Untitled record

• · I ■

6077 - 7 -

tester

The invention relates to a test device for testing electrical or electronic test objects according to the preamble of claim 1.

Such test devices are used to test populated and unpopulated printed circuit boards, chips, integrated circuits or the like. On electrical accuracy, by the contacting the test specimen 15th

at the same time electrically contacted at predetermined points and thereby electrical connections to the at least one assembled printed circuit board Prüfelelekt onik the test device manufactures, the

then in an extremely short time the test for electrical 20

Error-free. Then the

Test specimen replaced and another specimen of the same kind contacted in his place by the contacting and tested by the test electronics ^Become-

In a known test device of this type (DE-OS - US Pat.

32 11 410), the contacting device according to a

Raster arranged contact surfaces, ie pads on, the

on a main body of the contacting device 30

arranged and contacted by pins,

6077 - 8th -

They serve with their front ends to contact & Prüfligen and sit with their rear ends on the pads. The pads are connected via plug pins, sockets and flexible electrical lines with a measuring device arranged at a distance from the contacting device, which forms the test electronics. Since such a test device generally has a very large number of pads, usually several hundred to many thousands of pads, manually producing the many electrically conductive connections between the contacting and the test electronics is extremely time consuming and it can also easily lead to incorrect connections, the then again in a time-consuming procedure must be determined and corrected.

A It is therefore an object of the invention to provide a test device of the type mentioned in the preamble of claim 1, in which the production of the electrical connections between the contacting device and the test electronics are simple and quick, possibly e'ich semi-or fully automatic manufacture leaves.

This object is achieved by a test device according to claim 1.

By the or each terminal board directly to at least one associated printed circuit board, which is also referred to as a test board, the test elec tron ​​e, the Sn can the back of the Anschlußuöleiterplatte or anyone

6077 - 9 -

Anschlussleiterplette provided, electrically connected to pads of Anschlußleiterplette electrical connections that serve their connection s on the adjacent populated printed circuit board, ie the Prüfleiterplatte electrical connections are always sü QetFüffeFi be that each sülcfief

Connected to a located on the assembled printed circuit board associated connection comes to rest. In this way, particularly suitably the electrical connections of the terminal board either adjacent only one "wide side of the insulating plate of the associated test circuit board in a row at short intervals next to each other or even more expediently each of the two broad sides of the insulating plate of the respective test circuit board ever

Row of electrical connections of the

Be associated with the circuit board. At the respective broad side of the test circuit board can then be suitably also be arranged per row of electrical connections of the connection board depending on a number of electrical connections of the Prüfleiterplatte, the pitches of these two opposite rows of electrical connections can be the same, and each terminal of the connection board is doing the one associated with him, electrically connected to him or to be connected

Connection of the relevant test board opposite.

The electrical connections of the terminal board can by means of their insulating plate penetrating conductor tracks with the on the front of the

6077 - 10 -

Pad board arranged pads are electrically conductively connected, wherein each pad may be connected to a single associated electrical connection of the terminal circuit board.

The terminal board may preferably have a

be unpopulated Leiterplette, but it may be.

also be a populated printed circuit board. It is always referred to as a connection board. By contrast, the test circuit board is always a populated printed circuit board which belongs to the test electronics and not to the contacting device. On the other hand, the terminal board can always be assigned to the contacting device, even if its insulating board is a one-piece extension of the insulating board of a test board.

It is therefore in the further test board usually called test board, which is not the terminal board, but belongs to the test electronics.

The pads of the terminal board, which may also be referred to as electrical contact surfaces, may preferably have a square shape in plan view and be arranged side by side and one above the other at short intervals, preferably according to a predetermined grid in one or more rows. It is particularly convenient to arrange the pads in four or eight rows, but other arrangements are possible.

6077 - 11 -

Each pad may - but need not - be contacted by a contact pin or the like of the contacting device.

