Radiator assembly and manufacture thereof

Heat sink assembly and manufacturing method thereof

The present invention generally relates to a device and method for fastening electrical components to a heat sink, which can dissipate heat. More specifically, the present invention relates to a spring clip and a heat sink assembly and a manufacturing method, the arrangement of which can fasten the heat sink to an electronic device component and realize heat communication with it.

With the advancement of microelectronics technology, people tend to develop some device integrated circuits that can perform more electronic functions while occupying less natural space. In general, the integrated circuit is installed in some housings for use in order to protect the integrated circuit from the environment, and at the same time provide some ways to realize the input/output communication between the integrated circuit and the external circuit. As people have been constantly working towards miniaturization, more heat is generated in less physical space, and at the same time, fewer structures are used to remove heat from the package. Similarly, in the development of circuit device integrated circuits using compound semiconductors, higher requirements have been put forward on the packaging problem. They should be able to accommodate some devices that can work under high temperature conditions, and they should be able to dissipate heat to the devices. The temperature is controlled.

In order to guide heat from the integrated circuit to the outside of the package, many device packages include a heat transfer medium with high thermal conductivity, which communicates heat with the integrated circuit, and has a heat dissipation surface that is close to the package body. surface. Other packages only transfer heat through the package itself. However, in order to dissipate heat from the package body, an external heat sink must be connected to the device package body. Generally, the heat sink is a material body such as metal, which has high thermal conductivity. The heat sink usually has at least one flat surface for positioning with the adjacent surface of the device package, and may also include many fins, pins or other structures to dissipate heat to the surrounding atmosphere.

In order to improve efficiency, the heat sink must occupy as little space as possible, while at the same time dissipating the greatest amount of heat energy. It is also hoped that the heat sink can be easily connected to the device package and can be removed from the package at the same time, and they can also be connected to various different types of device packages. When a large number of devices are used in the assembly process, from an economic point of view, people hope that the assembly process, including the assembly of the heat sink, is simple, automatic, versatile, and reliable. Therefore, it is not acceptable to fix the heat sink by adhesives, screws, bolts and similar connection methods, and it is better to connect by simple methods such as clips, because this connection is quicker and easy. achieve.

In US Patent No. 5,208,731 entitled "Heat Dissipating Assembly", a clip is shown for fixing the heat sink so as to transfer heat to the heat generating mechanism package. The clip disclosed in this patent has a complicated structure and is expensive to manufacture. In addition, compared with the present invention, the assembly process of the clip is more complicated.

The purpose of the present invention is to provide a device and method for the above-mentioned problems and aspects.

A heat sink assembly of the present invention includes: a. A set of heat sinks, which includes a main body part made of a thermally conductive material, the main body part having at least one flat first main surface, and a first main surface A second main surface with parallel surfaces, and a groove on the second main surface, the groove extending parallel to the first main surface; and

b. An installation mechanism, which has an elongated central body and first and second ends, the central body being placed and fastened to the protruding part by means of the protrusion formed by the deformation of the main body In the groove, the protrusion protrudes in the groove, the protrusion covers the elongated central body in the groove, and the end of the mounting mechanism extends from its opposite ends Reach out.

The method of manufacturing a heat sink assembly of the present invention, the assembly includes a heat sink and a spring clip, which includes the following steps: a. preparing a heat sink, which has first and second main surfaces opposed to each other; b. A groove is formed on the second main surface, and the main surface is parallel to the first main surface; c. Positioning the central body of the spring clip extending in the axial direction, the spring clip having an end, The end portion extends in the opposite direction from the axis of the central body located in the groove; and d. deforming the portion of the heat sink adjacent to the groove toward the groove direction, so as to form a protrusion, The spring clip is covered in the groove.

According to the present invention, a heat sink assembly is provided, in which a simple spring clip is used to connect the heat sink to a socket, bracket or other connection support, thereby fixing the heat sink to a device package body . The spring clip includes a long central body that passes through a surface of the heat sink and is placed in a groove or hole on the surface. The central body is permanently pivotally connected to the groove or In the hole, the end of the spring clip thus protrudes from the heat sink, which can be used to fasten the heat sink to the connecting support, which supports the device package. However, since the spring clip is permanently fixed in the heat sink, the heat sink and the spring clip can be handled as an integral part. During the assembly process, the number of loose parts and the assembly steps are reduced. The combination of the present invention can take various forms and is suitable for use in various assembly operations. Because the spring clip is fastened to the heat sink, the assembly process is simplified, the cost is reduced, and the reliability is improved. The other features and advantages of the present invention will be improved through the following description of the claims and drawings. For clarity.

Figure 1 is an exploded view of the assembly, which includes a device package, a connection bracket, and a preferred heat sink and spring clip assembly of the present invention.

