Formed composite article.

The present invention relates to molded, reinforced composites with a coating on at least one side and a method for their production.

Molded reinforced composites are usually made by placing layers of a resin and its hardener, preferably a polyester resin and a peroxide hardener, and a reinforcement, which is a powder, flake or preferably a fiber, suitably glass fiber, in a suitable tool which Allows resin to harden and removes the resulting hardened composite. The surfaces of such moldings often have flaws where the reinforcement forms part of the surface. In order to prevent such defects and thus to obtain a perfectly smooth surface, it is customary in practice to apply a layer of the resin to the tool surface without reinforcement and to allow this resin to solidify (gel) before the rest of the resin with the reinforcement is applied. This method of creating a flawless surface on the composite is called a gel coating.

The mechanical properties of molded composites made in this way are limited because a resin that cures rapidly at room temperature must be used. If better mechanical properties are required, a phenolic or epoxy resin can be used. These resins harden only slowly when mixed with a hardener and left at room temperature, and it is therefore customary in practice to heat the resin in the mold and thus achieve hardening within a few minutes. It is of course possible to apply a gel coating which hardens rapidly at room temperature, for example a polyester resin, and after the gelation has taken place, the phenolic or epoxy resin is applied together with the reinforcement. Such a method is disadvantageous because of the chemical difference between the coating and the core of the molded body. In the event of physical or mechanical impacts, the coating tends to crack or even separate from the molded body core. It is therefore widely preferred to use a heat-curable phenol or epoxy resin gel coating if the core of the molded body consists of a phenol or epoxy resin.

The installation of such mechanically resistant gel coatings now presents its own difficulties. After application of the coating resin to the tool, heating is required to achieve gelation, since the reinforcement and further resin cannot be applied until the gel coating has hardened, otherwise the reinforcement will penetrate the coating and damage the finished surface. In order to obtain a gel coating of appropriate thickness, a formulation containing additives which impart thixotropy is usually applied. However, many such additives cause thixotropic compositions to flow when heated, and this in turn leads to places where the yellow stratification is thicker than desired. The formulation of heat-curable gel coatings is problematic because it requires precise knowledge of the conditions of use, curing conditions and even the shape of the tool.

There is another difficulty that must be overcome when processing a hot-cured gel coating. The coating and the tool to which it is applied must be heated for a sufficient amount of time to achieve gelling of the resin. Then they must be cooled down before the resin and reinforcement layers are applied, otherwise a certain premature gelation of this resin can occur. After laying on, the entire structure is heated again. Such a process is not only expensive because of the costs for heating the often large metal tools, but the heating-cooling-heating sequence is also very time-consuming, which increases the cost per molded article. There is therefore a need for a method for producing mechanically strong, gel-coated composites, in which the coating is firmly bonded to the reinforced core of the molded body and which do not require double heating of the tool and resin.

It has now been found that this object can be achieved by applying a layer of a composition which is both light-curable and heat-curable, or a composition which becomes heat-curable when light-cured, as a gel coating, the heat-curable portion being formed from an epoxy resin or phenolic resin. The reinforced resin is only thermosetting and preferably the same type as the thermosetting portion of the gel coating. This gel coating solidifies rapidly under ultraviolet radiation and in this solidified state is resistant to damage caused by contact with the reinforcement. However, it is still heat-curable. When the entire structure is heated, usually under pressure, the thermosetting resin flows to a certain extent before curing. This leads to mixing of the gel coating resin and the reinforced resin at their interface, so that after the curing has ended, it is impossible to separate the gel coating unless the physical or mechanical impact is so strong that the reinforced resin also suffers damage. Since only one heating stage is required, the process is economical and not particularly time-consuming.

