Light emitting diode package having interconnection structures

Technical field of light-emitting diode packaging structure

[0001] The present invention relates to a light-emitting diode packaging structure, in particular to a light-emitting diode packaging structure that is convenient for multiple light-emitting diodes to realize different circuit connections.

Background technique

[0002] Generally, in a package structure with multiple light-emitting diode chips, in order to realize a series or parallel circuit connection between the multiple light-emitting diode chips, it is necessary to connect the bonding pads of the light-emitting diode chips in the manner of metal wire bonding.

[0003] As shown in FIGS. 1-2, a prior art light-emitting diode packaging structure 1 includes a substrate 10, a first light-emitting diode chip 11, a second light-emitting diode chip 12, a plurality of metal wires 13, and a protective layer 14. Each LED chip includes a positive electrode pad and a negative electrode pad (not labeled). The substrate 10 includes a mounting area 109, a first electrode 101 and a second electrode 102. The mounting area 109 is defined at the center of the substrate 10. The first electrode 101 and the second electrode 102 are respectively disposed on opposite sides of the mounting area 109. The first light emitting diode chip 11 and the second light emitting diode chip 12 are arranged in the mounting area 109 of the substrate 10. The positive electrode pad of the first light-emitting diode chip 11 is connected to the first electrode 10L through a metal wire 13. The negative electrode pad of the first light-emitting diode chip 11 is connected to the positive electrode of the second light-emitting diode chip 12 through a metal wire 13 pad. The negative electrode pad of the second light emitting diode chip 12 is connected to the second electrode 102 through a metal wire 13. The protective layer 14 covers part of the substrate 10, the first light emitting diode chip 11, the second light emitting diode chip 12 and a plurality of metal wires 13. In this way, the first and second light-emitting diode chips 11 and 12 of the light-emitting diode packaging structure 1 are connected in series between the first electrode 101 and the second electrode 102, and the equivalent circuit is shown in FIG. 3.

[0004] However, due to electrostatic discharge, the bonding pads of the first and second light-emitting diode chips 11 and 12 are more likely to be broken down or damaged when the circuit is connected by metal wire bonding. The reliability of the light emitting diode packaging structure 1 is reduced. In addition, since the positions of the bonding pads of the first and second light-emitting diode chips 11 and 12 are higher than the positions of the first electrode 101 and the second electrode 102 on the substrate 10, the first and second electrodes are connected according to the metal wire bonding process. The metal wires 13 of the bonding pads of the two light-emitting diode chips 11 and 12 also relatively need to occupy a higher space, that is, the height Η marked in FIG. 2, which also increases the overall thickness of the light-emitting diode package structure 1 correspondingly, which is different from the prior art. The trend of thinner and lighter packaging structures is inconsistent.

Summary of the invention

[0005] In order to solve the problems of large thickness and low reliability of the prior art light-emitting diode packaging structure, it is necessary to provide a light-emitting diode packaging structure with a small thickness and high reliability.

[0006] A light-emitting diode packaging structure includes a substrate, a first light-emitting diode chip, a second light-emitting diode chip, and a plurality of metal wires. Each light-emitting diode chip includes a positive electrode pad and a negative electrode pad. The substrate includes a first electrode, a second electrode, a third electrode, a fourth electrode, and an interconnecting electrode. A square area at the center of the upper surface of the substrate is defined as the installation area. The first light-emitting diode chip and the second light-emitting diode chip are sequentially arranged in the mounting area. The first electrode to the fourth electrode are respectively arranged at four corners outside the substrate mounting area and exposed on the upper surface of the substrate. The interconnection electrode is embedded in the substrate and electrically connects the second electrode and the third electrode. The first and second LED cores

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The four bonding pads of the sheet are respectively connected to the first electrode to the fourth electrode, and the four bonding pads of the first and second light-emitting diode chips are not directly interconnected.

