Low emissivity coating with low solar heat gain coefficient, enhanced chemical and mechanical properties and method of making same

Low-emissivity coating with low solar heat gain coefficient, enhanced chemical and mechanical properties and its production method Technical field

[0001] The present invention relates generally to low emissivity ("low e") coatings, and more specifically to low solar heat gain coefficient (SHGC) ("low g") with retained or enhanced mechanical and Chemically stable coating.

Background technique

[0002] All U.S. patents and patent applications cited herein are incorporated by reference in their entirety, including the concurrently pending U.S. Application Nos. 11/64 & 913, U.S. Application Nos. 11/431,915, U.S. Provisional Application No. 60/680, 008, U.S. Provisional Application No. 60/736,876, and U.S. Provisional Application No. 60/750, 782_OIn case of conflict, this will prevail, including definitions.

[0003] Solar control coatings on transparent panels or transparent substrates are used to pass visible light and block infrared radiation (IR)-high visible light transmittance, low emissivity coatings on, for example, architectural glass or car windows can be Greatly save costs related to environmental control, such as heating and cooling costs.

[0004] Generally speaking, a coating that provides high visible light transmittance and low emissivity is composed of a laminate, which usually includes a transparent substrate and an optical coating. The laminate includes one or more thin metal layers with high IR reflectivity and low transmittance between anti-reflection dielectric layers. These systems reflect radiant heat and isolate the cold and solar radiation. Most of the low-emissivity laminates used today are based on transparent insulating materials. Generally, the thickness of the dielectric layer is adjusted to reduce internal and external reflections so that the light transmittance is high (>60%). The IR reflective metal layer can actually be any reflective metal, such as silver, copper or gold. Silver (Ag) is most commonly used for this application due to its relatively neutral color. The anti-reflective dielectric layer is usually made of a transparent material to increase the visible light transmittance.

[0005] Conventional low-emissivity coatings generally strive to maintain a relatively constant reflection over the entire visible spectrum to make the coating a "neutral" color, that is, basically colorless. However, conventional low-emissivity coatings cannot provide the extreme reflective colors required for aesthetics or other reasons in certain applications.

[0006] In order to obtain the desired characteristics in the coated substrate, the composition and thickness of each layer in the multilayer coating must be carefully selected. For example, the thickness of the IR reflective layer, such as the Ag layer, must be carefully selected. It is known that the emissivity of the Ag layer tends to decrease as the resistance of the Ag sheet decreases. Therefore, in order to obtain a low emissivity Ag layer, the sheet resistance of the Ag layer should be as low as possible. However, increasing the thickness of the Ag layer will also result in a decrease in visible light transmittance and may produce generally undesirable colors. It is desirable to be able to increase the visible light transmittance by reducing the thickness of the Ag layer without increasing the sheet resistance and emissivity.

[0007] The thin and transparent Ag metal layer is susceptible to corrosion when exposed to various corrosive agents, such as air-borne chloride, sulfide, and sulfur dioxide, in a humid or humid environment. To protect the Ag layer, various barrier layers can be deposited on the Ag. However, the protection provided by conventional barrier layers is often insufficient.

[0008] Coated glass is used in a variety of applications where the coating is exposed to high temperatures. For example, the coating on the glass window in a self-cleaning kitchen oven is repeatedly heated to a cooking temperature of 120-230°C, and often deviates to, for example, 480°C during the cleaning cycle. Moreover, when tempering or bending the coated glass, the coating and the glass are heated to a temperature above 600°C for several minutes. These heat treatments may cause irreversible damage to the optical properties of the Ag coating. This damage may be due to the Ag being oxidized by oxygen diffused to the upper and lower layers of Ag. This damage may also be due to Ag and alkaline ions such as sodium (Na⁺)reaction. Such damage or structural changes in the dielectric layer above and below Ag may contribute to

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Enhance the diffusion of oxygen and alkaline ions. The coating must be able to withstand these high temperatures. However, previously known multilayer coatings using Ag as an infrared reflective film often cannot withstand such temperatures without some damage to the Ag film.

[0009] Low emissivity coatings are described in U.S. Patent Nos. 4,749,397 and 4,995,895. Vacuum-deposited silver-containing low-emissivity coatings are currently available in the door and window design market.

[0010] US Patent No. 4,995,895 teaches the use of an oxidizable metal as an anti-fogging outer coating for the protection of a temperable low-e coating. The patent relates to a method to reduce the mist generated by exposure to temperatures exceeding 600°C.

[0011] Metals, metal alloys, and metal oxide coatings have been used for low emissivity silver coatings to improve some of the properties of coated objects. US Patent No. 4,995,895 describes a metal or metal alloy layer that is deposited as the outermost layer of all layers on a glass substrate. The metal or metal alloy layer is oxidized and used as an anti-reflective coating. U.S. Patent No. 4,749,397 describes a method in which a metal oxide layer is deposited as an anti-reflective layer. Sandwiching the silver layer between the anti-reflection layers optimizes light transmission.

[0012] Unfortunately, optical coatings are often damaged during transportation and handling, including scratches and exposure to corrosive environments. Silver-based low-emissivity coatings are particularly susceptible to corrosion problems. Most of the low-emissivity stacks currently in use use barrier layers in or on the low-emissivity thin stacks to alleviate these problems. The thin barrier layer is usually used to reduce the corrosion of the silver layer by water vapor, oxygen or other fluids. If they form an outer coating, some use their hardness or reduce friction to reduce damage caused by physical scratching of low-emissivity laminates.

[0013] For semi-desert areas and areas with strong sunlight, the existing high transmittance and low e products have brought advantages, but the heat and light load are still too strong to maximize the use of these low e products in rooms and buildings. Temperature and visual comfort.

[0014] There are also low-e laminates with lower light transmittance, but these products usually exhibit at least one of the following shortcomings: high reflection, which makes it unsightly, or high shading coefficient, which makes it unsuitable for controlling thermal load.

[0015] Few commercially available low-e products have ideal optical characteristics and shading coefficient. Those products still require additional modifications to make them ideal for processing and production. Moreover, these low-e coatings are soft coatings and require great care during storage and processing into insulating glass units. It is desirable to improve the current mechanical and chemical stability of these coatings.

[0016] The production of different laminate designs on the same coating machine may also often be problematic, because the device requirements of different designs are not always compatible. It is ideal to be able to produce different coatings on one coating machine at the same time without shutting down and changing the configuration of the coating machine.

[0017] Moreover, for safety reasons, more glass is now heat treated to increase its mechanical strength and avoid scratches when broken. This is especially true for low SHGC products. When part of the coating is exposed to sunlight and part is in the shade, the increase in energy absorption of the coating increases the potential thermal stress on the lite. Generally designed low-e coatings are not used to withstand heat strengthening or tempering. Such conditions may completely damage the coating and ruin its aesthetics, making it unusable.

[0018] Therefore, there is still a need for a low-emissivity coating stack (and its preparation method) that can overcome these various problems in the prior art. In particular, there is a need for a low-e laminate with a low solar heat gain coefficient. If desired, the laminate exhibits retained or increased aesthetics, as well as mechanical and/or chemical stability, and can be tempered or thermally strengthened . Furthermore, there is a need for laminates that can be coated without the need for specific non-standard coating machines.

