Nova Patents
EP0343757A2

Method of joining substrates.

Abstract

A method of joining, repairing or reinforcing substra­tes, particularly polymeric pipes for transporting fluids, e.g. natural gas and water. The method makes use of an article, preferably a heat-recoverable article, which comprises a conductive polymer composition and which is heated to its recovery temperature by passing electrical current through the conductive polymer. Preferably the article is a heat-shrinkable coupler (3). The coupler may make direct contat with and fuse to the pipes (1,2), or there may be an insert between the coupler and the pipes. The article pre­ferably comprises carbon black dispersed in either a sin­tered polymer, particularly ultra high molecular weight polyethylene or a very high molecular weight polymer, par­ticularly polyethylene having a molecular weight greater than 150,000.

EP0343757A2, drawing sheet 1
Sheet 1 of 6

Term

Term ended

Projected expiry passed 2 April 2005, 21.5 years ago.

  1. Priority
  2. Filed
  3. Published
  4. Projected expiry
  5. Today

13 claims: 5 independent, 8 dependent

  1. 1
    A method of joining, repairing, reinforcing or otherwise modifying a substrate, at least an outer surface of which is composed of a first composition which is a heat-softenable composition comprising an organic polymer, which method comprises (1) placing adjacent to each other the parts of the substrates to be joined, repaired, reinforced, or otherwise modified, and an article comprising a heat-recoverable element, the heat-recoverable ele­ment being composed of a second composition which (a) is compatible with the first composition, and (b) comprises an organic polymer and, dispersed in the polymer, a particulate conductive filler;and (2) generating heat within said element to cause the element to recover into contact with the parts of the substrates to be joined, repaired, reinforced or otherwise modified and to cause fusion (as hereinbefore defined) between the element and said outer surface.
  2. 3
    A heat-recoverable article comprising a heat-recoverable element which is composed of a conductive polymer com­position comprising (a) a matrix consisting essentially of organic polymer particles which have been sintered together so that the particles have coalesced without losing their identity, and (b) a particulate conductive filler which is dispersed in said matrix but is present substantially only at or near the boundaries of the coalesced particles.
  3. 9
    A method of repairing, reinforcing, joining or otherwise modifying a substrate, which method comprises (1) placing adjacent the substrate an article comprising an element which is composed of a con­ductive polymer composition comprising (a) a matrix consisting essentially of organic polymer particles which have been sintered together so that the particles have coalesced without losing their identity, and (b) a particulate conductive filler which is dispersed in said matrix but is present substantially only at or near the boundaries of the coalesced particles;and (2) generating heat within the conductive polymer ele­ment while maintaining the article in direct or indirect contact with the substrate, thereby adhering the article to the substrate.
  4. 12
    A method of joining at least two substrates positioned adjacent to each other such that there is a gap between the parts of the substrates to be joined, the method comprising:(1) selecting the substrates such that at least one of the substrates has at least an outer surface which is composed of a composition which is heat sof­tenable, and/or providing an insert member which is composed of a heat softenable composition, (2) placing adjacent the substrates an article which comprises a heat-recoverable element comprising an organic polymer and dispersed in the polymer a par­ticulate conductive filler, and (3) generating heat within the element (i) to cause the element to recover into contact with the parts of the substrate to be joined (ii) to cause the heat-­softenable composition(s) to soften and (iii) to drive the softened composition(s) to fill the gap between the substrates.
  5. 13
    14. A method of joining repairing, reinforcing or otherwise modifying a hollow substrate comprising:(1) placing adajent to the substrate an article comprising a heat-recoverable element comprising an organic polymer and dispersed in the polymer, a particulate conductive filler. (2) positioning a support member within the hollow substrate, which support member has protuberances on its external surface, and (3) generating heat within said element to cause the element to recover towards the substrate such that it deforms the substrate into the gaps between the protuberances of the support member.