EP0322040A3

Manufacturing process for a monolithic semiconductor device comprising at least one transistor of an integrated control circuit and one power transistor integrated on the same chip

Abstract

The device uses the horizontal insulating region and the buried layer as the power transistor base and emitter respectively. An epitaxial growth is interposed between the two diffusions needed to form the aforesaid regions and those needed to create the base and the emitter of the transistor of the integrated control circuit.

EP0322040A3, drawing sheet 1
Sheet 1 of 1

Term

Term ended

Projected expiry passed 16 December 2008, 17.8 years ago.

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1 sheet

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