The use of photopolymerization to harden a gel coating is known. German Patent 3,140,316 describes a method in which a gel coating is precured by radiation and then a thermosetting material is applied and cured. The coating preferably contains some electrically conductive material and it is stated that no release agent is required on the tool surface. Only unsaturated substances are described as suitable for the process, typically acrylates and polyesters. The gel coating is fully cured by irradiation, and the second resin is then applied together with a suitable hardener, and the curing takes place at room temperature. The fact that the gel coating is fully hardened before the second resin is applied means that the bond between these layers depends almost exclusively on the adhesive strength of the second resin and cannot be as strong as with a certain chemical interaction at the resin interface. A physical or mechanical impact can therefore lead to the separation of the gelled coating.

The subject of this invention is therefore a process for the production of coated, reinforced epoxy or phenol moldings, which is characterized in that<ul id="ul0001" list-style="none"><li>(i) applying a layer of a liquid composition containing a photohardenable residue and a residue having at least one epoxy group or phenolic hydroxyl group to the surface of a tool,</li><li>(ii) exposing this layer to actinic radiation until solidification takes place, thereby forming a solidified layer with a thermosetting residue which is an epoxy or phenolic resin,</li><li>(iii) applying at least one reinforcing layer and at least one layer of a thermosetting resin which is an epoxy or phenolic resin to the solidified layer in any order or simultaneously,</li><li>(iv) the structure is heated to form a hardened shaped body and</li><li>(v) removes the hardened molded body from the tool.</li></ul>

The composition used for gel coating can consist of an only light-curable resin with an only heat-curable epoxy or phenolic resin, ie a double-functional material a resin which has at least one photocurable group and at least one epoxy or phenol hydroxyl group in the same molecule and cures in step (ii) to form a thermosetting resin, consist of a mixture of such a double-functional resin and an only light-curable resin and / or an only heat-curable epoxy or phenolic resin or of an epoxy or phenolic resin together with a heat-activated hardener and a hardener activated by actinic radiation.

The thermosetting resin used in step (i) or formed in step (ii) by light curing a double-functional resin may be the same or different kind as the resin used in step (iii). Preferably the resins are of the same type, ie if an epoxy resin is used in step (i) or is formed in step (ii) by light curing a compound containing an epoxy group and one or more light curable groups, then an epoxy resin is used in step (iii). Similarly, if a phenolic resole is used in step (i), a phenolic resole is used in step (iii).

Such light-curable resins are preferably used in the present process, the at least one unsaturated ester group of the formula CH₂ = C (R¹) COO- I wherein R¹ represents a hydrogen, chlorine or bromine atom or an alkyl group having 1 to 4 carbon atoms, in particular a hydrogen atom or a methyl group.

The photocurable resin usually has at least two groups of the formula I and a molecular weight of up to at most 10,000. These groups can be attached to an aliphatic, aromatic, araliphatic, cycloaliphatic or heterocyclic radical. Light-curable resins include acrylates and methacrylates of monohydric alcohols, such as 2-methoxyethanol, tetrahydrofurfuryl alcohol and cyclohexanol, as well as full and half esters of acrylic and methacrylic acid with glycols such as ethylene glycol, propylene glycol, 1,4-butanediol, neopentyl glycol, diethylene and tri-ethylene glycol - and tripropylene glycol, tetraethylene glycol and higher polyoxyalkylene glycols, and higher functional polyols such as trimethylolpropane, Polyoxyalkylene triols and pentaerythritol. If appropriate, these acrylates and methacrylates are halogen-substituted. Acrylate and methacrylate esters of substituted monohydric alcohols such as 2-cyanoethanol, 2-chloroethanol, 2-bromoethanol and 2-isocyanatoethanol are also suitable as the photo-curable resin.