Summary of the invention

[0019] In order to overcome the problems associated with the previous low-emissivity coatings, the present invention provides an improved coating, the resulting laminate has a low solar heat gain coefficient (ie low-g laminate), and is beautiful, It also shows that it is similar to the general low emissivity stack

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Compared to equivalent or better chemical and mechanical stability. Moreover, the products provided by the present invention are compatible with standard production methods. In particular, for example, switching from a standard coater to a low-g coater does not require ventilation or other coater configuration changes. In addition, the glass substrate coated in accordance with the present invention can surprisingly be tempered or thermally strengthened, and this tempering or thermal strengthening does not lead to laminate degradation or degradation of the optical quality of the coated substrate, and does not This can lead to other defects that usually occur when these processes are used with low emissivity coatings.

[0020] The present invention overcomes the shortcomings of low-e laminates known in the art by introducing at least one thin absorbent layer to increase the absorption of the laminate or by increasing the absorption of other layers such as barrier layers. The technique of increasing the absorption of the laminate reduces the overall light transmittance without increasing light reflection. Increased light reflection is often a problem, especially when it occurs on window panes facing the interior of the building.

[0021] The appropriate choice of absorbing material also enables one to control the transmission color of the coated glass. In an embodiment, an absorbing layer may be inserted between the barrier layer protecting the infrared reflective layer and the covering dielectric layer. In an alternative embodiment, the barrier layer itself can also be made more absorbent to achieve similar results. Therefore, in this embodiment, the barrier layer functions as both a barrier layer and an absorbing layer, and is referred to herein as an "absorption barrier" layer. The infrared reflective layer is preferably silver (Ag), but can also be any reflective material, such as, without limitation, copper or gold. Therefore, in one aspect, the present invention provides a low-emissivity coating on a substrate. The coating from the substrate includes a first dielectric layer, a first infrared reflective layer, a first absorption barrier layer, and a first Two dielectric layers, a second infrared reflective layer, a second absorption barrier layer, a third dielectric layer, and an optional outer coating. An optional outer coating is used in embodiments that are to be tempered or heat treated. In a preferred embodiment, the nucleation layer is under the one or two infrared reflective layers. Although the preferred embodiment includes the above-described laminated structure, the present invention also provides a coating having a single infrared reflective layer instead of two or more infrared reflective layers. Therefore such an embodiment would include a first dielectric layer; an optional nucleation layer; an infrared reflective layer; an absorption barrier layer; a second dielectric layer; and an optional overcoat. The coating of the present invention is formed by depositing these layers on the substrate. A preferred method includes deposition by magnetron sputtering.

Description of the drawings

[0022] Figure 1 depicts an embodiment of an aesthetically pleasing low-emissivity laminate according to the present invention, the laminate exhibiting low SHGC and enhanced mechanical and/or chemical stability.

[0023] FIG. 2 depicts another embodiment of an aesthetically pleasing low-emissivity laminate according to the present invention, the laminate exhibiting low SHGC and enhanced mechanical and/or chemical stability, including for improving The nucleation layer with the characteristics of the Ag layer.

[0024] FIG. 3 depicts yet another embodiment of an aesthetically pleasing low-emissivity laminate according to the present invention, the laminate exhibiting low SHGC and enhanced mechanical and/or chemical stability.

[0025] FIG. 4 depicts another embodiment of an aesthetically pleasing low-emissivity laminate according to the present invention, the laminate exhibiting low SHGC and enhanced mechanical and/or chemical stability.

[0026] FIG. 5 depicts an embodiment of a low-emissivity laminate for automobiles or other vehicles, the laminate including two glass substrates, a PVB layer, and a coating according to the present invention.

[0027] FIGS. 6A and 6B describe the optical constant data of a typical material suitable for the low-g absorber of the present invention. Figure 6A provides data related to the refractive index (η), and Figure 6B provides data related to the extinction coefficient (k).

[0028] FIG. 7 provides an illustration for SiA10_xN_yGraph data of the refractive index and extinction coefficient of the two stoichiometry. [0029] FIG. 8 provides an explanation for the SiA10 in the low-g laminate according to the present invention_xN_yThe graph data of the preferred η and k values.

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[0030] FIG. 9 depicts another embodiment of an aesthetically pleasing low-emissivity laminate according to the present invention, the laminate exhibiting low SHGC and enhanced mechanical and/or chemical stability.

[0031] FIG. 10 depicts yet another embodiment of an aesthetically pleasing low-emissivity laminate according to the present invention, the laminate exhibiting low SHGC and enhanced mechanical and/or chemical stability.

[0032] FIG. 11 depicts an embodiment of an aesthetically pleasing low-emissivity laminate according to the present invention, the laminate exhibiting low SHGC and enhanced mechanical and/or chemical stability.

[0033] FIG. 12 depicts another embodiment of an aesthetically pleasing low-emissivity laminate according to the present invention, the laminate exhibiting low SHGC and enhanced mechanical and/or chemical stability, including for improving A nucleation layer with characteristics of the Ag layer. [0034] FIG. 13 depicts another embodiment of an aesthetically pleasing low-emissivity laminate according to the present invention, the laminate exhibiting low SHGC and enhanced mechanical and/or chemical stability.

[0035] FIG. 14 depicts another embodiment of an aesthetically pleasing low-emissivity laminate according to the present invention, the laminate exhibiting low SHGC and enhanced mechanical and/or chemical stability.

Detailed ways

[0036] In the following detailed description, reference is made to a number of specific embodiments in which the present invention can be implemented. These embodiments are described in sufficient detail to enable those skilled in the art to implement the present invention, and it should be recognized that other embodiments can also be used and can be made without departing from the spirit and scope of the present invention. Structural changes and logical changes.

[0037] The present invention provides an improved coating, the resulting low-emissivity laminate has a low solar heat gain coefficient (SHGC), and is aesthetically pleasing, and also exhibits equivalent or better than general low-emissivity laminates. Good chemical and mechanical stability. Moreover, the products provided by the present invention are compatible with standard production methods. In particular, for example, switching from a standard coater to a low-g coater does not require ventilation or other coater configuration changes. Moreover, glass substrates coated according to embodiments of the present invention can surprisingly be tempered or thermally strengthened without the defects that usually occur when these processes are used with low emissivity coatings.

[0038] In embodiments, the present invention increases the absorbency of the laminate by introducing at least one thin absorbent layer or by increasing the absorption of other layers such as a barrier layer (thereby obtaining a "absorbent barrier" layer) to achieve low eLaminate desired properties. The technique used to increase the absorption of the stack reduces the overall light transmittance without increasing light reflection. Increased light reflection is often a problem, especially when it occurs on window panes facing the interior of the building. The tempering tolerance can be increased by adjusting the thickness of the dielectric layer or the absorption barrier layer or the properties of the absorption barrier layer.

[0039] In one aspect, the present invention provides a low-emissivity laminate including a coating on a substrate, the coating including at least one absorbing layer. The absorption layer may be a layer other than the barrier layer. Alternatively, the barrier layer can also be modified to also function as an absorbent layer, thereby becoming an absorbent barrier layer and eliminating the need for separate absorbent and barrier layers. The low-emissivity stack is characterized by its solar heat gain coefficient (SHGC) of less than about 0.34, preferably less than about 0.31. In some embodiments, the low-e stack is characterized by SHGC ranging from about 0.22 to about 0.25. In various embodiments, the light transmittance of the stack is about 42% to about 46%. In some embodiments described herein, the light transmittance can be as high as about 62%. During tempering, the transmittance increases by about 1-8%. In some embodiments, the transmittance color of the stack is negative a* and negative b*. In an alternative embodiment, the laminate has a transmission color of negative a* and positive b\

[0040] On the other hand, the present invention provides a low-emissivity coating on a substrate. The coating from the substrate includes a first dielectric layer, a first infrared reflective layer, and a first absorption barrier. Layer, second dielectric layer, second infrared reflective layer, second absorber

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A barrier layer, a third dielectric layer, and optionally an overcoat layer. Either the first or second absorption barrier layer is optional, that is, these two layers are not necessary. An optional outer coating is used in embodiments that are to be tempered or heat treated. In a preferred embodiment, the nucleation layer is located under one or more infrared reflective layers.

