DE69033909D1
Packaging semiconductor chips
Abstract
This record has no abstract on file.
Term
Term ended
Expired 25 July 2010, 16.2 years ago.
- Priority
- Filed
- Granted
- Expired
- Today
9 members in 5 offices
Priority claims1
| Document | Office | Kind | Date |
|---|---|---|---|
| 8918482 | United Kingdom | A |
Members9
| Document | Office | Kind | |
|---|---|---|---|
| GB8918482D0 | United Kingdom | D0 | |
| EP0413451A2 | European Patent Office (EPO) | A2 | |
| JPH0382132A | Japan | A | |
| EP0413451A3 | European Patent Office (EPO) | A3 | |
| US5073816A | United States of America | A | |
| JP3066048B2 | Japan | B2 | |
| US6100581A | United States of America | A | |
| EP0413451B1 | European Patent Office (EPO) | B1 | |
| DE69033909D1This record | Germany | D1 |
1 legal event, as the office reported them to INPADOC
Events
| Event | Code | |
|---|---|---|
| No legal effect for de8332 | 8332 |
Numbers
- Application
- 69033909
Titles2
- English
- Pack of semiconductor chips
- German
- Packung von Halbleiterchips
Classification
- CPC, 7
- H10P74/273
- H10P74/23
- H10W76/157
- H10W70/60
- H10W90/00
- H10W90/754
- H10W72/5449
- IPC, 7
- H01L21 66
- H01L25 04
- H01L21 60
- H01L25 065
- H01L25 18
- H01L27 10
- H10W76 157