Also suitable as light-curable resin by reacting a compound containing one or more glycidyl groups, in particular a mono- or polyglycidyl ether of a mono- or polyhydric alcohol or phenol or N-glycidylhydantoin, with 2-hydroxypropyl esters formed with acrylic or methacrylic acid. Other suitable light-curable resins are esters formed by reacting a diepoxide or other polyepoxide with an equivalent amount of an adduct of a hydroxyalkyl acrylate or methacrylate with a saturated or unsaturated dicarboxylic anhydride such as succinic, maleic or phthalic anhydride. Typical such compounds include 1,4-bis (2-hydroxy-3-acryloyloxypropoxy) butane, poly (2-hydroxy-3-acryloyloxypropyl) ether of a bisphenol or phenol / formaldehyde novolak, 2,2-bis ( 4- (2-hydroxy-3- (2-acryloyloxyethoxy) succinyloxypropoxy) phenyl) propane, 1- (2-hydroxy-3-acryloyloxypropoxy) butane, octane and decane, bis (2-hydroxy) 3-acryloyloxypropyl) adipate, 2-hydroxy-3-acryloyloxypropyl propionate and 3-phenoxy-2-hydroxypropyl acrylate as well as the corresponding methacrylates.

Further light-curable compositions suitable for stage (i) of the new process are phenolic or epoxy resins together with a hardener which can be activated by actinic radiation, in particular an aromatic iodonium, sulfonium, sulfoxonium or iodosyl salt or a ferrocenium salt Suitable anions for such salts include boron, arsenic, antimony or phosphorus fluorides and, if a phenolic resin is used, also halides, sulfates or sulfonates.

Suitable phenolic resins which can be used in the gel coating and which can form the core of the shaped body with the reinforcement are, by reacting a mono- or polyhydric phenol such as phenol itself, a cresol, bisphenol A or resorcinol with an aldehyde such as formaldehyde and novolaks. Resoles and novolaks derived from phenol and formaldehyde are preferred as the phenolic resins.

Suitable epoxy resins which can be used in the gel coating and which can form part of the shaped body core with the reinforcement include polyglycidyl esters which can be obtained by reacting a compound containing two or more carboxylic acid groups per molecule with epichlorohydrin or glycerol dichlorohydrin in the presence of alkali. Such glycidyl esters are preferably derived from aliphatic polycarboxylic acids, for example Succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid or dimerized or trimerized linoleic acid, from cycloaliphatic polycarboxylic acids such as tetrahydrophthalic acid, 4-methyltetrahydrophthalic acid, hexahydrophthalic acid and 4-methylhexahydrophthalic acid, and from aromatic polycarboxylic acids such as phthalic acid, isophthalic acid and terephthalic acid.

Further suitable epoxy resins are polyglycidyl ethers obtainable by reacting a compound containing two or more free alcoholic and / or phenolic hydroxyl groups in the molecule with epichlorohydrin under alkaline conditions or also in the presence of an acid catalyst with subsequent alkali treatment. These ethers can be prepared from acyclic alcohols such as ethylene glycol, poly (oxyethylene) glycols, propane-1,2-diol, poly (oxypropylene) glycols, propane-1,3-diol, butane-1,4-diol, Poly (oxytetramethylene) glycols, glycerin, pentaerythritol and poly (epichlorohydrin). They are also made from mononuclear phenols such as resorcinol and multinuclear phenols such as bis- (4-hydroxyphenyl) methane, 4,4'-dihydroxydiphenyl, bis- (4-hydroxyphenyl) sulfone, 1,1,2,2-tetrakis ( 4-hydroxyphenyl) ethane, 2,2-bis (4-hydroxyphenyl) propane (otherwise known as bisphenol A), 2,2-bis (3,5-dibromo-4-hydroxyphenyl) propane and from aldehydes such as Formaldehyde can be produced with novolaks formed with phenols.

Other suitable epoxy resins are poly (N-glycidyl) compounds including, for example, those obtained by dehydrochlorination of the reaction products of epichlorohydrin with amines containing at least two amine hydrogen atoms, such as aniline, n-butylamine and bis (4-aminophenyl) methane. Triglycidyl isocyanurate and N, N'-diglycidyl derivatives of cyclic alkylene ureas such as ethylene urea and of hydantoins such as 5,5-dimethylhydantoin.