It can be in this way very quickly and easily called the electrical connections between the electrical connections - hereinafter referred to as short connections - the at least one connection board and the associated electrical connections below also called short connections - make at least one test board of the test electronics, preferably by soldering along each pair of adjacent adjacent rows of terminals of the terminal board and the associated test board whose terminals are to be electrically connected to each other, which can be done in a train by straight running by means of a soldering iron or other soldering device, the solder then only At the connections to be interconnected, adjacent connections are received. Other possibilities of rapid connections exist, for example, by welding or even easier in that each terminal of the terminal board is pressed against the associated terminal of the test board only in detachable contact, be it that this terminal is resiliently arranged on the terminal board or on the test board odef by these two ports are simply pressed frictionally against each other. You can then remove the connector board at any time and replace it with another connector board.

6077 - 12 -

The mechanical and / or electrical connection of the connecting circuit board with the at least one associated test printed circuit board can be made manually or semi-automatically or fully automatically, always with minimal effort in the shortest possible time. Also, high security against misconnections is achieved.

The contacting device may preferably be electrically connected to the test electronics only via connections arranged on the connection board or boards.

In view of the normally very large number of terminals per populated printed circuit board, it is expedient to extend each row of such terminals substantially over the length of the relevant narrow side of the insulating plate of the Prüfleiterplatte. Accordingly, the or each associated series of terminals on the terminal board can also extend substantially over the length of this narrow side of the adjacent Prüfleiterplatte. Advantageously Benders can thus correspond to the length of the connecting circuit board of the jagging narrow side of the insulating plate of the test circuit board.

It can be useful in many cases provide that the Padfeld located on the front of the AnschlußleiterpV extends approximately over the length of this connection board, which the formation of the

6o77 - 13 -

Terminal board penetrating, each pad with an associated terminal on the back of the terminal board connecting conductor tracks particularly simple. The number of pad rows on the front side of the terminal PCB can be any, preferably at least four.

In particular, when particularly small center distances of the pads are desired, it is expedient that the pad field extends only over a portion of the length of the AnschluBleiterplatte,. preferably at most 0.7 times its length, more preferably about 0.2 to 0.5 times its length. In this case, it may then be expedient to provide that the pads are arranged in a number of rows extending in the longitudinal direction of the terminal board, which is greater than four, preferably in eight to sixteen rows. It is again expedient, on each broad side is insulating plate of the test board adjacent to the relevant terminal board only to arrange a number of terminals, which series can extend substantially over the length of the respective narrow side of the Prüfleiterplatte so that their center distances not to be excessively small need. Adjacent to this row of terminals or adjacent to each such row of terminals is located on the back of the terminal board depending on a row of terminals, each terminal is connected to an associated pad. If the pads only over a portion of the length of the

Terminal board arranged frontally at her

6077 - 14 -

For example, if the pad array were to be spaced closer than the length and width of the front panel of the connector board, the pads on that connector board could be spaced closer together. Here it can be particularly advantageous to provide that the pads are arranged on the limited length range in more than four rows, as said preferably in eight to sixteen rows.

The terminal board may be formed as a separate part which is attached to at least one test board, preferably to a single test board at their respective narrow side. Preferably, this can be done in a form-fitting manner, wherein the connecting circuit board for the or each test printed circuit board particularly expediently has a longitudinal groove into which the insulating board of the relevant test circuit board is inserted in a form-fitting manner. As a result, exact location is secured and the electrical connections between the terminals of the terminal board and the terminals adjacent to these terminals of at least one test board are possible in the simplest way.