[0041] The substrate is preferably glass. In a preferred embodiment, the two infrared reflective layers are Ag layers and are well balanced with an Agl/Ag2 ratio of about 80% or higher. However, in other embodiments, this ratio may be as low as 50%. A balanced Ag layer offers multiple advantages, especially from a process point of view. Because the two targets corrode at approximately the same rate, the length of the operating cycle can be maximized. For example, when the second Ag layer (Ag2) is much thicker than the first layer (Agl), the coating machine must be ventilated early in the operation, which has a great negative impact on production costs. As mentioned above, the present invention also provides a coating having a single Ag layer instead of a double or multiple Ag layer.

[0042] When present as a separate layer, the absorbing layer is preferably interposed between the barrier layer protecting the Ag layer and the covering dielectric layer. The absorbing material may include metal, alloy, silicide, absorptive oxide, absorptive gray metal, nitride, or any other suitable material that achieves the desired effect. Preferred materials include, but are not limited to, Ti, TiN, Si, NiCr, NiCrO', Cr, Zr, Mo, W, and ZrSi, nickel or Lo alloys, and transition metals and their nitrides, low-valent nitrides, and Low-order oxides, as well as silicides and aluminides. In the preferred temperable and non-temperable embodiments, the absorbing material includes NiCr_oIn some embodiments without tempering, Ti is also a good absorbent material.

[0043] Appropriate selection of the absorbing material also enables the ordinary skilled person to control the transmission color of the coated glass. Neutral colors (preferably negative a* and b* and well-balanced-the minimum requirements for transmission and glass side reflection are negative a* values and b* values less than +2) are more beautiful than darker green and yellow tones. Neutral transmission is ideal because it maximizes the correct color reproduction of the glass-insulated glass unit (IGU). If necessary, the present invention can also obtain a blue hue.

[0044] Therefore, it has been found that certain materials in a low-g design can reduce the transmission of the low-e coating and adjust the color of the stack to a preferred color. For temperable coatings, this preferred material is also thermally stable in the film stack. Many other materials can be used to replace the above-mentioned absorbent materials. These materials can be defined by the range of refractive index (η) and shading coefficient (k), and are suitable for performing the function of reducing transmission. In the temperable low-g design, the absorption layer has suitable optical properties and additional thermal stability.

[0045] When a separate absorption layer is not used, one or more barrier layers can be modified to increase absorption, thereby producing the same desired optical properties as described above. This improvement preferably includes changing the gas levels in these layers, as shown in the figure below. These graphs show the oxygen flow rate and the sputtering power (kW) of NiCrO_xRatio and NiCrO_xThe relationship between the extinction coefficient (k). The second y coordinate also shows when the given NiCrO_xTY or SHGC value when used for double-layer silver low-e laminates as described herein.

[0046] The NiCrO_xThe ratio is preferably based on a 2879 mm long sputtering target operated with a DC power supply. The power is generally 15-45kwo chlorine, and the gas flow is 300sccm.

[0047] NiCrO with oxygen flow rate and sputtering power_xRatio vs extinction coefficient and low e TY

[0048]

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<img file="CN101925552B_D0001.tif" />

Oxygen flow (seem)/kw

[0050]

[0049] NiCrO with oxygen flow rate and sputtering power_xRatio vs extinction coefficient and low e SHGC

<img file="CN101925552B_D0002.tif" />

Oxygen flow (seem)/kw

[0051] US Patent 6,416,872 is incorporated by reference in its entirety in this application, which relates to the use of solar control designs including Fabry-Perot-type thin film stacks (metal/dielectric layer/metal). One of the metals is an infrared reflective material (silver), and the other is an optically absorbing material. The optically absorbing material is described by a series of suitable optical constants. The embodiment of the present invention similarly includes a Fabry-Perot laminate, but includes a general layer structure of metal/metal/dielectric layer/metal/metal, or more specifically, a metal/thin suboxide absorber (barrier Layer)/metal/dielectric layer/metal/thin suboxide absorber (barrier layer)/metal. In each case, one metal in the metal/metal combination is preferably an infrared reflective metal, and the other is preferably an absorptive metallic material. The low-g absorptive metal material can be described with a similar range of optical constants as described in US Patent 6,416,872. The optical constants of typical materials optically suitable as low-g absorbers are shown in Figs. 6A and 6B. Based on the data shown in FIG. 6A, for the metal absorber shown, the preferred refractive index range at a wavelength of 550 nm is about 1 to about 5.5. Based on the data shown in Figure 6B, for the metal absorber shown, the extinction coefficient at a wavelength of 550nm is about 1.75-about 4. 5. Another parameter that can be used to help define the range of suitable materials is a refractive index profile with a positive slope at 550 nm. This feature distinguishes metallic materials from low-priced oxides and nitrides, which, when drawn similarly, usually have a negative slope at 550nm.

[0052] In one embodiment of the present invention, when the absorbing layer exists as a separate layer, it is added at a specific position of the laminate. This is to optimize other characteristics that are important for the manufacture and processing of coated glass, especially overall durability and hygiene.

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Convenience of production.

[0053] When the absorption layer is present, the thickness of each absorption layer is preferably about 0.1 nm to about 8 nm. If two absorbing layers are included, it is preferred that the first absorbing layer is thicker than the second absorbing layer. The thickness of the first absorption layer is preferably from about 1 nm to about 6 nm, more preferably from about 1.5 nm to about 5 nm. The thickness of the second absorption layer is preferably from about 0.1 nm to about 5 nm, more preferably from about 0.1 nm to about 4 nm. In another embodiment, the thickness of the first absorption layer is about 3 nm. In another alternative embodiment, the thickness of the second absorbing layer is about 0.5 nm. In another alternative embodiment, the thickness of the first absorption layer is about 3.6 nm. In another alternative embodiment, the thickness of the second absorbing layer is about 0.1 nm. The thickness ranges described above apply similarly to the absorption barrier layer, when such a layer is used instead of a separate absorption layer and barrier layer.