[0007] A light-emitting diode package structure includes a substrate, a first light-emitting diode chip, a second light-emitting diode chip, a plurality of metal wires, and a protective layer. Each light-emitting diode chip includes a positive electrode pad and a negative electrode pad. The substrate includes a first electrode, a second electrode, a third electrode, a fourth electrode, a fifth electrode, a sixth electrode, a first interconnection electrode and a second interconnection electrode. A square area at the center of the upper surface of the substrate is defined as a mounting area, and the first light-emitting diode chip and the second light-emitting diode chip are sequentially arranged in the mounting area. The first to fourth electrodes are respectively disposed at four corners outside the substrate mounting area and exposed on the upper surface of the substrate, and the fifth electrode and the sixth electrode are located on opposite sides of the mounting area and exposed on the substrate. On the upper surface, the first interconnection electrode is embedded in the substrate and electrically connects the first electrode and the third electrode, the second interconnection electrode is embedded in the substrate and electrically connects the second electrode and the fourth electrode, the first, The four bonding pads of the second light emitting diode chip are respectively connected to four of the first electrode to the sixth electrode, and the four bonding pads of the first and second light emitting diode chips are not directly interconnected.

[0008] Compared with the prior art, the bonding pads of the first and second light-emitting diode chips of the above-mentioned light-emitting diode packaging structure are directly connected to the electrodes of the substrate, and the first and second light-emitting diode chips are no longer connected by metal. Because of the wire connection, the above-mentioned light-emitting diode package structure has high reliability and a thinner thickness.

<td colspan="3">Description of the drawings</td>

<td>[0009]</td><td colspan="2">Fig. 1 is a top view of a prior art light emitting diode packaging structure.</td>

<td>[0010]</td><td colspan="2">FIG. 2 is a schematic cross-sectional structure diagram of the light-emitting diode package structure shown in FIG. 1.</td>

<td>[0011]</td><td colspan="2">Fig. 3 is an equivalent circuit diagram of the light emitting diode package structure shown in Fig. 1.</td>

<td>[0012]</td><td colspan="2">4 is a top view of the light emitting diode package structure of the first embodiment of the present invention.</td>

<td>[0013]</td><td colspan="2">FIG. 5 is a schematic cross-sectional structure diagram of the light-emitting diode package structure shown in FIG. 4.</td>

<td>[0014]</td><td colspan="2">Fig. 6 is an equivalent circuit diagram of the light emitting diode package structure shown in Fig. 4.</td>

<td>[0015]</td><td colspan="2">FIG. 7 is a three-dimensional exploded perspective view of a substrate used in the light-emitting diode packaging structure shown in FIG. 4.</td>

<td>[0016]</td><td colspan="2">Fig. 8 is a top perspective view of a light emitting diode package structure according to a second embodiment of the present invention.</td>

<td>[0017]</td><td colspan="2">FIG. 9 is an exploded perspective view of the three-dimensional structure of the substrate used in the light-emitting diode packaging structure shown in FIG. 8.</td>

<td>[0018]</td><td colspan="2">Fig. 10 is a top perspective view of a light emitting diode package structure according to a third embodiment of the present invention.</td>

<td>[0019]</td><td>Symbol description of main components</td><td></td>

<td>[0020]</td><td>Light emitting diode packaging structure</td><td>1、2、3、4</td>

<td>[0021]</td><td>Substrate</td><td>10、20、30</td>

<td>[0022]</td><td>First light-emitting diode chip</td><td>11、21、31</td>

<td>[0023]</td><td>Second light emitting diode chip</td><td>12、22、32</td>

<td>[0024]</td><td>Metal wire</td><td>13、23、33</td>

<td>[0025]</td><td>The protective layer</td><td>14、24、34</td>

<td>[0026]</td><td>Mounting plate</td><td>25、35</td>

<td>[0027]</td><td>Wiring layer</td><td>26</td>

<td>[0028]</td><td>First wiring layer</td><td>36</td>

<td>[0029]</td><td>Second wiring layer</td><td>37</td>

<td>[0030]</td><td>Support plate</td><td>28^38</td>

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<td>[0031]</td><td>Installation area</td><td>109、259、359</td>