The test device may be a test board or a

Have a plurality of test circuit boards. If it has a plurality of test printed circuit boards, it can be provided that each test printed circuit board is assigned a respective connecting printed circuit board. However, it can be provided in many cases also appropriate

6077 - 15 -

be that at least two Prüfleiterplatten only a common single AnechluBleiterplatte is assigned. This is particularly possible if the electrical connections between the terminals of the Anschlußleiterplette and the Prüfleiterplatte done only by releasable contact, so no insoluble solder or welded joints of these connections are provided. However, this measure is to assign at least two test circuit boards a single terminal board, possibly to associate with each of the existing test boards a single terminal board, at least in some cases also possible, when the board terminals are non-detachably connected to the terminals of the test boards by welding, soldering or otherwise, especially if the spaces between the test boards are so provided . that in.-They can continue to make electrical connections of the connections located here by welding or soldering.

The contact pins, which contact the pads of the at least one terminal board, may have different training. In many cases, it may be appropriate spring contact pins and / or spring contact pins or the like. spring-supported so-called rigid pins uncT / or so-called buckling wires, which laterally deflect during axial compression and / or be wires or needles that have at least one lateral bulge, giving them special safe and simple axial

6077 - 16 -

Give suspension properties. All such pins serve as electrical conductors and therefore suitably consist entirely of metal.

The contact pins contacting the pads can either directly serve to contact specimens,

or it may also be provided in a manner known per se, in particular when the Kon.taktstifte contacting the Puds are spring contact pins, that their free from the pads free ends serve as an abutment for so-called rigid pins, which in

¹^ at least one plate are guided axially movable and are used to contact the specimens. Such rigid pins have the advantage that they are particularly easily arranged obliquely inclined to the longitudinal direction of the spring-supporting spring contact pins

²can, so that their free ends serving to contact specimens can be out of the grid, in which the pads and preferably also the spring contact pins contacting them in general

can be arranged appropriately. 25

The connections of the conductor tracks of the terminal board may be formed by the respective ends of the tracks themselves or these conductor tracks can be angeschlosn to the back of the terminal board arranged separate connections, for example. On short leaf springs, the frictional contacting of the example. As contact surfaces formed terminals of the relevant at least serve a test board.

~¹⁷~

In the drawings, embodiments of the invention are shown. Show it:

1 shows a test device gemäes an embodiment of the invention in a sectional side view,

Housing is not shown

Fig. 2 is a fragmentary plan view of the

Test device according to FIG. 1 likewise without housing,

3 shows a front view of the connection board

of the test apparatus according to FIGS. 1 and 2 in a broken representation,

_n 4 is a partial section through a test device according to a second embodiment of the invention, wherein also the housing is omitted,

"J. 5 shows a front view of the connecting circuit board of the test device according to FIG. 4.

The test apparatus 14 according to FIGS. 1 to 3 has a contacting device 10 for contacting _Q_ electrical or electronic specimens 11, such as printed circuit boards or the like., For the purpose of producing

6077 - 18 -

electrically conductive connections between its f »checkpoints and the test electronics carrying out the test 12. The test electronics 12 has in this embodiment, two populated Leiterpletten 13, 13 ', which are also referred to as Prüfleiterplatten 13, 13', on which all Examination of the respective test 11 serving circuits can be arranged. These test circuit boards 13, 13 'can be located together with a part of the contacting device 10 in a housing, not shown. Instead of the test electronics 12 having two test circuit boards 13, 13 ', they may also have only one such test board or more than two test circuit boards. The assembly of these test circuit boards 13, 13 'is not shown. Only a few of their connections 15 are shown with interconnects 16 connected.

The contacting device 10 has in this embodiment, a plurality of mutually parallel, fully extended spring contact pins 17 shown any conventional design, which are guided axially axially movable in two mutually parallel and perpendicular to them, held on a frame 21 support plates 19.

This contacting device 10 also has two

preferably unpopulated connection boards 22, 22 ', the metallic pad 24, ie electrical contact surfaces carry on its flat front side 23. At each such pad 24 may each have a metallic

Spring contact pin 17 abut. If the number of

6077 - 19 -

Spring contact pins 17 may be smaller than the number of pads, then only one of the number of spring contact pins corresponding number of pads to be contacted by a respective Federkontektstift 17 and the remaining pads 24 may be uncontacted.