[0054] The barrier layer (either alone or an absorbing barrier layer) protects the Ag layer from plasma attack when the dielectric layer is sputtered thereon. It also controls aggressive species such as Ο?, 0, out 0, and Na⁺Diffusion to improve chemical stability. In a preferred embodiment, the barrier layer is transparent. The barrier layer may include, but is not limited to, NiCr, NiCrO', TiO', NiCrN'Oy, NiCr%, Ti, or other one or more metals, or low-valent nitrides or low-valent oxides thereof. The preferred barrier layer is NiCr0_xOIn this layer, especially in the first (ie, bottom layer) NiCrO_xIn the layer, it may contain about 15 to 60 atomic% of oxygen. Preferably, the atomic% of oxygen is 20% to 55%. When the first NiCrO' layer contains about 20 atomic% of oxygen, the heat resistance of the temperable form of the present invention can be improved. In a preferred embodiment, (especially when the barrier layer is modified so that it also has increased absorption properties), the barrier layer includes NiCrO_xAnd it is a thin protective layer sputtered and deposited on silver from a planar target. Preferably it is sputtered in a nitrogen-oxygen mixture. The ratio of power to oxygen flow (seem) is used to estimate the sputtered NiCrO_xThe preferred method of oxidation. For fully oxidized NiCrO_xFor example, the ratio used is 10:1. The ratio used in some coatings according to the present invention is preferably 7.5: 1 to &amp; 0: E

[0055] In an alternative preferred embodiment, an absorption barrier of NiCr is used. Similarly, this thin protective barrier layer is preferably sputtered and deposited on silver from a DC planar target. In such an embodiment, the NiCr layer is sputtered only in nitrogen. The NiCr layer may be completely metallic, except for unintentional impurities, such as may be caused by gas crosstalk adjacent to the cathode.

[0056] In a preferred embodiment, each dielectric layer independently includes oxide, nitride, or oxynitride. When the dielectric layer includes an oxide, the oxide is preferably sputtered from a Ti, Zn, Sn, ZnSn alloy, or Bi target. The oxide may include Nb₂0₅o The oxide may contain up to 20% by weight, preferably up to about 10% by weight of elements such as Al or B, or similar such elements. These dopants are commonly used to make silicon coater targets conductive. When the dielectric layer includes nitride or oxynitride, the nitride or oxynitride can be Si, SiAl, SiB, SiZr nitride or oxynitride, or other suitable nitrides or oxynitrides that achieve the desired effect. nitride. Similarly, the nitride or oxynitride may contain up to about 20% by weight, preferably up to about 10% by weight, of elements such as Al or B, or similar such elements for making the coater target conductive. In a preferred embodiment, the dielectric layer is SiA10_xN_yAnd it is reactive sputtering made of silicon/10wt% aluminum rotatable cathode. The reactive gas is preferably about 90% nitrogen flow and 10% oxygen. Although stoichiometric changes occur from layer to layer and between each production run, it is preferred that the material is sub-stoichiometric. In a preferred embodiment, for SiAl, there is insufficient nitrogen and oxygen in the sputtering gas to obtain a fully reacted oxynitride. In some embodiments, the atomic ratio in the layer is approximately Si₄0₀.₄N₅o

[0057] In a preferred embodiment using three primary dielectric layers, at least one of the dielectric layers is in a substoichiometric state. More preferably, the three dielectric layers (for example, SiAlO'Ny) are all in a substoichiometric state. There are many benefits to using this substoichiometric layer. E.g:

1. If the target surface chemistry is substoichiometric, the deposition rate from the SiAl sputtering target is higher. For silicon-rich

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The sputtering yield is higher for the surface than for the surface containing more silicon nitride. A higher deposition rate is advantageous for operating the coating machine at a higher speed, which is more economical.

[0059] 2. The higher refractive index of the substoichiometric nitride allows the dielectric layer to have a lower physical thickness for the same optical thickness. When depositing substoichiometric layers, less target material is consumed, which again makes the coater run more efficiently.

[0060] 3. The higher refractive index dielectric layer makes the optical characteristics more flexible in the low-e stack design. It is easier to obtain ideal transmission and reflection colors with a higher refractive index dielectric layer than with a lower refractive index and stoichiometric material.

[0061] 4. Substoichiometric layers tend to have better chemical barrier properties than stoichiometric dielectric layers. This makes the low-e laminate have better chemical stability and corrosion resistance. The etchant is less likely to reach the fragile silver layer.

[0062] 5. The light absorption of the substoichiometric dielectric layer helps reduce transmission and increase the solar heat gain coefficient of the low-g laminate.

Substoichiometric dielectric layers tend to be optically absorptive in visible light, but more transparent in infrared. Therefore, these materials reduce visible light transmission but often do not interfere with the infrared reflection characteristics of the silver layer.

[0063] The metal absorber layer is optically absorbing in both visible light and infrared. When metal materials are used to reduce transmission in low-g products, both visible light transmission and infrared reflection are reduced. It is ideal for low-e products that the infrared reflection is as high as possible.

[0064] These advantages often appear in substoichiometric oxides, substoichiometric oxynitrides, and substoichiometric nitrides that can be used in low-e stacks.

[0065] The ratio of silicon to aluminum used in the preferred dielectric layer in the laminate according to the present invention is 10% by weight Al. Other Si:Al ratios can also be used. In some embodiments, the atomic ratio of Si, O and N is about Si₄0₀.₄N₅o The main function of the top silicon oxynitride dielectric layer is to act as an optical interference layer, which contributes to the anti-reflection of silver. However, part of the reason for the choice of this material is its barrier properties and hardness, as well as its contribution to the mechanical and chemical protection of silver.

[0066] FIG. 7 describes the refractive index and extinction coefficient of silicon oxynitride. The refractive index and extinction coefficient plotted on the graph indicate two stoichiometric SiA10_xN_yo This represents SiA10 suitable for low g coating_xN_yThe approximate upper and lower limits of stoichiometry. The stoichiometry of the preferred embodiment is generally between these two end values. Figure 8 depicts SiA10 in a low-g stack_xN_yThe preferred n&amp;k approximation.

[0067] In a preferred embodiment, the refractive index of the dielectric layer at 550 nm is from about 1.8 to about 2.5, more preferably from about 2.1 to about 2.3. Specifically, in a preferred embodiment, the top dielectric layer may have a lower refractive index than the bottom or middle dielectric layer. In such an embodiment, the refractive index of the top dielectric layer is about 1.8 to about 2.3, and the refractive index of the bottom or middle dielectric layer is about 2.0 to about 2.5. In preferred embodiments , The extinction coefficient of the dielectric layer at 550 nm is from about 0 to about 0.05, more preferably from about 0.01 to about 0.02.

[0068] In a preferred embodiment, the coating further includes a nucleation layer between the first dielectric layer and the first silver layer. In another preferred embodiment, the coating further includes a second nucleation layer between the second dielectric layer and the second silver layer. The nucleation layer improves the characteristics of the silver layer, which is usually based on Zn oxide, and other elements such as, but not limited to, Al, Sn or mixtures thereof up to 15% by weight. In a preferred embodiment, the sputtering target used to deposit ZnO contains about 1.5% Al, and the resulting layer is ZnA10_χΟThis material is preferably reactively sputtered from a rotatable or flat cathode of zinc/1.5% aluminum by weight. The sputtering gas is preferably composed of nitrogen and sufficient oxygen so that the oxide is deposited in a completely oxidized state. Nucleation layers for silver, such as those described herein, are generally described in low-e patent literature. The thickness of the nucleation layer in the embodiment of the present invention is preferably about 2nm-12nm_oIn a preferred embodiment, the bottom nucleation layer is thicker than the top nucleation layer, and the ratio between the two is about 1.2 to about 2.0. This structure improves durability, especially after heat treatment or tempering.

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[0069] In a preferred embodiment, the infrared reflective layer includes Ag and is sputtered in pure nitrogen. Alternatively, a small amount of oxygen can be added. Oxygen contributes to mechanical durability, especially in embodiments that are subjected to heat treatment or tempering.