<td>[0032]</td><td>First electrode</td><td>101、201、301</td>

<td>[0033]</td><td>Second electrode</td><td>102^202^302</td>

<td>[0034]</td><td>Third electrode</td><td>203^303</td>

<td>[0035]</td><td>Fourth electrode</td><td>204^304</td>

<td>[0036]</td><td>Internal electrode</td><td>261</td>

<td>[0037]</td><td>First interconnected electrode</td><td>361</td>

<td>[0038]</td><td>Second interconnecting electrode</td><td>362</td>

<td>[0039]</td><td>Third interconnecting electrode</td><td>373</td>

<td>[0040]</td><td>First through hole</td><td>25Κ351</td>

<td>[0041]</td><td>Second through hole</td><td>282^372</td>

<td>[0042]</td><td>Third through hole</td><td>383</td>

Detailed ways

[0043] Referring to FIGS. 4-5, the light-emitting diode package structure 2 of the first embodiment of the present invention includes a substrate 20, a first light-emitting diode chip 21, a second light-emitting diode chip 22, a plurality of metal wires 23, and a protective layer 24. Each LED chip 21.22 includes a positive electrode pad and a negative electrode pad (not labeled).

[0044] The substrate 20 is approximately rectangular in shape, and includes a first electrode 201, a second electrode 202, a third electrode 203, a fourth electrode 204, an interconnecting electrode 261, and a mounting area 259. The mounting area 259 is defined as a square area at the center of the upper surface of the substrate 20. The first to fourth electrodes 201 to 204 are respectively disposed at four opposite corners of the installation area 259. Both the first electrode 201 and the fourth electrode penetrate the upper and lower surfaces of the substrate 20 and protrude from the lower surface of the substrate 20. Only one end of the second electrode 202 and the third electrode 203 penetrates the upper surface of the substrate 20. The interconnection electrode 261 is embedded in the substrate 20 for electrically connecting the second electrode 202 and the third electrode 203.

[0045] The first light emitting diode chip 21 and the second light emitting diode chip 22 are sequentially arranged in the mounting area 259. The anode pad of the first light emitting diode chip 21 is connected to the first electrode 201 through a metal wire 23. The negative electrode pad of the first light emitting diode chip 21 is connected to the second electrode 202 through a metal wire 23. The anode pad of the second light emitting diode chip 22 is connected to the third electrode 203 through a metal wire 23. The negative electrode pad of the second light emitting diode chip 22 is connected to the fourth electrode 204 through a metal wire 23. The protective layer 24 covers part of the substrate 20, the first light emitting diode chip 21, the second light emitting diode chip 22 and a plurality of metal wires 23.

[0046] In this way, the first and second light-emitting diode chips 21.22 of the light-emitting diode package structure 2 are mounted on the first electrode

201 and the fourth electrode 204 form a circuit connection in series, and the equivalent circuit is shown in FIG. 6.

[0047] FIG. 7 is a three-dimensional exploded perspective view of the substrate 20 used in the light-emitting diode packaging structure 2. The substrate 20 further includes a mounting board 25, a wiring layer 26, and a supporting board 28 stacked in sequence. In this embodiment, the mounting plate 25 and the supporting plate 28 are both rectangular ceramic substrates. The wiring layer 26 is rectangular and has the same size as the mounting board 25 and the supporting board 28.

[0048] The mounting board 25 includes four first through holes 251. The installation area 259 is defined at the center of the upper surface of the installation board 25. The four first through holes 251 are respectively disposed at four opposite corners of the installation area 259.

[0049] The first to fourth electrodes 201 to 204 and the interconnection electrode 261 are all disposed on the wiring layer 26. The first to fourth electrodes 201 to 204 are located at the four corners of the wiring layer 26 and correspond to the four first through holes 251 respectively. The first

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The electrode 201 and the fourth electrode 204 are located at two opposite corners of the wiring layer 26, and the second electrode 202 and the third electrode 203 are located at the other two opposite corners of the wiring layer 26. The interconnection electrode 261 is electrically connected to the second electrode 202 and the third electrode 203.