Each of the two of an electrically insulating insulating plate 25, the pads 24 and connecting them with rear terminals 26 electrical conductor tracks, such as 27, existing terminal boards 22, 22 'is on each one of the two Prüfleiterplatten 13, 13' as shown in FIG characterized in that in each of the insulating plates depending on a length extending along its longitudinal groove is milled, into which the electrically insulating

Insulating plate 29 of the respective populated, for

Test electronics 12 belonging test circuit board 13 or 13 'positively immovable or not releasably inserted, so that the straight flat narrow side 28 of the insulating plate 29 and thus the relevant test board 13 and 13 "abuts the bottom of the respective longitudinal groove 44.

On the front side 23 or front side of each contacting device 10 associated terminal board 22 or 22 * ​​four rows of square pads 24 at short intervals next to each other according to a predetermined grid of a grid size of, for example. 0.5 to 2 mm are arranged in this embodiment. Other grid dimensions are possible. Their rear electrical connections 26 are in

6077 - 20 -

constant pitch arranged in two rows, which extend near the two broad sides of the insulating plate 29 of the associated test board 13 and 13 '. These terminals 26 may preferably be somewhat above the back side of the terminal board 22, 22 ', respectively, and preferably above this

Conductor cables 27 may be formed or ar, these conductor tracks 27 with them electrically conductively connected electrical connections 26, such as small resilient metal plate or the like. Be connected. Any such

ic terminal 26 is located on the terminal 26 adjacent broad side of the insulating plate 29 of the Prüfleiterplatte 13 or 13 'a example. As the end of a conductor 16 or trained as a different electrical contact electrical connection 15 without or at a small distance opposite, which two each other associated terminals 15 and 26 are electrically connected to each other, in this embodiment by soldering by means of a soldering point 30 formed thereby.

As a result, along the back of the

Insulating plate 25 of each terminal board 22 and 22 'both at a small distance from one broad side of the insulating plate 29 of the relevant test circuit board

OQ 13 or 13 'as well as in close proximity

whose other broad side j & a series of terminals 26, the via the insulating plates 25 penetrating conductor tracks 27 with the pads 24 on the front -1st terminal board 22 or 22 'electrically connected

gg are, each port 26 with one each

6077 - 21 -

associated pad 24. Each of these ports 26 is

with the adjacent terminal 15 on the 5th

relevant broad side of the test circuit board 13 or 13 'electrically connected by soldering. The number of solder joints in question thus corresponds to the number of connections 26 at the back of the

Terminal board 22 and 22 * ​​and accordingly also 10

the number of terminals 15 on the insulating plate of the associated test board 13 and 13 '. Since these solder joints 30 per connection board 22 and 22 'form a total of two straight rows of solder joints, you can extremely easy and fast by passing a soldering tool per row in each case make a train.

The two connection boards 22 and 22 'are with

the adjacent narrow longitudinal sides

The pads 24 on the front sides of these two connection printed circuit boards 22, 22 'together form a rectangular pad field 31 of a predetermined pitch.

Each spring contact pin 17 is made of metal and

forms an electrical conductor of low passage resistance.

If a candidate 11 is to be tested, he will be against

Here, vertically upwardly directed spring contact pins 17 pressed into a predetermined position or with a predetermined force, so that the existing spring contact pins his points to be contacted

contact and thereby electrical connections 35

6077 - 22 -

between these points of the specimen 11 and the test electronics 12 formed or formed by the two test circuit boards 13, 13 ', which then automatically performs the test of the specimen for accuracy, whereupon the specimen is removed again and another same specimen to JO the spring contact pins 17th pressed in the same same position and can also be tested, etc.