[0070] The optional external coating, if present, can have a positive effect on the chemical and/or mechanical stability. It can include, but is not limited to, c, SiSn, ZrSi, SiSnO₂Or silicide. It should be noted that this nomenclature is not used to refer to the stoichiometry or atomic ratio between different elements. For example, ZrSi is a sputtering material in which the atomic percentage of Zr varies from 0% to 100%, and the layer can be graded. This layer can be oxidized when heated. The overcoat usually has relatively comparable properties compared to the underlying dielectric layer. If the dielectric layer is an oxide, the outer coating is preferably one of the above-mentioned materials, or nitride or oxynitride, such as SiN or Si_xAl_yN_z0_c°Alternatively, when the dielectric layer is nitride or oxynitride, the overcoat is selected from the above list, or may be an oxide (such as Zr0₂, ZrSiO₂, SnO?, or ZrO_xN_y&gt; Ti0₂Or other similar substances, but not limited to the exact stoichiometric ratio described here). The preferred outer coating is carbon and is preferably used in temperable products during production. The thickness of this layer of coating that is usually sputtered is preferably about 4-8 nm, and is burned off during the tempering process. The preferred embodiment uses a sputtered carbon outer coating about 3-5 nm thick as the outermost layer. This material is preferably DC magnetron sputtered in nitrogen.

[0071] In a preferred embodiment, the present invention provides a low-emissivity coating on a substrate, the order of the coating outward from the substrate includes a thickness of at most about 25 nm, preferably at most about 23 nmof first dielectric layer; a first silver layer having a thickness of about 8 nm to about 15 nm; a first absorption barrier layer having a thickness of about 0.1 nm to about 4 nm; a second dielectric layer having a thickness of about 40 nm to about 75 nm; A second silver layer having a thickness of about 8 nm to about 15 nm; a second absorption barrier layer having a thickness of about 0.1 nm to about 4 nm; a third dielectric layer having a thickness of about 10 nm to about 40 nm; and an optional overcoat Floor. In another embodiment, the coating includes a nucleation layer between the first dielectric layer and the first silver layer, and the thickness of the nucleation layer is about 4 nm to about 12 nm. In yet another embodiment, the coating includes a second nucleation layer between the second dielectric layer and the second silver layer, and the thickness of the second nucleation layer is about 2 nm to about 8 nm. Stacks with a thickness of the first dielectric layer of about 23 nm are particularly suitable for tempering.

[0072] In another preferred embodiment, the present invention provides a low-emissivity coating on a substrate, the coating sequentially from the substrate outward includes a first dielectric layer, which includes SiAlO' Ny; the first nucleation layer, which includes ζηΑΙΟ'; the first infrared reflective layer, which includes Ag; the first absorption barrier layer, which includes NiCr; the first dielectric layer, which includes SiA10_xN_y The first nucleation layer, which includes ZηΑΙΟ'; the second infrared reflective layer, which includes Ag; the second absorption barrier layer, which includes NiCr; the third dielectric layer, which includes SiAlO'Ny; and optional external coating. In an alternative embodiment, the absorption barrier layer includes NiCrO_xo

[0073] In another preferred embodiment, the present invention provides a low-emissivity coating on a substrate, the order of the coating outward from the substrate includes: a first dielectric layer, which includes SiAlO 'Ny, and the thickness is at most about 25nm, preferably at most about 23nm; the first nucleation layer, which includes ZnA10_x, And the thickness is about 4nm to about 12nm; the first silver layer, the thickness of which is about 8nm to about 15nm; the first absorption barrier layer, which includes NiCr, and the thickness is about 0.1nm to about 4nm; second dielectric layer , Which includes SiAlO'Ny, and has a thickness of about 40nm to about 80nm; the second nucleation layer, which includes ZnAIO', and has a thickness of about 2nm to about 8nm; the second silver layer, which has a thickness of about 8nm to about 15nm; The second absorption barrier layer, which includes NiCr, and the thickness is about 0.1nm to about 4nm; the third dielectric layer, which includes SiAlO'Ny, and the thickness is about 10nm to about 40nm; and optional outer coating . In an alternative embodiment, the absorption barrier layer includes NiCr._xOStacks with a thickness of the first dielectric layer of about 23 nm are particularly suitable for tempering.

[0074] In one embodiment, the present invention provides a low-emissivity coating on a substrate, the order of the coating outward from the substrate includes: a first dielectric layer, which includes SiAl'NyO" And the thickness is about 3nm to about 25nm; the first nucleation layer, which includes ZnAlyO and the thickness is about 4nm to about 12nm; the first silver layer, the thickness of which is about 8nm to about 12nm; the first barrier layer, which includes NiCrO_x, And the thickness is from about 1nm to about 4nm; the first absorption layer, which includes NiCr, and the thickness is from about 1.5nm to about

CN 101925552 Β

4nm; the second dielectric layer, which includes SiAl'NyO", and the thickness is about 55nm-about 75nm; the second nucleation layer, which includes ZnA10_x, And the thickness is about 3nm to about 10nm; the second Ag layer, the thickness of which is about 10nm to about 15nm; optional second barrier layer, which includes NiCrO_xAnd the thickness is about 2nm to about 4nm; the second absorption layer, which includes NiCr, and the thickness is about 0.7nm to about 2.2nm; the third dielectric layer, which includes SiAl'NyO", and the thickness is about 24nm -About 40nm; and optional overcoat. In embodiments, including NiCrO_xThe second barrier layer of is not present, so that the second absorption layer is deposited directly on the second Ag layer. Co-sputtered NiCr and Luo, NiCr/Cr bilayers, or other absorptive gray metals or alloys can be used to replace the NiCr metal in the second absorbing layer in this described embodiment. Other alternatives include, but are not limited to, nickel alloys containing any Ni:Cr ratio; NiCr layers with graded Ni:Cr ratios; NiCrN is formed by reaction with nitrogen_xThe NiCr layer; and a double-layer optical absorber including NiCr/NiCr, where any metal can be any ratio of Ni and Cr.

[0075] In another embodiment, as shown in FIG. 9, the present invention provides a low-emissivity coating on a substrate, the coating from the substrate includes a first dielectric layer, a first The nucleation layer, the first Ag layer, the first barrier layer, the first optical absorption layer, the second dielectric layer, the second nucleation layer, the second Ag layer, the second optical absorption layer, the third dielectric layer, and An optional, preferably scratch-resistant outer coating. The layer thickness is as described herein. In an alternative embodiment, as shown in FIG. 10, the order of the coating from the substrate outward includes SiAlO_xN_y/ZnO/Ag/NiCrO_x/NiCr metal/SiA10_xN_y/Zn0/Ag/NiCr metal/SiAlO'Ny/ optional outer coating. Therefore, in this embodiment, the second NiCr metal absorption layer is deposited directly on the second Ag layer. This embodiment can be tempered or thermally strengthened, and this tempering or thermal strengthening does not lead to aging of the laminate or degradation of the optical properties of the coated substrate or other processes that generally occur when these processes are used on low emissivity coatings. Defects. In addition to improved temperability, this structure (in which the second absorber layer is deposited directly on the second silver layer) exhibits enhanced mechanical durability. It is also noted that in this embodiment, the color is more easily adjusted to the preferred set point. The NiCr metal in the second absorption layer can be replaced by co-sputtered NiCr and NiCr, NiCr/Cr double layer, or any absorptive gray metal or alloy. Other alternatives include, but are not limited to, nickel alloys containing any Ni:Cr ratio; NiCr layers with gradual Ni:Cr ratios; NiCr layers that react with nitrogen to form NiCr%; dual-layer optical absorbers including NiCr/NiCr, Any metal can be any ratio of Ni and Cr.

