EP0246765A3
Apparatus and method for manufacturing planarized aluminium films
Abstract
An apparatus for planarizing an aluminum layer on a semiconductor wafer includes two deposition sources. The first source applies a refractory metal silicide layer to form a barrier to oxygen. The water is moved to a second deposition source which is an aluminum sputter device including a heater for the wafer, R.F. bias on the wafer and a magnetic mirror behind the wafer to move the plasma away from the wafer.
Term
Term ended
Projected expiry passed 27 April 2007, 19.4 years ago.
- Priority
- Filed
- Published
- Projected expiry
- Today
1 sheet
Sheet 1
Every citation, both ways
| Document | Relation | Office | Category | Cited during |
|---|---|---|---|---|
| EP0162642A1 | Cites | European Patent Office (EPO) | X | Search report |
| US4306731A | Cites | United States of America | AD | Search report |
| US4526665A | Cites | United States of America | A | Search report |
| ELECTRONICS, vol. 58, no. 37, Spetember 1985, page 21; N.J. PARSIPPANY: "Sputterer covers steep walls evenly" | Non-patent | – | – | Search report |
| REVIEW OF SCIENTIFIC INSTRUMENTS, vol. 54, no. 5, May 1983, pages 633-635, American Institute of Physics, New York, US; C.A. STONE et al.: "Substrate heater and biasing electrode assembly for rf sputtering unit" | Non-patent | – | – | Search report |
| JOURNAL OF THE ELECTROCHEMICAL SOCIETY, vol. 132, no. 6, June 1985, pages 1466-1472, Manchester, New Hampshire, US; Y. HOMMA et al.: "Planar deposition of aluminum by RF/DC sputtering with RF bias" | Non-patent | – | – | Search report |
| PATENT ABSTRACTS OF JAPAN, vol. 10, no. 50 (E-384)[2107], 27th February 1986; & JP 60202942 A (HITACHI SEISAKUSHO K.K.) 14-10-1985 | Non-patent | – | – | Search report |
27 members in 5 offices; this record represents the family
Priority claims4
| Document | Office | Kind | Date |
|---|---|---|---|
| 863745 | United States of America | – | |
| 86374586 | United States of America | A | |
| 925004 | United States of America | – | |
| 92500486 | United States of America | A |
Members27
| Document | Office | Kind | |
|---|---|---|---|
| EP0163446A1 | European Patent Office (EPO) | A1 | |
| KR850008361A | Republic of Korea | A | |
| JPS6141767A | Japan | A | |
| DE163446T1 | Germany | T1 | |
| US4595482A | United States of America | A | |
| US4627904A | United States of America | A | |
| US4657654A | United States of America | A | |
| US4661228A | United States of America | A | |
| EP0227438A2 | European Patent Office (EPO) | A2 | |
| KR870006231A | Republic of Korea | A | |
| JPS62228463A | Japan | A | |
| EP0246765A2 | European Patent Office (EPO) | A2 | |
| JPS6324054A | Japan | A | |
| JPS63230872A | Japan | A | |
| EP0246765A3This record | European Patent Office (EPO) | A3 | |
| EP0227438A3 | European Patent Office (EPO) | A3 | |
| US4865712A | United States of America | A | |
| KR900004600B1 | Republic of Korea | B1 | |
| KR900004601B1 | Republic of Korea | B1 | |
| KR900004602B1 | Republic of Korea | B1 | |
| EP0163446B1 | European Patent Office (EPO) | B1 | |
| DE3580515D1 | Germany | D1 | |
| EP0227438B1 | European Patent Office (EPO) | B1 | |
| DE3686640D1 | Germany | D1 | |
| DE3686640T2 | Germany | T2 | |
| JPH0686658B2 | Japan | B2 | |
| JP2662582B2 | Japan | B2 |
7 legal events, as the office reported them to INPADOC
Over the term
Point at a mark for the eventEvents
| Event | Code | |
|---|---|---|
| Information on inventor provided before grant (corrected)RIN1 | RIN1 | |
| Application deemed to be withdrawnWithdrawn18D | 18D | |
| Information on the status of an ep patent application or granted ep patentGrantedSTATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWNSTAA | STAA | |
| Designated contracting statesAK | AK | |
| Search report despatchedORIGINAL CODE: 0009013PUAL | PUAL | |
| Designated contracting statesAK | AK | |
| Public reference made under article 153(3) epc to a published international application that has entered the european phaseORIGINAL CODE: 0009012PUAI | PUAI |
Numbers
- Publication
- 0246765
- Application
- 87303717
Titles3
- English
- Apparatus and method for manufacturing planarized aluminium films
- French
- Appareil et méthode de fabrication de films d'aluminium planarisés
- German
- Gerät und Verfahren zur Herstellung planarisierter Aluminiumschichten
Classification
- CPC, 12
- H01J37/3266
- C23C14/0682
- C23C14/165
- C23C14/351
- H01J37/32935
- H01J37/3408
- H01J37/3423
- H01J37/3435
- H01J37/3458
- C23F4/00
- H10P14/412
- H10W20/062
- IPC, 5
- C23C14 06
- C23C14 16
- C23C14 35
- H01J37 34
- H10P14 40
Designated states1
- Contracting states, 1
- United Kingdom