Epoxides which are particularly preferably used in the process according to the invention are optionally pre-extended diglycidyl ethers of dihydric phenols such as 2,2-bis (4-hydroxyphenyl) propane and bis (4-hydroxyphenyl) methane and dihydric alcohols such as butane-1,4-diol, Polyglycidyl ether of phenol / formaldehyde and bisphenol-A / formaldehyde novolaks as well as N-glycidylated aromatic amines such as N, N, N ', N'-tetraglycidyl-4,4'-diaminodiphenylmethane and N, N, O-triglycidyl-4-aminophenol.

As mentioned previously, the liquid composition used in step (i) may also contain a resin having at least one photo-curable group and at least one epoxy or phenol hydroxyl group in the same molecule. Such double-functional resins preferably carry at least one 1,2-epoxy group or phenol hydroxyl group and at least one substituted ester group of the formula I, with those having one or two 1,2-epoxy groups and 1 to 6 groups of the formula I being particularly preferred.

Typical such compounds correspond to the formula<chemistry id="chem0001" num="0001"><img file="EP0214930A2_D0001.tif" /></chemistry> wherein R¹ has the meaning given above and R² the rest of a di- or polyglycidyl compound after removal of the two glycidyl groups, R³ the rest of a di- or polycarboxylic acid after removal of the two carboxylic acid groups and R⁴ represent an alkylene chain with 1 to 6 carbon atoms.

Such suitable R 2 radicals include divalent phenol, in particular bisphenol, residues after the two phenol hydrogen atoms have been removed, glycol residues after the two alcohol hydrogen atoms have been removed and aromatic amine residues after the two amine hydrogen atoms have been removed. Suitable radicals R³ are saturated or unsaturated, aliphatic or aromatic dicarboxylic acid and aromatic tri- or tetracarboxylic acid residues after removal of the two carboxylic acid groups, such as succinic acid, malonic acid, maleic acid, phthalic acid, trimellitic acid and pyromellitic acid residues. As alkylene groups R⁴ are ethylene, propylene and butylene groups.

Suitable double-functional compounds can be prepared by introducing a group of the formula I into a compound which already contains one or more 1,2-epoxy groups or, conversely, introducing one or more 1,2-epoxy groups into a compound which already has one or more Contains groups of formula I.

A convenient method for introducing groups of formula I into a compound already containing epoxy groups to form, for example, a compound of formula III, is to react at least one diepoxide with a stoichiometric deficit in the epoxy group content of a compound that is both a group of formula I and also a group such as a carboxylic acid, phenolic or alcoholic hydroxyl or imide group, which is capable of reacting with a 1,2-epoxy group so as to introduce at least one group of the formula I into the molecule. Suitable polyepoxides include those mentioned above as being suitable for use as a thermosetting resin.

It goes without saying that this method usually does not give a 100% yield of material which contains both a 1,2-epoxy group and an acrylate group of the formula I in the same molecule. The remaining material in the product consists of a mixture of unchanged starting material with the original number of epoxy groups and material in which all epoxy groups have been replaced by groups of the formula I. However, since such mixtures can be successfully used in the present process, the fact that the reaction product is a mixture has no further consequences.

Another method for producing double-functional compounds, for example those of the formula II, by introducing one or more epoxide groups into a compound having at least one group of the formula I is to use a compound as the latter which additionally has at least one alcoholic hydroxyl group or a carboxyl group contains and treats them that the group (s) is or are converted into 1,2-epoxy groups by known methods of epoxy resin technology for converting hydroxyl or carboxyl groups into glycidyl ether or ester groups. For example, the compound is left in the presence of a hydrogen chloride binding agent (usually a strong base, e.g. NaOH, and preferably a catalyst such as a quaternary ammonium compound, a tertiary amine, a transition metal salt, a thioether or a sulfonium salt) react with epichlorohydrin. An excess of epichlorohydrin over the amount theoretically required is normally used, the excess serving as a solvent for the reaction, which is usually carried out at a temperature of 30 ° to 120 ° C., preferably 40 to 65 ° C., and usually under reduced pressure to remove the water formed during the reaction.