[0076] The present invention also provides a low-emissivity laminate comprising at least one absorption layer (as described, which may be a separate layer or a barrier layer modified to have increased absorption properties), which is low The emissivity stack is characterized by a solar heat gain coefficient (SHGC) of less than about 0.34, preferably less than about 0.31, and, in some preferred embodiments, from about 0.22 to about 0.25. In an embodiment, the stack includes a glass substrate having a thickness of about 1/8 inch and a light transmittance of about 42% to about 46%. An embodiment with a light transmittance of about 50% to about 62% is also provided. In some embodiments, the transmission color of the stack is negative a* and negative b. In alternative embodiments, the transmission color of the stack is negative a* and positive b*_o

[0077] The present invention also provides a method of manufacturing the above-mentioned low-emissivity laminate with low SHGC, the method comprising depositing the coating described herein on a substrate. Those layers in the multilayer coating of the present invention can be deposited using conventional physical and chemical vapor deposition techniques. The details of these technologies are well known in the art and will not be repeated here. Suitable deposition techniques include sputtering methods. Suitable sputtering methods include DC sputtering using metal targets, and AC and RF sputtering using metal and non-metal targets. All can be sputtered by magnetron. Sputtering can be performed in an inert gas or reactively in a reactive gas. The total gas pressure can be maintained as 5X10^_4-8X10^_2mbar, preferably 1 X 10 bow-1 X 103 nbar. The sputtering voltage can be 200-1200V, preferably 250-1000V. The dynamic deposition rate can be 25-4000nm-mni7W-sec, preferably 30-700nm-mni²/W-seCo Coating machines manufactured by Leybold Systems GmbH with models Typ A 2540 ζ 5H/13-22 and Typ A 2540 Ζ 5H/20-29 are suitable for sputtering deposition of the multilayer coating of the present invention.

[0078] Compared with single-layer silver, the multilayer silver in the low-emissivity coating of the present invention has a higher reflection of IR radiation.

CN 101925552 Β

Efficiency, there is a clearer line between the transmission and reflection wavelengths.

[0079] The multilayer coating of the present invention is deposited on a substrate and is mechanically supported by the substrate. The surface of the substrate is used as a template for the coating and affects the surface topography of the coating. In order to maximize the transmission of visible light, it is preferable that the roughness of the substrate surface is smaller than the wavelength of visible light. Such a smooth surface can be formed by, for example, solidifying and melting the substrate. The substrate can be any material whose emissivity can be reduced by the multilayer coating of the present invention. For architectural and automotive applications, the preferred material for the substrate has good structural properties and has minimal absorption in the visible and near-infrared spectral regions where solar energy is concentrated. Crystalline quartz, fused silica, soda lime silicate glass, and plastics such as polycarbonate and acrylic are all preferred substrate materials.

[0080] The expression "deposited on" as used herein refers to the application of a substance directly or indirectly on the layer in question. If applied indirectly, one or more layers can be inserted. Moreover, unless otherwise specified, the format "[Substance 1]/[Substance 2]/[Substance 3]/..." or format "first [substance 1] layer; first" is used in describing the coating of the present invention. [Substance 2] layer; second [substance 1] layer; second [substance 2] layer; ..." etc., meaning that each substance is deposited directly or indirectly on the previous substance in sequence.

[0081] The coated articles according to different embodiments of the present invention can be used for architectural windows (eg, IG units), automotive windows, or other suitable applications. The coated articles described herein may or may not undergo heat treatment in different embodiments of the invention. Figure 5 depicts an embodiment of the invention suitable for automotive or other vehicle applications such as windshields or similar laminates. In the described embodiment, the coating according to the present invention is added to a laminate that also includes two glass substrates and a layer of polyvinyl butyral (PVB). If the coating faces PVB, it can be on the first or second layer.

[0082] Certain terms are commonly used in the field of glass coatings, especially when defining the performance and solar management characteristics of coated glass. The terms used in this article are consistent with their well-known meanings. For example, as used in this article: [0083] Visible wavelength light reflection intensity, that is, "reflectivity" is defined as a percentage and expressed as R_XY or out (meaning that the RY value refers to light reflectance, or light transmittance in the case of TY), where "X" is "G" for the glass side or "F" for the film side. "Glass side" (such as "G") refers to the side of the glass substrate opposite to the side where the coating is located, while the film side (ie, "F") refers to the side of the glass substrate where the coating is located.

[0084] Color characteristics are measured and expressed using CIE LAB 1976a*, b* coordinates and scale (ie CIE 1976a*b* chart, D65 10° observer), where:

[0085] L* is (CIE 1976) luminance unit

[0086] a* is (CIE 1976) red-green unit

[0087] b* is (CIE 1976) yellow-blue unit.

[0088] Other similar coordinates can also be used equally, the subscript "h" represents the conventional use of the Hunter method (or unit) 111. C, 10° observer, or CIE LUV coordinates. These scales are defined in this article according to the following standards: expanded by ASTM E-308-95, Annual Book of ASTM Standards, Vol. 06. 01 Standard Method for Computing the Colors of Objects by 10 Using the CIE System and/ Or ASTM D-2244-93 Standard Test Method for Calculation of Color Differences From Instrumentally Measured Color Coordinates described by IES LIGHTING HANDB00K1981 Reference Volume Sep. 15, 1993_O

[0089] The terms "emissivity" and "transmittance" are already familiar in the art, and are used herein according to their well-known meanings. Therefore, for example, the term "transmittance" herein means solar light transmittance, which is determined by visible light transmittance (T_visTY), infrared energy transmittance (T[R), and ultraviolet light transmittance (T_uv) Composed of. Total solar transmittance (TS or T too

CN 101925552 Β

Sun energy) can be a weighted average of these other values. Regarding these transmittances, the visible light transmittance used for construction purposes can be characterized by the standard III. D65 10 degree technology; and the visible light transmittance used for automotive purposes can be characterized by the standard III.Α 2 degree technology (for these technologies, see for example (ASTM Ε-308-95 added in this article)_οUse a specific infrared range (ie 2,500-40, OOOnm) for emissivity.

[0090] "Emissivity" ("E" or "e") is a measure or characteristic of the absorption and reflection of light at a given wavelength. It is usually expressed by the following formula: E=1-reflectivity film. For architectural use The emissivity value becomes quite important in the so-called "middle zone" of the infrared spectrum, sometimes also called the "far zone", that is, about 2,500-40,000 nm, for example, as referenced below by Lawrence Berkeley Laboratories WINDOW 4. lprogram, LBL-35298 (1994). Therefore, the term emissivity used in this article is used to refer to the ASTM titled Standard Test Method for Measuring and Calculating Emittance of Architectural Flat Glass Products Using Radiometric Measurements. The emissivity value measured in the infrared range specified in Standard E 1585-93. The standard and its regulations are incorporated herein by reference. In this standard, the emissivity is expressed as hemispherical emissivity (EJ and normal emissivity (E_n) (Normal emissivity).

[0091] The actual accumulation of the data to measure the emissivity value is conventional and can be done by using, for example, a Beckman Model 4260 spectrophotometer (Beckman Scientific Inst. Corp.) with a "VW" accessory. The spectrophotometer measures the reflectance of different wavelengths, and from this, the emissivity is calculated using the above-mentioned ASTM standard 1585-93.