In Fig. 1 is still shown in phantom that 2g the contactor 10 may also be formed so that the spring contact pins 17, instead, as shown fully drawn, directly contacting the test pieces 11 are used, the resilient support of contacting the specimens 11 serving , so-called 2Q rigid pins 32, which are just thin needles made of steel or the like, which do not bend during operation. The single rigid pin 32 abuts its springy support on the head of an associated spring contact pin 17 and is slidably guided in holes of jjg two plates 33, 34 of a plate assembly 35 slidably. Oiese rigid pins 32 are axially rigid and do not bend laterally when contacting DUTs due to their multiple sliding.

₃q While the spring contact pins 17 are arranged appropriately in the grid of the pads 24, located in the left outer plate 34 holes for these rigid pins 32 need not be arranged in this grid, but can also grid out

_qF; be, so that then the respective rigid pins 32nd

6077 - 23 -

are inclined slightly obliquely to the longitudinal axis of the spring contact pins 17, as shown for some rigid pins 32. This makes it readily possible to contact the specimens 11 at locations that are not arranged in the grid of the spring contact pins 17 and the pads 24. If such a candidate too

IQ contact, it is pressed against the free tips of the rigid pins 32. Not all the spring contact pins 17 need to be equipped with a respective rigid pin 32, but only the spring contact pins which are connected via the contact pins 32 with electrical connectors.

each have to establish points to contact the respective test specimen. When such a specimen 11 is pressed against the free ends of the rigid pins 32, then these rigid pins 32 push the heads of the spring contact pieces 17 against the action of springs

2Q of these spring contact pins referred to in Fig. 1 down until the desired contact forces have set, with the rigid pins 32 press on the specimen 11 for safe electrical contact. Subsequently, the test electronics 12 performs the test

2g of the specimen 11 to electrical faultless.

Of course, it is also possible to arrange the pads 24 of the connecting circuit boards 22, 22 'already so that they correspond to the arrangement of the points to be ion-clocked - the test specimens in question, that is

at least some of the pads 24 are outside the grid applicable to the remaining pads 24. However, it is more favorable to arrange all the pads 24 in a common grid, which makes it possible to use these lead conductors. plates 22, 22 'for different specimens

6077 - 24 -

allows their places to be contacted so

w are distributed and arranged differently. you

■ '5 ■

then provides the contactor 10 only to the

'.. Positions with spring contact pins 17 or only with

• Rigid pins 32, if provided, where

Contact the relevant candidate

are. 10

In this embodiment, the entire pad field 31 of the contacting device 10 extends over the front sides of both Anschluiileiterplatten 22 and 22 ', ie approximately over the length and height of the front sides 23 of the abutting two connecting circuit boards 22, 22'.

While the insulating plate 29 of the test board 13th

or 13 'according to FIGS. 1 to 3 a single layer

20

may be, so may be a mono-layer plate,

is in the embodiment of Figures 4 and 5, the Prüfleiterplatte 13''eine multi-layer plate. In ■ this embodiment has its level

Insulating plate 29 'a total of four layers 36 to 39. Pie

nc.

Terminal board 22 '' is here now formed by the fact that the two upper layers 36, 37 at the one dash-dotted lines indicated narrow side 28 of the flat insulating plate 29 'at right angles upwards

angled and the two lower layers 38, 39 at

30

this straight narrow side right-angled down

are angled so that here is an over the length of the relevant narrow side of the flat insulating plate 29 * of the test board 13 * 'of

ι test electronics extending terminal board 22 ''

35

6077 - 25 -

the contacting device 10 results, whose perpendicular to the insulating plate 29 'extending, ^& also flat insulating plate 25 * of two layers

exists, the one-piece extensions of the laying 36 to 39 of the insulating plate 29 'are. The Anschlußleiterplette 22 '· is therefore also a

rtüxti-Leyöipläuue üfid stands uöiuäölcs uijvr the

Insulating plate 29 'about the same distance and can

preferably rectangular outline and overall approximately cuboid shape. As a result, the pad density of the pads 24 on the front side of this connection board 22 "can be increased,

in particular so that the pad field 31 does not extend remotely over the length of this Anschlußleiterplatie 22 '', but only over a portion of the length of its flat front side 23, preferably over a maximum of O, 7 times their length, especially

suitably over about 0.2 to 0.5 times this length. The narrow side 28 is not a physical surface, but an imaginary geometric plane at which the planar insulating plate 29 'in the plane perpendicular to her insulating insulating plate 25'

passes.

