DE19829151C1

Electrical contacting of a conductive film, especially a heating layer for laminated automobile glazing, comprises connecting a collector bar to solder deposits by energy supply through the pane and-or an adhesive film on the thin film

Abstract

A conductive thin film on a glass pane is electrically contacted by connecting a collector bar (7) to solder deposits (5) by energy supply through the pane (1) and/or an adhesive film (2) covering the thin film (6). Electrical contacting of a conductive thin film on a glass pane, especially within a laminated glass pane, is effected by (a) depositing, especially with ultrasonic assistance, solder deposits (5) on one face of the pane (1); (b) applying the conductive thin film (6) to cover the deposits; (c) placing a collector bar (7), which can be connected with connection contacts, on the thin film at a predetermined position above the deposits; (d) applying an adhesive film (2) over the thin film and the pane surface; and (e) joining the collector bar with the deposits by means of energy supply through the pane and/or the adhesive film such that the thin film is disrupted at the soldering locations.

DE19829151C1, drawing sheet 1
Sheet 1 of 1

Term

Term ended

Expired 30 June 2018, 8.2 years ago.

  1. Priority and filed
  2. Granted
  3. Expired
  4. Today

9 claims: 4 independent, 5 dependent

  1. 1
    A method for electrically contacting at least one conductive thin layer on a glass window, in particular inside a laminated glass pane, comprising the steps of:a) on a surface of the glass pane ( 1 be), in particular with ultrasound support, multiple solder deposits ( 5 ) Soldered;b) the same glass surface, the conductive thin film ( 6 ) So on placed that they, the solder deposits ( 5 ) Covered;c) at least one connectable with terminals busbar ( 7 ) becomes on the thin film ( 6 ) In a predetermined position above the solder deposits ( 5 ) on set and, if necessary, temporarily fixed;d) at least one thin layer ( 6 ) And the area of ​​the glass pane ( 1 ) covering adhesive film ( 2 ) Is placed;e) the bus bar by means of the glass pane ( 1 ) And / or the adhesive sheet ( 2 ) Penetrating power supply with the solder deposits ( 5 ) Aufschmelzend ver inhibited, wherein the conductive thin film on the solder joints is at least partially is breached.
  2. 5
    The method according to any one of the preceding claims, characterized marked characterized in that the required energy for soldering by high-frequency Induction is supplied.
  3. 8
    The method according to any one of the preceding claims, characterized marked characterized in that the busbar between its to above the solder deposits fixed grading areas by adhesive means provisionally on the thin film becomes.
  4. 9
    A method according one of the preceding claims, characterized in net that the solder deposit on a surface of the glass pane at least partially, covering in particular its border color layer are soldered.