EP0475720A2

Polyamide resin composition and film therefrom.

Abstract

A polyamide resin composition obtained by melting and kneading (A) a first polyamide containing not less than 90 mol%, based on the total recurring units, of a m-xylylene adipamide unit of the formula, and(B) a second polyamide showing a semicrystallization time of not more than 30 seconds in a constant-temperature crystallization at 160°C and having a solubility parameter in the range of 13 ± 1.5(C) under the conditions where the following relationship is satisfied,(0.025C-2.2) ≦ log R ≦ (0.025C-0.5) wherein C is a proportion (wt.%) of the first polyamide based on the total weight of the first and second polyamides, and R is a ratio of the melt viscosity of the first polyamide to the melt viscosity of the second polyamide at a temperature higher by 20°C than the melting point of that one of the first and second polyamides which has a higher melting point than the other, provided that C is in the range of 20 to 95 (wt.%); and a film produced therefrom.

EP0475720A2, drawing sheet 1
Sheet 1 of 19

Term

Term ended

Projected expiry passed 10 September 2011, 15 years ago.

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12 claims: 1 independent, 11 dependent

  1. 1
    A polyamide resin composition obtainable by melting and kneading (A) a first polyamide containing not less than 90 mol%, based on the total recurring units, of a m-xylylene adipamide unit of the formula, (B) a second polyamide showing a semicrystallization time of not more than 30 seconds in a constant-temperature crystallization at 160°C and having a solubility parameter in the range of 13 ± 1.5, under the conditions where the following relationship is satisfied, (0.025C-2.2) ≦ log R ≦ (0.025C-0.5) wherein C is the proportion (wt.%) of the first polyamide based on the total weight of the first and second polyamides, and R is the ratio of the melt viscosity of the first polyamide to the melt viscosity of the second polyamide at a temperature higher by 20°C than the melting point of that one of the first and second polyamides which has a higher melting point than the other, provided that C is from 20 to 95 (wt.%).
  2. 2
    A composition according to Claim 1, wherein the first polyamide is polyamide 6 or polyamide 66.
  3. 3
    An unstretched film of a polyamide resin composition as claimed in Claim 1 or 2, which shows a haze value of not more than 7 % when it is converted to a film 50 µm thick.
  4. 4
    An unstretched film according to Claim 3, wherein the proportion C of first polyamide (A) is 60 to 95 % by weight based on the total weight of the first polyamide and the second polyamide.
  5. 5
    A biaxially stretched film of a polyamide resin composition as claimed in Claim 1 or 2, which shows a haze value of not more than 3.5 % when it is converted to a film 25 µm thick.
  6. 6
    A biaxially stretched film according to Claim 5, wherein the proportion C of first polyamide (A) is 20 to 60 % by weight based on the total weight of the first polyamide and the second polyamide.
  7. 8
    An unstretched multi-layer film according to Claim 7, wherein the proportion C of first polyamide (A) is 60 to 95% by weight based on the total amount of the first polyamide and the second polyamide.
  8. 9
    A biaxially stretched multi-layer film composed of a layer of a polyamide resin composition as claimed in Claim 1 or 2 and a layer element of another thermoplastic resin.
  9. 10
    A biaxially stretched multi-layer film according to Claim 9, wherein the proportion C of first polyamide (A) is 20 to 60 % by weight based on the total amount of the first polyamide and the second polyamide.
  10. 11
    A multi-layer film according to any one of Claims 7 to 10, wherein said another thermoplastic resin is a polyolefin, a polycarbonate, a polyethylene terephthalate or the same polyamide as that used as the second polyamide.
  11. 12
    A multi-layer film according to any one of Claims 7 to 11, wherein an adhesive layer is present between the layer of the polyamide resin composition and the layer of another thermoplastic resin.