An expedient method for the preparation of double-functional compounds such as those of the formula IV consists in converting a hydroxy-substituted compound containing a group of the formula I into a half ester by reaction with a polycarboxylic anhydride. The free carboxylic acid group (s) can can then be glycidylated by the method described above or esterified by treatment with a compound containing two or more epoxy groups, usually at 60 to 120 ° C in the presence of a strong base and a catalyst such as a quaternary ammonium compound or a transition metal salt.

Both a phenolic resin residue and an unsaturated group of the formula I containing compounds are prepared by reacting the phenolic resin containing more than one phenolic hydroxyl group or hydroxyalkyl group per average molecule with an unsaturated acid containing a group of the formula I, preferably acrylic or methacrylic acid or its reactive derivatives, especially the chloride or glycidyl ester.

Typical double-functional compounds are glycidyl acrylate, glycidyl methacrylate, 2- (4-glycidyloxyphenyl) -2- (4- (3-acryloyloxy-2-hydroxypropoxy) phenyl) propan, 2- (4- (glycidyloxyphenyl) -2- (4- (2-hydroxy-3-methacryloyloxy) propoxy) phenyl) propane, 1- (2-methacryloyloxyethoxycarbonyl) -2,4- and -2,5-bis (glycidyloxycarbonyl) benzene, 1- (2- Acryloyloxyethoxycarbonyl) -2,4- and -2,5-bis- (glycidyloxycarbonyl) benzene, 2-acryloyloxyethoxyglycidyl succinate, 2-methacryloyloxyethoxyglycidyl succinate, 1-glycidyl-3- (3-acryloyloxy-2-hydroxypropyl) -5,5-dimethylhydantoin, 1-glycidyl-3- (2-hydroxy-3-methacryloyloxy) propyl) -5,5-dimethylhydantoin, 1-glycidyloxy -4- (3-acryloyloxy-2-hydroxypropyloxy) butane, 1-glycidyloxy-4- (2-hydroxy-3-methacryloyloxypropyloxy) butane and the reaction product of a phenol / formaldehyde resol with half the stoichiometric amount of acryloyl- or methacryloyl chloride or glycidyl acrylate or methacrylate.

One or more components of the liquid composition can be solid, provided that the mixture is liquid. The viscosity of the composition is preferably in the range 0.1 to 50 Pa s. In order to reach this viscosity range, the composition can also contain monoepoxides instead of or in addition to low-viscosity, among the selected acrylates and methacrylates described above. Suitable monoepoxides include n-butylglycidyl ether, 2,2,4-trimethylpentylglycidyl ether (isooctylglycidyl ether) and phenylglycidyl ether.

The weight ratio of the photohardenable residue to the epoxy or phenolic resin residue in the liquid composition is not critical as long as effective amounts of both are present. Where the epoxy or phenolic resin residue and the photo-curable residue are on separate molecules, the weight ratio of the epoxy or phenolic resin to the photo-curable material is generally in the range from 0.2: 1 to 15: 1, preferably from 1: 1 to 10: 1 .

The liquid composition is preferably irradiated in the presence of a suitable catalyst which, when irradiated, results in an excited state which leads to the formation of free radicals which then initiate the polymerization of the monomer.

Suitable catalysts of this type are, inter alia, alpha-halogen-substituted acetophenones such as 2,2,2-trichloro-4'-tert-butylacetophenone, benzophenones, O-alkoxycarbonyl derivatives of an oxime of benzil or 1-phenylpropane-1,2-dione, such as benzil - (O-ethoxycarbonyl) -alphamonoxime and 1-phenylpropane-1,2-dione-2- (O-ethoxycarbonyl) -oxime, benzil ketals e.g. benzil dimethyl ketal and mixtures of phenothiazine dyes (e.g. methylene blue) or quinoxalines (e.g. Metal salts of 2- (m- or p-methoxyphenyl) -quinoxaline-6'- or -7'-sulfonic acid) with electron donors such as sodium benzenesulfinate or another sulfinic acid or its salt, an arsine, phosphine or thiourea (photoredox systems). Titanocenes such as bis- (π -cyclopentadienyl) -bis- (σ -pentafluorophenyl) -titanium (IV) are also suitable. Benzyl dimethyl ketal is particularly preferred as a photoinitiator.

