EP0194530A3

Method for controlling the plating rate in an electroless plating process

Abstract

Method for controlling plating in an electroless plating process. The plating rate is continuously monitored. The plating rate is compared with a set point plating rate. A control voltage is derived proportional to the difference in .plating rate and the desired plating rate, the integral of the difference, and the derivative of the difference. The control voltage is applied to a replenishment control for controlling the replenishment rate of a constituent chemical of the plating process.

EP0194530A3, drawing sheet 1
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Projected expiry passed 28 February 2006, 20.6 years ago.

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