Both insulating plates 25 'and 29' may have rectangular outlines, but the insulating plate 29 'is generally much larger than the insulating plate 25'.

On the back of the terminal board 22 ''

is located at a small distance above the upper level of the insulating plate 29 'and close below the bottom of this insulating plate 29' each have a number of electrical connections 26, the associated with,

6077 - 26 -

they are electrically connected again by solder joints 30, namely such that the single terminal 15 of the test board 13 '' of the test electronics 12 with an associated terminal 26 of the terminal board 22nd '* _n is connected and all these connections are electrically isolated from each other.

In this way, both on the upper longitudinal half of the front side 23 of the terminal board 22 '' as well as on its lower 15th

Longitudinal half four pad rows or possibly even one

greater number of mutually parallel pad rows may be arranged, which pad rows extend in the longitudinal direction of the terminal board 22 '' over a central region thereof. All pads 24 of this total of eight pad rows can be arranged according to a predetermined grid.

In this embodiment, these will turn

square contact surfaces forming metallic 25

Pads 24 of so-called kink wires or crease needles

40 contacted, which also form contact pins. Each buckling needle 40 is straight in holes of two plates 41, 42 of a plate assembly 43 of the contacting device 10 and slightly laterally 30th

ausgebogan that under axial load each such buckling needle 40 in the direction of arrow A, this axially by lateral bending or buckling springs and the spring force on the contacted by her pad 24th

for producing safe electrical contact 35

6077 - 27 -

transfers. For this purpose, if necessary. These buckles may also be straight, if they are only guided so that they can bend out axieler load laterally for the purpose of axial suspension.

When testing test specimens, the respective test specimen is pressed against the free tips of the KnicknadRln 4Q and pushes them slightly to the right. Each such buckling needle 40 then forms an electrical conductor which electrically connects the relevant contacted location of the specimen with the respective pad 24 contacted by it, and from this pad 24 the electrical connection then continues via the conductor line 27 connected to it and the respective ones electrically connected to one another connected terminals 26, 15 to the respective input conductor 16 of the test board 22 * ​​'of the test electronics. While the pad field 31 shown in FIG. 5 extends only over a not too large portion of the much larger overall length of the front side 23 of the terminal board 22 * ​​', extending in FIG. 5 dashed lines indicated two rows 51 of the back of the terminal board 22 '' arranged connections 26 as well as the two rows of associated terminals 15 of the test board 13 '' practically over the entire length L of the terminal board 22''wie also over the entire length of the same long narrow side 28 of Test circuit board 13 '', which allows for this connection rows cheap, relatively large pitch. Each terminal 26 is connected through a through the insulating plate 25 'of the terminal board 22' 'guided conductor train 27 with an associated

6077 - 28 -

Pad 24 on the front of this insulating plate 25 'electrically connected. As a result, thus relatively large pad density is possible.

Instead, as shown, only a single such test board 13 * 'with associated terminal board 22 *' assign the test unit 14.

can also be several such Prüfleiterplatten 13''der Prüfelektronik with Anschlußleiterpiatten 22''angeordnet, which also expedient the AnschluQleiterplatten then in alignment with each other with their narrow adjacent longitudinal edges can be arranged adjacent to each other, so that they together in accordance with a larger Padfeld preferably one forming a common grid.

For the examination of a specimen in the plate assembly 43 need only be used as many bending needles 40, as the respective spring has to be contacted points, also here by appropriate arrangement of a part or all holes for the respective buckling pins or creasing needles 40 in the respective specimen adjacent foremost plate 41 and out of grid lying '* drs test specimens can be contacted.