In general, 0.01 to 20 and preferably 0.5 to 15% by weight of photopolymerization catalyst, based on the weight of the liquid composition, are incorporated.

Hardeners for the epoxy or phenolic resin are well known and are selected depending on the type of resin and the properties required in both the cured and uncured resin. If a phenolic resol is used, curing can be effected by heating without added hardener or in the presence of an acid hardener such as phosphoric acid, sulfuric acid, methanesulfonic acid, p-toluenesulfonic acid, xylenesulfonic acid or hydrochloric acid. If a phenolic novolak is used, a formaldehyde donor must be added, preferably hexamethylenetetramine.

Hardeners for epoxy resins which can be used in the process according to the invention include polycarboxylic acids and their anhydrides, in particular aromatic acids and anhydrides such as pyromellitic acid, pyromellitic acid anhydride, trimellitic acid, trimellitic acid anhydride and phthalic anhydride, aliphatic, cycloaliphatic and heterocyclic amine amine, amine polyamines, tertiary amines, tertiary amines, including tertiary amines, including tertiary amines, including tertiary amines, including tertiary amines, including diamine amines, including amine, amine, amine, amine, and tertiary amines and N, N-dimethylpropylene-1,3-diamine, Polyalkylene polyamines such as diethylenetriamine, triethylenetetramine and tetamethylenepentamine, alkanolamines such as ethanolamine, diethanolamine, triethanolamine and N- (2-hydroxyethyl) -diethylenetriamine, cycloaliphatic polyamines such as bis- (4-aminocyclohexyl) methane and isophorone polyamine such as isophorone diamine -Aminoethyl) -piperazine and polyaminoamides such as the reaction products of aliphatic polyamines with dimerized and trimerized unsaturated fatty acids.

Other hardeners include aromatic primary and secondary amines, for example phenylenediamines, substituted phenylenediamines such as 2,4- and 2,6-diethyl-3,5-diaminotoluene, bis- (aminophenyl) methanes such as bis- (4-aminophenyl) - methane, bis (aminophenyl) sulfones such as bis (4-aminophenyl) sulfone and bis (aminophenyl) ketones such as bis (4-aminophenyl) ketone, imidazole and substituted imidazoles such as 2-methylimidazole, 2-phenylimidazole , 1-benzyl-2-methylimidazole and 1-cyanoethyl-2-methylimidazole, Amides including substituted ureas, especially ureas substituted with aromatic groups such as N- (4-chlorophenyl) -N ', N'-dimethylurea, N- (2-hydroxyphenyl) -N', N'-dimethylurea, N- (3-chloro -4-methylphenyl) -N ', N'-dimethylurea and 2,4-bis (N, N-dimethylureido) toluene, amidines such as dicyandiamide and 1-cyano-3-lower alkyl guanidines, for example the 3-methyl, 3 , 3-dimethyl or 3,3-diethyl compounds, and complexes of boron trifluoride or trichloride with an aliphatic, cycloaliphatic or heterocyclic amine, in particular trimethylamine or octyldimethylamine.

Conventional accelerators can be used with the epoxy resin hardeners mentioned above.

Any solid material commonly used in the manufacture of reinforced composites may be present as reinforcement. This can be in powder form, flake or preferably fiber form. Particularly preferred fibers are those made of cotton, glass, carbon, boron, asbestos or metals such as steel or aluminum. These fiber materials can be added as loose fibers or as a woven or non-woven fabric and pre-impregnated with the thermosetting resin.

The liquid composition can be applied to the tool surface by any known method, for example by spraying, brushing or rolling. The thickness of this coating is typically 1-250 microns. As is common in the practice of applying gel coatings, the tool surface is preferably treated with a mold release agent before the resin is applied.

