Vibrating diaphragm base material, preparation method thereof, vibrating diaphragm and loudspeaker

Diaphragm substrate and preparation method thereof, diaphragm and loudspeaker technical field

[0001] The present invention relates to the field of acoustic equipment, and in particular to a diaphragm substrate, a method for preparing the diaphragm substrate, a diaphragm prepared by using the diaphragm substrate, and a speaker with the diaphragm.

Background technique

[0002] At present, the diaphragm material is generally a single layer or composite material such as silicone rubber, thermoplastic elastomer (TPE), thermoplastic polyurethane elastomer rubber (TPU), etc. These polymer materials have a small elastic modulus and have relatively good elasticity. , Is more commonly used in the existing diaphragm preparation. However, because these polymer materials are not resistant to high temperatures, on some products, when the temperature rises to a certain level (the product continues to vibrate or does a reliability test), the product amplitude will become larger and larger, causing deviations, causing the product to sway , Which directly leads to product performance failure. Figure 1 is a graph showing the amplitude changes of 20ms and 500ms with the existing diaphragm material at different temperatures. 20ms and 500ms represent the different time used to test the same frequency phase interval of the existing diaphragm material. The longer the time, The more the number of vibrations, the higher the product temperature. From the figure, we can see that under the test conditions of 20ms and 50ms for the existing diaphragm materials, the amplitude of the same point on the product has a significant deviation.

Summary of the invention

[0003] In order to overcome the shortcomings of the prior art, one of the objectives of the present invention is to provide a diaphragm material with a small amplitude deviation at high temperature.

[0004] The second objective of the present invention is to provide a method for preparing a diaphragm material with a small amplitude deviation at high temperature.

[0005] The third object of the present invention is to provide a diaphragm made of a diaphragm material with a small amplitude deviation at high temperature.

[0006] The fourth object of the present invention is to provide a speaker with a diaphragm with a small amplitude deviation at high temperature.

[0007] One of the objectives of the present invention is achieved by adopting the following technical solutions: a diaphragm substrate, including a polymer material layer made of a polymer material and a porous damping material layer made of a porous damping material, the porous The damping material layer is embedded in the polymer material layer.

[0008] Further, the thickness of the polymer material layer is greater than the thickness of the porous damping material layer.

[0009] Further, the polymer material layer includes a first surface and a second surface disposed oppositely, and the porous damping material layer is disposed between the first surface and the second surface.

[0010] Further, the porous damping material layer has a first side surface close to the first surface, a second side surface disposed opposite to the first side surface and close to the second surface, and a second side surface from the first surface. A plurality of through holes penetrated from the side to the second side, the polymer material layer includes a first polymer material layer laminated on the first side surface, a second polymer material layer laminated on the second side surface, and A polymer material embedded layer embedded in the through hole.

[0011] Further, the first polymer material layer, the second polymer material layer and the polymer material embedded layer are integrally formed.

[0012] Further, the polymer material layer is made of at least one of silicone rubber, thermoplastic elastomer, thermoplastic polyurethane elastomer rubber, polyether ether ketone, and polyethylene terephthalate.

[0013] Further, the porous damping material layer is made of at least one of polyphthalamide and polyetherketone.

[0014] The second objective of the present invention is achieved by adopting the following technical solutions:

[0015] A method for preparing the aforementioned diaphragm substrate includes the following steps:

[0016] Prepare a polymer material substrate and a porous damping material substrate respectively;

[0017] The polymer material substrate and the porous damping material substrate are laminated and fixed together by high-temperature compression molding to make the diaphragm base material.

[0018] The third objective of the present invention is achieved by adopting the following technical solution: a diaphragm which is processed from the above-mentioned diaphragm base material.

[0019] The fourth object of the present invention is achieved by adopting the following technical solutions: a speaker including a magnetic circuit system, a vibration system, and a basin frame provided with a containing cavity, the magnetic circuit system and the vibration system are both contained in the containing cavity Wherein, the vibration system includes a diaphragm connected to the top of the basin frame, and the diaphragm adopts the above-mentioned diaphragm.

[0020] Compared with the prior art, the beneficial effects of the present invention are: (1) The porous damping material has higher structural strength and can inhibit the shrinkage of the polymer material, thus ensuring the use of the diaphragm substrate of the present invention. The product size remains consistent. (2) The diaphragm base material of the present invention can suppress and improve the performance variation of polymer materials under high temperature conditions. Therefore, the speaker and other products using the diaphragm base material of the present invention have a smaller amplitude deviation with the increase of temperature, which improves the product performance The stability.