[0092] The term R solar refers to the total solar reflectance (here, the glass side), and is the weighted average of IR reflectance, visible light reflectance, and UV reflectance. The term can be calculated according to the known DIN 410 and ISO 13837 (December 1998) tables 1,22 pages for automotive applications and the ASHRAE 142 standard known for construction applications, both of which are included in this article Cite to join.

[0093] "Haze" is as defined below. Diffusion of light in many directions causes a decrease in contrast. Herein, "haze" is defined in accordance with ASTM D 1003, which defines haze as the percentage of light that deviates from the incident light beam by more than 2.5 degrees on average. "Haze" can be measured with a BykGardner haze meter in this article (all haze values in this article are measured by this haze meter and expressed as a percentage of scattered light). Another term used herein is "sheet resistance". Sheet resistance (Rs) is a well-known term in the art, and is consistent with its well-known meaning in this article. Expressed here as ohms/square. Generally speaking, this term refers to the resistance ohms of the current passing through the layer system of any square on the glass substrate. Sheet resistance indicates how well a layer or layer system reflects infrared energy, and is therefore often used together with emissivity as a measure of this characteristic. The "sheet resistance" can be easily measured, for example, by using a 4-point probe ohmmeter, such as an adjustable 4-point resistivity probe with a Magnetron Instruments Corp. head, manufactured by Signatone Corp, of Santa Model M-800 manufactured by Clara, Calif.

[0094] As used herein, "chemical stability" is synonymous with the term "chemically resistant" in the art. The chemical stability was determined by an immersion test, in which a sample of 2" X5" or 2" X2" coated glass substrate was immersed in about 500ml containing 4.05% NaCl and 1.5% H at about 36°C₂0₂In the solution for 20 minutes. Chemical stability can also be determined by Cleveland test or climate chamber test, as shown below. Cleveland box device

[0095] For this test, the samples were cut into 4" X12" or 6" X12". Heat the water to 50Ό +/-2Ό and maintain the room temperature at 23Ό +/-3Ό (73°F+/-50°F). Place the sample above the hot water bath with the film side down. After a few minutes of exposure, the sample was covered with a thick layer of condensed water. Over time, water drips from the surface of the sample and forms new condensation on the sample. Condensed water has been present on the sample throughout the test.

[0096] Climate box device

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[0097] For this test, the sample was cut to 4" Χ6". For the static humidity test, the humidity is maintained at 98% relative humidity (RH) and the temperature is cycled between 45°C and 55°C within one hour.

[0098] Measurements made

[0099] The samples were taken out for measurement after 1, 3, and 7 days of exposure. Measure haze, emissivity and reflectivity on the film side.

[0100] Calculation of Δ Haze:

[0101] Haze = Haze after the test-Haze before the test

[0102] Calculation of AE:

[0103] ΔΕ = (AL*^A2+Aa*^A2+Ab*^A2） ^λ1/2, where AL, Aa*, and b* are the measured value before the test minus the measured value after the test.

[0104] Calculate the percentage change in emissivity using the following formula:

[0105] Reflectance change = (after E test-before E test) / (E glass-before E test)

[0106] The "scratch resistance" used herein is determined by the following test. The test uses the Erichsen Model494 brush tester and Scotch Brite 7448 abrasive (made of SiC grit adhered to the fibers of the rectangular pad), in which a standard weight brush or a modified brush holder is used to fix the abrasive of the friction sample. Use the brush or brush holder to perform 100-500 dry or wet strokes. The damage caused by scratching can be measured in three ways: change in emissivity, haze, and E on the film side. This test can be combined with immersion test or heat treatment to make scratches more visible. 200 dry strokes with a load of 135g on the sample can get good results. If necessary, you can reduce the number of strokes or use a softer grind. This is one of the advantages of this test. According to the different required resolution levels between samples, the load and/or the number of strokes can be adjusted. More intense experiments can be performed to get a better classification. The repeatability of this test can be checked by testing multiple samples of the same film within a specified period of time.

[0107] The term "heat treatment" as used herein means heating an object to a temperature sufficient to enable thermal tempering, bending, or thermal strengthening of the glass-containing object. This definition includes, for example, heating the coated article to a temperature of at least about 1100°F (for example, a temperature of about 550°C to 700°C) for a time long enough to enable tempering, thermal strengthening, or bending.

[0108] The term "solar heat gain coefficient (or SHGC)" ("g") is well known in the art and refers to a measure of total solar heat gain through a window system relative to incident solar radiation.

[0109] Unless otherwise specified, the other terms listed below have the following meanings in this specification.

[0110] Ag Silver

[0111] Ti0₂ Titanium dioxide

[0112] NiCrO_xAlloys or mixtures containing nickel oxides and lo oxides, the oxidation state can be changed from stoichiometric to sub-stoichiometric

[0113] NiCr alloy or mixture containing nickel and Luo

[0114] SiAlN_xOr Si% reactive sputtered silicon aluminum nitride. The sputtering target usually contains 1-20% by weight of Al. Sputtering gas is Ar, N₂And 0₂mixture. Depending on the gas mixture and sputtering power, the material is more or less absorptive [0115] SiAlN'Oy or SiN'Oy reactively sputtered silicon aluminum oxynitride. The sputtering target usually contains 1-20% by weight of Al. Sputtering gas is usually Ar. N₂And 0₂mixture. Depending on the gas mixture and sputtering power, the material has greater or lesser absorptivity

[0116] ZnAl_y0_xReactively sputtered Zn aluminum oxide. The sputtering target usually contains 1-20% by weight of Al. Sputtering gas is Ar and 0₂mixture

[0117] Zn_xSn_yAl_z0_wReactively sputtered zinc tin (aluminum) oxide. Sputtering targets usually contain zinc tin alloys optionally doped with aluminum

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gold. The zinc-tin alloy covers a wide range from zinc-rich alloys to tin-rich alloys. The sputtering gas is a mixture of Ar and Ο?

[0118] Zr is wrong

[0119] One or more layers of coatings applied to the substrate, which together affect the optical properties of the substrate

[0120] Low-e laminate has a transparent substrate with a low thermal emissivity optical coating composed of one or more layers

[0121] The barrier layer is a layer deposited to protect other layers during processing, especially a heat reflective silver layer. It can provide better adhesion to the upper layer, which may or may not exist after processing.

[0122] The layer has a certain thickness of material with a certain function and chemical composition, and is separated on each side by an interface with another material of a certain thickness with a different function and/or chemical composition. After processing, the deposited layer may or may not exist due to the reaction during processing. As used herein, "layer" includes a certain thickness of material that can be bounded by air or atmosphere on one side (for example, a top layer or protective outer coating on top of other layers in a coating stack)

[0123] Co-sputtering is simultaneously sputtered onto the substrate from two or more separate sputtering targets of two or more different materials. The resulting deposited coating may consist of reaction products of these different materials, or an unreacted mixture of two target materials, or both.

[0124] An intermetallic compound is a phase in an alloy system composed of two or more metal elements in a specific stoichiometric ratio. The metal element is electronic or interstitial bonding instead of being present in the solid solution typical of standard alloys. Intermetallic compounds usually have very different properties from their elemental components, especially increased hardness and brittleness. The increased hardness helps them have better scratch resistance than most standard metals or metal alloys.

[0125] The term mechanical stability refers to (unless otherwise specified) the use of a nylon brush (order number 0068.02.32) on the Erichsen brush tester (Model 494). The brush weighs 450 grams. The diameter of a single bristle is 0.3mm. Bristles Wet brush durability test with 4mm diameter arranged in groups). The test runs 1000 strokes (one stroke is equal to the complete cycle of the brush moving back and forth once). Brush the sample on the coated side and immerse the sample in deionized water during the brushing process.