In the photopolymerization stage of the process according to the invention, actinic radiation with a wavelength of 200 to 600 nm is preferably used. Suitable actinic radiation sources include carbon arcs, mercury arcs, fluorescent lamps with phosphors that emit ultraviolet light, argon and xenon glow lamps, tungsten lamps and photographic flood lamps. Among them, mercury vapor arcs, especially sunlamps, fluorescent sunlamps and metal halide lamps, are the most suitable. The exposure time required depends on a number of factors, including, for example, the individual compounds used, the type of light source and the distance of this source from the irradiated composition. Suitable times which give the coating sufficient hardness to withstand damage caused by the reinforcement when heated under pressure can easily be determined by the person skilled in the art in photopolymerization methods.

The invention will now be explained with reference to the following examples, all parts and percentages relating to the weight.

The following resins are used in these examples:

Harz I

This means an epoxy resin prepared by pre-extending bisphenol A diglycidyl ether by reaction with bisphenol A using sodium hydroxide as catalyst with an epoxide content of 1.4 val / kg.

Harz II

This means a glycidylated phenol / formaldehyde novolak with an epoxy content of 5.6 val / kg and a viscosity of 40 Pa s at 50 ° C.

Resin III

This means 1,4-butanediol dimethacrylate.

Harz IV

This means glycidyl methacrylate.

Harz V

This means bis- (4- (N, N-diglycidylamino) phenyl) methane with an epoxide content of 7.5 val / kg.

Resin VI

This means 2,2-bis (4-glycidyloxyphenyl) propane with an epoxy content of 5.2 val / kg.

Resin VII

A mixture of 80% phenol (208.3 parts), 38.3% formalin (222.2 parts) and zinc acetate (19.4 parts) is refluxed for 2 1/2 hours and then allowed to cool. The mixture separates into two layers and the aqueous layer is drawn off, leaving a phenol / formaldehyde resole with a viscosity of 0.4 Pa s at 25 ° C.

This resole (100 parts) is mixed with tetramethylammonium chloride (0.199 parts) and 2,6-di-tert-butyl-4-methylphenol (0.266 parts) and heated to 80 ° C. Glycidyl methacrylate (46.1 parts) is added dropwise over the course of an hour, and the mixture is then heated at 80 ° C. for a further 8 1/2 hours. Upon cooling, resin VII is obtained with a viscosity of 1.44 Pa s at 25 ° C.

Resin VIII

This means dibromo neopentyl glycol dimethacrylate, supplied by Shin-Nakamuro Chemical Co. Ltd., Wakayama, Japan.

Resin IX

This means a phenol / formaldehyde resol with the following properties: molar ratio phenol: formaldehyde = 1: 1.4; specific gravity = 1.225; Solids content = 76%; Viscosity at 25 ° C = 0.8 Pa s.

Resin X

This means a glycidylated bisphenol A / formaldehyde novolak with a softening point of 72 ° C and an epoxy content of 4.7 val / kg.

Resin XI

This means a resin made by evaporating all the water from a phenol / formaldehyde resol with a molar ratio of phenol: formaldehyde of 1: 1.8, a viscosity of 6-8 Pa s at 25 ° C, a solids content of 81.5-85 , 5% and a pH of 8.0-9.0.

Resin XII

This means 1,1,1-trimethylolpropane trismethacrylate.

example 1

Resin I (60.8 g) and Resin II (206.6 g) are heated together to 120 ° C. and resin III (100.0 g), Resin IV (20.4 g) and benzil dimethyl ketal ( 42.5 g). The mixture is allowed to cool to 60 ° C. and resin V (40.5 g) is added.

Resin VI (36.5 g), resin III (21.5 g), dicyandiamide (21.9 g) and N- (4-chlorophenyl) -N ', N'-dimethylurea (21, 9 g) and then passes the mixture through a three-roll mill. The two mixtures are combined and brushed onto a metal tool previously coated with a silicone release agent, resulting in a 4 to 6 micron thick coating. The coating is exposed for 0.6 seconds under an 80 W / cm medium pressure mercury arc lamp at a distance of 90 mm. The coating thus obtained is hard and tack-free.