For the electrical connection of a DUT to the

Test electronics this is pressed with its points to be contacted on the contact pins forming kinking needles 40 with sufficiently large force, so that these axially to exercise

• · · ■ · a · ■ t

6O77 - 29 -

sufficiently large contact forces are resiliently compressed slightly, and it is then made of each contacted test point of each test specimen electrical connection to the test electronics, which then makes the electrical test for accuracy.

It should be noted that, for example, everyone

Ftderkontaktstift 17 of FIGS. 1 and 2 may have a straight in a bore of the plate 19 with plain bearing play sleeve 46, in which

there is a compression spring, not shown, the 15th

a radially slidably mounted in the sleeve 46 gleitbai piston member 47 spring-loaded, which has a shaft 49 with a widened contact tip 50. Instead of such a spring contact pin can also

be provided a spring contact pin, the sleeve in the 20th

the plate 19 is fixedly arranged and in the sleeve then two axially rectilinear piston members are arranged, which may be loaded by the same compression spring and of which the one with the shaft

Contact tip and the other piston member one over 25

the sleeve to the rear projecting shaft or the like.

which is pressed against the associated pad 24. Other spring contact pins may also be provided, for example those with an over sleeve.

Also in the connection boards 22 and 22 * ​​after the

FIGS. 1 to 3 may, if desired, readily be provided that their pad fields 31 formed by the pads are similar or similar to that shown in FIGS

Pad 31 of the terminal board 22 '' of FIG. 35th

6Ο77 - 30 -

can only extend over a possibly relatively small portion of the lengths L of these connection boards 22, 22 *, as it makes the respective training of the candidates under test appropriate. It is therefore also possible here to provide that the pads 24 of each of the connecting circuit boards 22, 22 'extend, for example, only over 0.2 to 0.7 times the length L of these connecting circuit boards 22, 22' and the pads 24 then with correspondingly higher pad density in the corresponding shorter rows and, if necessary. are also arranged in more than four rows, so as to achieve correspondingly shorter distances between the points to be contacted of the respective specimens. However, the rear terminals 26 may be suitably arranged in at least one row, which extends approximately over the length L of the relevant terminal board 22 and 22 ', as the embodiment of FIG. 5 shows an example ^ accordingly.

These connecting circuit boards 22, 22 'according to FIGS. 1 to also have the advantage that they are readily detachable and thus replaceable on the associated test printed circuit boards

^ΛΟ can be arranged so that you can replace any such terminal board 22, 22 ', if desired, against another, preferably equal length terminal board with a different arrangement of the pads, however, the rear terminals 26 such other terminal boards 22, 22 * ​​as shown in FIGS. 1 to 3 may be arranged so that these terminals 26 with the unaltered terminals 15 of the

eon, - 31 -

unchanged test probes 29 can be electrically connected, so the back rows of terminals 26 any AnschluBleiterplatten and 22 'can always have the same pitch, which may suitably correspond to the division of the rows of terminals 15 of the Prüfleiterplatten 29. This makes it possible, the contactor 10 for DUTs different 'educations, among others

with respect to the arrangement of the pads 24 to make different and yet to be able to apply them to the remaining unchanged Prüfleiterplatten 29 can.

The connection boards 22, 22 'and 22 *' need at least often no external traces, but it is⁺, sufficient and advantageous for them, at least in many cases, to provide that the electrical connections between their pads 24 and the rear terminals 26 are formed only by copper or plated holes or dgl.der insulating plate 25 bzw.25'der the relevant printed circuit board forming Leiterzüya 27. However, if necessary, external circuit paths can also be provided or additionally provided.

The terminal board, such as 22, 22 'and 22' ', can also be called different, b & pw. as a connection board, connection plate, contact plate, stepping or interface plate or¹ like. _#