Figure 2 is a perspective view of the assembly shown in Figure 1.

Fig. 3 is a partial cross-sectional view of the heat sink and spring clip assembly taken along the type 3-3 of Fig. 1.

FIG. 4 is a perspective view of the spring clip in the assembly shown in FIG. 1. FIG.

A component, which describes a preferred embodiment of the present invention, in FIG. 1 and FIG. 2, the component is combined with an electronic device package 10 and a mounting bracket 11. As shown in the figure, the assembly 20 includes a heat sink 21 and a spring clip 30 connected to it. The heat sink 21 includes a main body 22 made of a thermally conductive material, such as aluminum, aluminum alloy, copper or the like. The main body has at least one flat first main surface 25 and a Slender pin 23. In this preferred embodiment, the pin 23 is formed by vertically cutting parallel fins, and the fins are formed by extrusion or by sawing a number of parallel grooves on the main body 22. of. No matter which manufacturing method is adopted, the main body 22 has at least a set of mutually parallel grooves or channels 24, which extend along the first direction to form a set of fins, which can radiate heat from the main body 22 to the surrounding atmosphere go with.

The preferred embodiment of the mounting mechanism is a spring clip 30, which has an elongated central body 31, thereby defining a main axis. The central body has two ends 32 and 33, which are perpendicular to the central body. The axis of the portion 31 extends in substantially opposite directions, thereby forming a substantially Z-shaped device. The spring clip 30 can be made of any suitable material, but it should be soft and elastic. For example, it can be a rod or thick wire made of steel, aluminum or similar materials.

As shown in FIGS. 1 and 3, the central body 31 of the spring clip 30 is placed in a groove 24a. The groove 24a can be one of the parallel channels 24 or a narrow channel located at the bottom of a channel 24, which has sufficient depth to accommodate the elongated central body 31 of the spring clip 30 . The end portions 32, 33 are respectively located on two opposite sides of the main body portion 22, and the central body portion 31 is blocked in the groove 24a, that is, the main body portion 22 close to the groove 24a is deformed, thereby forming a groove extending into the groove 24a. The protrusions 22a cover the central body 31, as shown in FIG. 3. It should be understood that the portion 22a that needs to be deformed in order to cover the central body portion 31 is very small, because the stress applied to the deformed protrusion 22a is very small. As for the formation of the protrusion 22a, for example, a mold tongue or the like may be used to pull a part of the inner side wall of the groove 24a inward. As described above, since the center portion is covered, the spring clip 30 can be supported in the groove 24a and be permanently fixed therein.

1 and 2 show a method of connecting a heat sink to an electronic device package by using the assembly 20. In this embodiment, the bracket 11 has a central opening 12 and a set of uneven edges 13 by which the device package 10 can be supported by the periphery. It should be understood that the function of the bracket 11 is only to provide a means for fixing the heat sink to the device package body, so it can be in any form, mainly depending on the shape of the package body 10. For example, the bracket 11 may only receive the corners of the package body 10, or adopt a shoe shape or a clip shape to connect it with the peripheral portion of the device package body. Regardless of the actual arrangement of the bracket 11, it has means for receiving the ends 32, 33 of the spring clip 30. In this embodiment, the bracket 11 has two protrusions 14 which are located near the two corners of the diagonal line and extend laterally outward from the two opposite sides. As shown in Figures 1 and 2, the device package 10 is placed in the bracket 11, the flat surface 25 of the heat sink is located near the upper surface of the device package 10, and the ends 32, 33 are pressed against the protrusions 14 of the bracket 11. , You can fix the components together.

It is believed that as long as the spring clip 30 in the main part 22 of the heat sink is fastened, the assembly 20 can be installed together as an integral part. By fixing the parts together, many loose parts can be eliminated. It is troublesome, and the connection between the component 20 and the device package is extremely simple, and even automated assembly can be highlighted. It should also be recognized that if the electronic device is located in the mounting device, such as a socket, etc., the bracket 11 can also be completely omitted, and the socket can be provided with a portion like the protrusion 14 to allow the end of the spring clip to be received. 32, 33, so that it can be placed in the installation device or in the groove under the installation device. With the assembly of the present invention, there are various ways to fix the end of the spring clip to the mounting device.

Although the description of the present invention is directed to a Z-shaped spring clip, and the spring clip is connected to a bracket, this form is only used to illustrate the principle of the present invention. The spring clip 30 can also take various other shapes, as long as it can be fastened to a heat sink. Naturally, it should also be understood that the details of the present invention described in the figures and in the text are merely examples, and various changes, modifications, and modifications can be made without departing from the principles and scope defined by the claims. cloth.