Two layers of a prepreg are applied to this coating, which contains 42% of an epoxy resin formulation on a sized square glass fabric weighing 200 g per square meter. The resin formulation contains resin VI (55 parts), with bisphenol-A pre-extended to an epoxy content of 0.3 val / kg resin VI (45 parts), dicyandiamide (14 parts) and N- (3-chloro-4-methylphenyl) - N ', N'-dimethylurea (7 parts). The assembly is covered with a polytetrafluoroethylene film and it is evacuated to keep the film on the layers. The mixture is heated in the oven at 130 ° C. for 1 hour and separated from the tool, which results in a hardened, rigid molded body from which the coating cannot be removed.

Example 2

Resin VII (100 parts), resin VIII (10 parts) and benzil dimethyl ketal (2 parts) are mixed at room temperature to give a clear solution. This is spread onto a surface of a metal tool previously coated with a silicone release agent, a 15-30 micrometer thick layer remaining. This is exposed to the radiation of a 400 W metal halide lamp which emits mainly at 365 nm for 2 minutes, the distance between the lamp and the coating being 20 cm. This exposure hardens the coating.

Place two layers of glass filament yarn mat, Vetrotex Unifilo U814, on the hardened coating and close the tool. (The words 'Vetrotex' and 'Unifilo' are registered trademarks). A mixture of resin IX (100 parts), xylene sulfonic acid (6.2 parts), 81% phosphoric acid (1.0 parts) and water (0.8 parts) is pumped into the closed tool, which is then on for 5 minutes 60 ° C is heated. The tool is opened and the shaped body formed is removed. This has a completely smooth and flawless coating on one side, which cannot be removed by mechanical attack.

Example 3

Resin I (60.75 g) and resin X (103.28 g) are heated together to 120 ° C. and the resulting molten mass is mixed with resin II (103.28 g), resin III (100.00 g), resin IV (20.38 g) and benzil dimethyl ketal (42.45 g), allow the mixture to cool to 80 ° C and add resin V (40.50 g).

Resin VI (72.90 g), resin III (43.00 g), dicyandiamide (43.74 g) and N- (4-chlorophenyl) -N ', N'-dimethylurea (43, 74 g) and passes the mixture through a three-roll mill.

The two mixtures are combined and spread onto a metal tool previously coated with a silicone release agent, resulting in a 30 to 40 micron thick coating. This is irradiated for 10 seconds under an 80 W / cm medium pressure mercury arc lamp at a distance of 220 mm. The coating thus obtained is hard and tack-free. Then two layers of a prepreg as used in Example 1 are applied, the structure is covered with a polytetrafluoroethylene film and evacuated in order to hold the film on the layers. The assembly is heated in the oven at 125 ° C for 1 hour and separated from the tool, which provides a hardened rigid body from which the coating cannot be removed.

Example 4

Resin XI (40.0 parts), Resin XII (3.0 parts), 2-hydroxyethyl methacrylate (1.0 part) and benzil dimethyl ketal (0.25 parts) are mixed at room temperature to a clear solution. This is spread onto a metal tool previously coated with a silicone release agent, a 20 micrometer thick coating remaining. This is irradiated for 20 seconds under an 80 W / cm medium-pressure mercury arc lamp at a distance of 220 mm in order to solidify the coating and make it tack-free.

A sheet-like molding compound is produced by adding 30 parts of cut glass filament with a cutting length of 50 mm to the solution used to form the coating, and applying the mixture thus obtained to a siliconized sheet of parchment paper, which results in a 20 micron thick film, which is covered with a second sheet of parchment and irradiated the entire assembly for 20 seconds on both sides with an 80 W / cm medium-pressure mercury arc lamp at a distance of 220 mm, whereby a fiber-reinforced, solid, thermosetting film is obtained, from which the parchment sheets are then removed.

Three layers of the sheet-like molding compound are placed on the solidified coating in the tool. The resulting structure is heated to 150 ° C. for 30 minutes and then separated from the tool, a hardened shaped body having a smooth, non-removable coating being obtained.