Description of the drawings

[0021] FIG. 1 is a schematic diagram of the amplitude variation of the existing diaphragm material vibrating at different temperatures for 20ms and 500ms;

[0022] FIG. 2 is a schematic diagram of a three-dimensional structure of a diaphragm substrate provided by an embodiment of the present invention;

[0023] FIG. 3 is a front plan view of a diaphragm substrate provided by an embodiment of the present invention;

[0024] FIG. 4 is a schematic diagram of a cross-sectional structure of a diaphragm substrate provided by an embodiment of the present invention;

[0025] FIG. 5 is a schematic diagram of the vibration amplitude variation of the diaphragm substrate provided by the embodiment of the present invention for 20 ms and 500 ms at different temperatures;

[0026] FIG. 6 is an exploded schematic diagram of a polymer material substrate and a porous damping material substrate provided by an embodiment of the present invention after being laminated after high temperature molding;

[0027] FIG. 7 is a perspective view of a speaker according to an embodiment of the present invention;

[0028] FIG. 8 is a cross-sectional view of AA in FIG. 7.

[0029] In the figure: 1. Diaphragm substrate; 11, polymer material layer; 111, first polymer material layer; 112, second polymer material layer; 113, polymer material embedded layer; 116, first Surface; 117, second surface; 12, porous damping material layer; 121, through holes; 122, first side; 123, second side; 101, polymer material substrate; 102, porous damping material substrate; 20, speaker; 21. Magnetic circuit system; 211. Magnetic frame; 212. Permanent magnet; 213. Pole core; 22. Vibration system; 221. Diaphragm; 222. Voice coil; 23. Basin frame.

Detailed ways

[0030] In the following, the present invention will be further described with reference to the drawings and specific implementations. It should be noted that, provided that there is no conflict, the following embodiments or technical features can be arbitrarily combined to form newof Examples. Example.

[0031] As shown in FIGS. 2-5, a diaphragm substrate 1 provided by an embodiment of the present invention includes a polymer material layer 11 made of a polymer material and a porous damping material made of a porous damping material group. The layer 12 and the porous damping material layer 12 are embedded in the polymer material layer 11. Because the porous damping material layer 12 is added to the diaphragm substrate 1 of this embodiment, the porous damping material

It has high structural strength and can inhibit the shrinkage of polymer materials, so it can ensure that the size of the product made by using the diaphragm substrate 1 of this embodiment maintains consistency, and the diaphragm substrate 1 of this embodiment can suppress the The performance variation of polymer materials under high temperature conditions is improved. Therefore, the amplitude of the speakers and other products using the diaphragm substrate 1 of the present embodiment is smaller with the increase in temperature, which improves the performance stability of the product.

[0032] Preferably, the thickness of the polymer material layer 11 is greater than the thickness of the porous damping material layer 12. The polymer material layer 11 includes a first surface 116 and a second surface 117 that are disposed oppositely. In this embodiment, the porous damping material layer 12 is entirely embedded in the polymer material layer 11 and is located between the first surface 116 and the second surface 117.

[0033] In this embodiment, the porous damping material layer 12 has a first side surface 122 close to the first surface 116, a second side surface 123 disposed opposite to the first side surface 122 and close to the second surface 117, and a second side surface 123 from the first side surface. 122. A plurality of through holes 121 penetrated to the second side surface 123. The polymer material layer 11 includes a first polymer material layer 111 laminated on the first side surface 122 and a second polymer material layer 112 laminated on the second side surface 123. And the polymer material embedded layer 113 embedded in the through hole 121. Among them, the first polymer material layer 111, the second polymer material layer 112 and the polymer material embedded layer 113 are made of the same material and are integrally formed, and the manufacturing process is simple. In this embodiment, the polymer material layer 11 penetrates through the through holes 121 and forms a laminated layer on both sides of the porous damping material layer 12 respectively. As an alternative embodiment, the polymer material layer 11 may be arranged in the following manner: The polymer material layer 11 may also only include the first polymer material layer 111 laminated on the first side 122 and the polymer material embedding layer 113 embedded in the through hole 121, wherein the polymer material embedding layer 113 may just penetrate through The hole 121, that is, the second surface 117 is flush with the second side surface 123, or the polymer material embedded layer 113 may not penetrate the through hole 121, that is, the second surface 117 is located in the through hole 121.

