Method and apparatus for semiconductor chip transducer

A motion transducer fabricated from a semiconductor material by etched exposure and release of a resiliently suspended element (16). Electrical sensing and/or torquing is applied to the suspended element (16) to produce mass or vibrational sensitivities to provide a transducer for various physical parameters. In the case of a gyroscopic transducer a mass (28) is applied to the element and may be applied in a balanced configuration on either side. The semiconductor element and electrodes (30,32) may be isolated by the use of buried PN junctions or dielectric layers, and a separately formed insulating dielectric bridge may be used to provide a support link between the suspended element (16) and the remainder of the semiconductor material. A specific crystal orientation is useful in permitting etch control in freeing the suspended element from the remainder of the material. Suspension link stress relief is provided and a waffle construction achieved in the suspended element for use in motional transduction.