[0050] The support plate 28 includes two second through holes 282. The second through holes 282 corresponding to the first electrode 201 and the fourth electrode 204 are provided at two opposite corners of the supporting plate 28.

[0051] During assembly, the lower surface of the mounting board 25 and the upper surface of the wiring layer 26 are close to and aligned with each other, so that the first to fourth electrodes 201 to 204 respectively pass through the first through hole 251 and then are exposed to The upper surface of the mounting board 25 facilitates the use of metal wires 23, such as gold wires, to respectively connect the four bonding pads of the first and second light-emitting diode chips 21.22. In this embodiment, the top surfaces of the first to fourth electrodes 201 to 204 are flush with the top surface of the mounting board 25. Then, the upper surface of the support plate 28 and the lower surface of the wiring layer 26 are close to and aligned with each other, so that the first electrode 201 and the fourth electrode 204 pass through the second through hole 282 and are exposed and protrude below the support plate 28. The surface is used as an electrode for connecting the light emitting diode package structure 2 with other external circuits. Finally, the mounting board 25, the wiring layer 26, and the supporting board 28 are combined into a solid overall structure by low-temperature co-firing.

[0052] Since the bonding pads of the first and second light-emitting diode chips 21.22 of the light-emitting diode package structure 2 are directly connected to the electrodes 201 to 204 of the substrate 20, the light-emitting diode chips 21.22 are no longer connected by metal wire bonding. Therefore, the light-emitting diode packaging structure 2 has high reliability and a thinner thickness.

[0053] Referring to FIGS. 8-9, the light-emitting diode package structure 3 of the second embodiment of the present invention includes a rectangular substrate 30, a first light-emitting diode chip 31, a second light-emitting diode chip 32, a plurality of metal wires 33, and a protective layer 34 . Each LED chip 31.32 includes a positive electrode pad and a negative electrode pad (not labeled).

[0054] As shown in FIG. 9, the substrate 30 includes a mounting board 35, a second wiring layer 37, a first wiring layer 36, and a supporting board 38 that are sequentially stacked. In this embodiment, the mounting plate 35 and the supporting plate 38 are both ceramic substrates.

[0055] The mounting plate 35 includes six first through holes 351. A square area at the center of the upper surface of the mounting plate 35 is defined as the mounting area 359. Four of the six first through holes 351 are respectively arranged at four opposite corners of the installation area 359, and the other two are arranged on opposite sides of the installation area 359.

[0056] The first wiring layer 36 is provided with first to fourth electrodes 301 to 304, a first interconnection electrode 361, and a second interconnection electrode 362. The first to fourth electrodes 301 to 304 are located at the four corners of the first wiring layer 36 and correspond to the four first through holes 351 in the four corners of the mounting area 359. The first electrode 301 and the fourth electrode 304 are located at two opposite corners of the first wiring layer 36, and the second electrode 302 and the third electrode 303 are located at the other two opposite corners of the first wiring layer 36. The first interconnected electrode 361 is electrically connected to the first electrode 301 and the third electrode 303, and the second interconnected electrode 362 is electrically connected to the second electrode 302 and the fourth electrode 304. In this embodiment, the first interconnection electrode 361 and the second interconnection electrode 362 are strip-shaped and arranged in parallel to each other.

[0057] The second wiring layer 37 is located between the mounting board 35 and the first wiring layer 36, and is provided with four second through holes 372, a fifth electrode 305, a sixth electrode 306, and a third interconnection electrode 373. The four second through holes 372 are arranged at four opposite corners of the second wiring layer 37 and correspond to the first to fourth electrodes 301 to 304 in a one-to-one correspondence. The fifth electrode 305 and the sixth electrode 306 are located between the four second through holes 372 and correspond to the first through holes 351 on opposite sides of the mounting area 359 in a one-to-one manner. The first interconnection electrode 361, the second interconnection electrode 362, and the third interconnection electrode 373 are insulated from each other.