[0034] Preferably, the polymer material layer is made of silicone rubber, thermoplastic elastomer (TPE), thermoplastic polyurethane elastomer rubber (TPU), polyether ether ketone (PEEK), polyethylene terephthalate (PET) Made of at least one of these polymer materials, these polymer materials have a small elastic modulus and have relatively good elasticity.

[0035] Preferably, the porous damping material layer is made of at least one of polyphthalamide and polyetherketone. These porous damping materials have high structural strength and can inhibit the performance of polymer materials at high temperatures. Mutations.

[0036] FIG. 5 is a diagram of the vibration amplitude variation of the diaphragm substrate 1 of this embodiment at different temperatures for 20ms and 500ms, respectively. 20ms and 500ms represent the same frequency phase interval for testing the diaphragm substrate 1 of this embodiment. Different time used. From the figure, we can see that under the test conditions of 20ms and 50ms for the diaphragm substrate 1 of this embodiment, the amplitude deviation of the same point on the product is small.

[0037] This embodiment also provides the above-mentioned preparation method of the diaphragm substrate 1, including the following steps:

[0038] Prepare the polymer material substrate 101 and the porous damping material substrate 102 respectively;

[0039] The polymer material substrate 101 and the porous damping material substrate 102 are laminated and fixed together by high-temperature compression molding to form the diaphragm base material 1.

[0040] In this embodiment, as shown in FIG. 6, the number of the polymer substrate 101 and the porous damping material substrate 102 is one, and the thickness of the polymer substrate 101 is greater than the thickness of the porous damping material substrate 102. First, the polymer material substrate 101 is laminated on the first side 122 of the porous damping material substrate 102, and then high-temperature molding is performed. The polymer material is embedded in the through holes 121 of the porous damping material substrate 102 to form a polymer material embedded layer 113 The polymer material still laminated on the first side 122 of the porous damping material substrate 102 forms the first polymer material layer 111, and the porous damping material substrate 102 forms the porous damping material layer 12. When the thickness of the polymer substrate 101 is large enough, after long-term high-temperature molding, the polymer material will be embedded and penetrate the through hole 121, forming a second polymer material layer 112 on the second side 123 of the porous damping material substrate 102 . In this embodiment, the first side 122 of the porous damping material substrate 102 and the first side 122 of the porous damping material layer 12 are

One side 122 is the same, and the second side 123 of the porous damping material substrate 102 is the same as the second side 123 of the porous damping material layer 12.

[0041] The diaphragm provided in this embodiment is processed from the aforementioned diaphragm substrate 1. Since the diaphragm base material 1 is used for processing, the amplitude of the diaphragm has a small deviation with the increase in temperature, and the performance of the product is relatively stable. Processing the diaphragm substrate 1 to form a diaphragm may specifically include processing operations such as cutting, stamping and forming the diaphragm substrate 1.

[0042] As shown in FIGS. 7-8, the speaker 20 provided by this embodiment includes a magnetic circuit system 21, a vibration system 22, and a basin frame 23 provided with a housing cavity. The magnetic circuit system 21 and the vibration system 22 are both contained in the housing. In the cavity, the vibration system 22 includes a diaphragm 221 connected to the top of the basin frame 23, and the diaphragm 221 adopts the diaphragm provided in this embodiment. The first polymer material layer 111 or the second polymer material layer 112 is located on the side of the diaphragm 221 close to the frame 23. In a preferred embodiment, the magnetic circuit system 21 includes a magnetic frame 211 connected to the bottom of the basin frame 23, a permanent magnet 212 accommodated in the magnetic frame 211, and a pole core 213 fixed on the top of the permanent magnet 212. The permanent magnet 212 The bottom of the diaphragm is fixed to the magnetic frame 211, the vibration system 22 includes a diaphragm 221 connected to the top of the basin frame 23 and a voice coil 222 arranged at the bottom of the diaphragm 221 and located in the receiving cavity. The voice coil 222 is generated in the magnetic circuit system 21 It moves under the action of the magnetic field, thereby driving the diaphragm 221 to vibrate up and down.

[0043] The above-mentioned embodiments are only preferred embodiments of the present invention, and cannot be used to limit the scope of protection of the present invention. Any insubstantial changes and substitutions made by those skilled in the art on the basis of the present invention belong to The scope of protection claimed by the present invention.