EP0349549A4
Support assembly for integrated circuits
Abstract
This record has no abstract on file.
Term
Term ended
Projected expiry passed 30 December 2007, 18.7 years ago.
- Priority
- Filed
- Published
- Projected expiry
- Today
Every citation, both ways
| Document | Relation | Office | Category | Cited during |
|---|---|---|---|---|
| WO8602200A1 | Cites | World Intellectual Property Organization (WIPO) | A | Search report |
| PATENT ABSTRACTS OF JAPAN, vol. 10, no. 259 (E-434)[2315], 4th September 1986; & JP-A-61 84 853 (NEC IC MICROCOMPUT. SYST. LTD) 30-04-1986 | Non-patent | – | – | Search report |
| See also references of WO 8805962A1 | Non-patent | – | – | Search report |
30 members in 8 offices
Priority claims1
| Document | Office | Kind | Date |
|---|---|---|---|
| 820887 | United States of America | A |
Members30
| Document | Office | Kind | |
|---|---|---|---|
| WO8805962A1 | World Intellectual Property Organization (WIPO) | A1 | |
| US4771330A | United States of America | A | |
| WO8809056A1 | World Intellectual Property Organization (WIPO) | A1 | |
| AU1187488A | Australia | A | |
| US4800419A | United States of America | A | |
| KR890700924A | Republic of Korea | A | |
| KR890700925A | Republic of Korea | A | |
| EP0314707A1 | European Patent Office (EPO) | A1 | |
| WO8904552A1 | World Intellectual Property Organization (WIPO) | A1 | |
| JPH01190102A | Japan | A | |
| JPH01503184A | Japan | A | |
| EP0344259A1 | European Patent Office (EPO) | A1 | |
| KR890702249A | Republic of Korea | A | |
| EP0349549A1 | European Patent Office (EPO) | A1 | |
| JPH02502323A | Japan | A | |
| CA1272306A | Canada | A | |
| EP0349549A4This record | European Patent Office (EPO) | A4 | |
| EP0314707A4 | European Patent Office (EPO) | A4 | |
| AU606386B2 | Australia | B2 | |
| EP0344259A4 | European Patent Office (EPO) | A4 | |
| JPH03503342A | Japan | A | |
| US5087961A | United States of America | A | |
| CA1300282C | Canada | C | |
| KR920008253B1 | Republic of Korea | B1 | |
| KR920008256B1 | Republic of Korea | B1 | |
| EP0314707B1 | European Patent Office (EPO) | B1 | |
| DE3851741D1 | Germany | D1 | |
| DE3851741T2 | Germany | T2 | |
| JP2583597B2 | Japan | B2 | |
| JP2664259B2 | Japan | B2 |
8 legal events, as the office reported them to INPADOC
Over the term
Point at a mark for the eventEvents
| Event | Code | |
|---|---|---|
| Application deemed to be withdrawnWithdrawn18D | 18D | |
| Information on the status of an ep patent application or granted ep patentGrantedSTATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWNSTAA | STAA | |
| First examination report despatched17Q | 17Q | |
| Supplementary search report drawn up and despatchedA4 | A4 | |
| Designated contracting statesAK | AK | |
| Request for examination filed17P | 17P | |
| Designated contracting statesAK | AK | |
| Public reference made under article 153(3) epc to a published international application that has entered the european phaseORIGINAL CODE: 0009012PUAI | PUAI |
Numbers
- Application
- 88902071
Titles
- English
- SUPPORT ASSEMBLY FOR INTEGRATED CIRCUITS
Classification
- CPC, 8
- H10W70/466
- H10W72/50
- H10W90/756
- H10W74/00
- H10W72/552
- H10W90/811
- H10W70/411
- H10W70/04
- IPC, 2
- H10W70 40
- H01L21 60
Designated states1
- Contracting states, 1
- Sweden