[0058] The support plate 38 includes two third through holes 383. The third through holes 383 are provided at two opposite corners of the support plate 38 corresponding to the first electrode 301 and the fourth electrode 304.

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[0059] When assembling, the lower surface of the mounting board 35 and the upper surface of the second wiring layer 37 are close to and aligned with each other, so that the fifth electrode 305 and the sixth electrode 306 pass through the mounting area 359 on opposite sides The first through hole 351 is then exposed on the upper surface of the mounting board 35. Then the upper surface of the first wiring layer 36 is close to the lower surface of the second wiring layer 37 and aligned with each other, so that the first to fourth electrodes 301 to 304 respectively pass through the four second through holes 372, and are located in the mounting area The four first through holes 351 at the four corners of 359 are exposed on the upper surface of the mounting board 35. In this embodiment, the top surfaces of the first to sixth electrodes 301 to 306 are flush with the upper surface of the mounting board 35, so as to facilitate the connection of metal wires 33, such as gold wires, to the bonding pads of the LED chips 31.32, respectively. Next, the upper surface of the support plate 38 and the lower surface of the first wiring layer 36 are close to and aligned with each other, so that the first electrode 301 and the fourth electrode 304 pass through the third through hole 383 and are exposed and protrude from the support plate 38 The lower surface of the light-emitting diode package structure 3 is used as an electrode for connecting the light-emitting diode package structure 3 with other external circuits. Finally, the mounting board 35, the first wiring layer 36, the second wiring layer 37, and the supporting board 38 are combined into a solid overall structure by low-temperature co-firing.

[0060] The first and second light-emitting diode chips 31>32 are sequentially arranged in the mounting area 359. The anode pad of the first light emitting diode chip 31 is connected to the first electrode 301 through a metal wire 33. The negative electrode pad of the first light emitting diode chip 31 is connected to the second electrode 302 through a metal wire 33. The anode pad of the second LED chip 32 is connected to the third electrode 303 through a metal wire 33. The negative electrode pad of the second LED chip 32 is connected to the fourth electrode 304 through a metal wire 33. The protective layer 34 covers part of the substrate 30, the first light emitting diode chip 31, the second light emitting diode chip 32 and a plurality of metal wires 33.

[0061] In this way, the first and second light-emitting diode chips 31>32 of the light-emitting diode package structure 3 are on the first electrode

A circuit connection is formed between 301 and the fourth electrode 304 in parallel.

[0062] Due to the use of the substrate 30, the light-emitting diode package structure 3 is not only reliable in performance and thin in thickness, but also the first and second light-emitting diode chips 31.32 can be connected in series or in parallel only by selecting and connecting different electrodes. .

[0063] FIG. 10 is a top perspective view of a light emitting diode package structure 4 according to a third embodiment of the present invention. The difference between the light emitting diode packaging structure 4 and the light emitting diode packaging structure 3 lies in the connection mode of the first and second light emitting diode chips 31 and 32. In this embodiment, the anode pad of the first light emitting diode chip 31 is connected to the first electrode 301 through a metal wire 33. The negative electrode pad of the first light emitting diode chip 31 is connected to the sixth electrode 306 through a metal wire 33. The anode pad of the second light emitting diode chip 32 is connected to the fifth electrode 305 through a metal wire 33. The negative electrode pad of the second light emitting diode chip 31 is connected to the fourth electrode 304 through a metal wire 33.

[0064] In this way, the first and second light-emitting diode chips 31.32 of the light-emitting diode package structure 4 are on the first electrode

301 and the fourth electrode 304 are connected in series in a circuit connection.

[0065] A person of ordinary skill in the art should realize that the above embodiments are only used to illustrate the present invention, but not to limit the present invention. As long as they are within the essential spirit of the present invention, the above embodiments Appropriate changes and changes made fall within the scope of protection of the present invention.

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