [announced via postgrant information from national office to epo]GrantedPGFP | PGFP | EP | |
| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
| Nl: lapsed or anulled due to non-payment of the annual feeLapsedNLV4 | NLV4 | EP | |
| Gb: european patent ceased through non-payment of renewal feeCeasedGBPC | GBPC | EP | |
| Se: european patent has lapsedLapsedEUG | EUG | EP | |
| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
| Annual fee paid to national office [announced via postgrant information from national office to epo]GrantedPGFP | PGFP | EP | |
| Annual fee paid to national office [announced via postgrant information from national office to epo]GrantedPGFP | PGFP | EP | |
| Annual fee paid to national office [announced via postgrant information from national office to epo]GrantedPGFP | PGFP | EP | |
| European patent in force as of 2002-01-01IF02 | IF02 | GB | |
| No opposition filedOpposition26N | 26N | EP | |
| No opposition filed within time limitOppositionORIGINAL CODE: 0009261PLBE | PLBE | EP | |
| Information on the status of an ep patent application or granted ep patentGrantedSTATUS: NO OPPOSITION FILED WITHIN TIME LIMITSTAA | STAA | EP | |
| Fr: translation filedET | ET | EP | |
| It: translation for a ep patent filedITF | ITF | EP | |
| It: translation for a ep patent filedITF | ITF | EP | |
| Corresponds to:REF | REF | EP | |
| Designated contracting statesAK | AK | EP | |
| (expected) grantORIGINAL CODE: 0009210GRAA | GRAA | EP | |
| First examination report despatched17Q | 17Q | EP | |
| Request for examination filed17P | 17P | EP | |
| Designated contracting statesAK | AK | EP | |
| Search report despatchedORIGINAL CODE: 0009013PUAL | PUAL | EP | |
| Designated contracting statesAK | AK | EP | |
| Public reference made under article 153(3) epc to a published international application that has entered the european phaseORIGINAL CODE: 0009012PUAI | PUAI | EP |
Numbers
- Publication
- 0476971
- Application
- 913084695
Titles3
- German
- Keramische Packungen und keramische Leiterplatte
- English
- Ceramic packages and ceramic wiring board
- French
- Emballages en céramique et panneau de câblage en céramique
Classification
- CPC, 11
- H10W90/401
- H10W70/692
- H10W40/259
- H10W70/685
- H10W90/734
- H10W90/736
- H10W90/754
- H10W90/756
- H10W72/884
- H10W70/682
- H10W72/552
- IPC, 2
- H10W40 25
- H10W70 692
Designated states1
- Contracting states, 1
- Sweden