[0126] In various embodiments, the low-emissivity laminate of the present invention exhibits the following independent characteristics: transmission Y is from about 30 to about 62, preferably from about 35 to about 55, and most preferably from about 40 to about 50 ; Transmission a* value is negative, most preferably from about -1 to about -6; preferably b* value is negative, most preferably from about 0 to about -6; RgY is from about 8 to about 20, more preferably from about 10- About 18, most preferably about 11 to about 17; Rga* is negative, most preferably about T to about -7; Rgb* value is preferably negative, most preferably about T to about -7; RfY is about 2 to about 12, more preferably about 2 to about 10, most preferably about 2 to about 8; Rfa* is negative, most preferably about -2 to about -20; Rfb* is preferably about -10 to about +10, most preferably From about -6 to about +6; and SHGC is from about 0.1 to about 0.30, up to about 0.34, more preferably from about 0.15 to about 0.28, and most preferably from about 0.20 to Approximately 0.25.

[0127] To further illustrate the present invention, the following non-limiting examples are provided:

Example 1

[0129] In this embodiment, as shown in FIG. 4, a low-e coating is deposited on a glass substrate to form a laminate having the following structure: glass/12nm oxide/10nm Ag/2nm NiCr._χ/4nmNiCr/72nm oxide/13nm Ag/2nm NiCr0_x/3nm NiCr/23nm oxide/7nm SiN. The oxide can be sputtered from Ti, Zn, Sn, ZnSn alloy or Bi target. Oxide may include Nb₂0₅o The oxide may contain up to about 20% by weight, preferably up to about 10% by weight of elements such as Al or B or similar elements to make the coater target conductive. The SiN overcoat is optional. This exemplary coating has an aesthetic transmission color with negative a* and b* values. SHGC is below 0.30. The coating has acceptable mechanical and chemical stability.

CN 101925552 Β

Example 2

[0131] In this embodiment, a low-e coating is deposited on a glass substrate to form a stack with the following structure: about 1/8 inch glass/0-15nm dielectric layer/2-10nm nucleation layer/ 8T5nm Ag/0.1-4nm barrier layer/0.2-8nm absorption layer/40-75n dielectric layer/2-10nm nucleation layer/8T8nm Ag/0.1-4nm barrier layer/0.2-8nm absorption Layer/10-40nm dielectric layer/overcoat. The dielectric layer may be oxides of Si, SiAl, SiB, SiZr (as in Example 1) or nitrides or oxynitrides, and it may contain up to about 20% by weight, preferably up to about 10% by weight of elements such as A1 or B to make the coater target conductive. The nucleation layer improves the properties of the Ag layer and is usually based on Zn oxide and contains up to 15% by weight of other elements such as Al, Sn or mixtures thereof.

[0132] When the dielectric layer is sputtered thereon, the barrier layer protects the Ag from plasma attack. It also improves chemical stability by controlling the diffusion of aggressive species such as O2, O2, O2, and Na+. Suitable barrier layers include, but are not limited to, NiCr, NiCrO', NiCrN'Oy, TiO', Ti, and other metals.

[0133] The outer coating is optional. If present, it has a positive effect on chemical and/or mechanical stability. Suitable overcoats include, but are not limited to, C, ZrSi, or silicide. Generally, the overcoat has relatively comparable properties compared to the underlying dielectric layer. If the dielectric layer is an oxide, the outer coating is one of the above materials, or a nitride or oxynitride (such as SiN or Si_xAl_yN_zO_c)°Or, when the dielectric layer is nitride or oxynitride, it is advantageous for the outer coating to be oxide, for example, but not limited to, ZrO₂, ZrSiO₂, SnO₂, ZrO_xN_y, Or Ti0_2O

Example 3

[0135] In this embodiment, a low-e coating is deposited on a glass substrate to form a laminate having the following structure: about 1/8 inch glass/3-15 nm SiAl_xN_y0_w/3-10nm ZnAl_y0_x/8-12nm Ag/l-4nmNiCrO_x/l. 5-3. Onm NiCr/55-65nm SiAl_xN_y0_w/3-10nm ZnAl_y0_x/10-15nm Ag/l-4nm NiCrO_x/O. 7-2. 2nm NiCr/24-32nm SiAl_xN_yO_w/Optional outer coating. If an outer coating is included, the outer coating can be selected from, but not limited to, l-5nm C, l-10nm ZrO? or ZrSi0_2OIn this embodiment, the measured light transmittance of the coating on the IGU is about 42% to about 46%, the SHGC is below about 0.30, and the transmission color is gray and can be adjusted from green to blue. The IGU includes 1/8" coated glass coated at position 2, and 1/8" transparent glass with a 1/2" gap. The coating has improved chemical and mechanical stability. In this example, the double layer NiCrO_x/NiCr has a positive effect on the desired properties. Because of the specific location of NiCr, the coating can be produced on existing coating machines that are mainly used for low-e coatings. It does not require special isolation of the NiCr sputtering target. These characteristics observed in the example laminate above are summarized in the table below:

[0136]

<td></td><td>Example 1</td><td>Example 2</td><td>Example 3</td>

<td>Beautiful</td><td>neutral</td><td>neutral</td><td>neutral</td>

<td>SHGG</td><td>Below 0.3</td><td>Below 0.3</td><td>Below 0.3</td>

<td>Beautiful</td><td>it is good</td><td>it is good</td><td>it is good</td>

<td>Angular stability</td><td>it is good</td><td>it is good</td><td>it is good</td>

<td>Moisture resistance</td><td>it is good</td><td>it is good</td><td>it is good</td>

<td>Chemical stability</td><td>it is good</td><td>it is good</td><td>it is good</td>

<td>Mechanical stability</td><td>it is good</td><td>it is good</td><td>it is good</td>

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Example 4

[0138] This example shows a preferred untempered coating with thickness data according to the present invention. The thickness is measured with DekTak profile curve instrument. In thickness measurement, the thickness of the entire laminate is measured first. Then, the top layer is removed in the coating machine, and the stack is measured to subtract SiA10_yN_xThe thickness of the top layer. Repeat the process, removing one layer at a time, until the bottom SiA10 is measured separately at the end_yN_xo The accuracy of the measurement is about ±0.5 nm.

[0139]

<td>Floor</td><td>Single layer thickness (nm)</td>

<td>Top SiA10_xN_y</td><td>33. 4</td>

<td>Top layer NiCr</td><td>0. 5</td>

<td>Ag</td><td>13. 5</td>

<td>ΖηΑ10_χ</td><td>6. 2</td>

<td>Middle SiA10_xN_y</td><td>68. 2</td>

<td>Bottom NiCr</td><td>3. 0</td>

<td>NiCrO_x</td><td>1. 3</td>

<td>Ag</td><td>10. 6</td>

<td>ZnA10_x</td><td>9. 0</td>

<td>Bottom SiA10_xN_y</td><td>23. 0</td>

Example 5

[0141] This example shows a preferred temperable coating comprising a carbon outer coating according to an embodiment of the present invention. The thickness is measured with a DekTak profiler as in Example 4 above. In these measurements, the top SiA10_xN_yIt is not separated from the carbon outer coating thickness. The carbon layer is estimated to be about 5nm thick, so the top layer SiA10_xN_yThe thickness is about 33nm.

[0142]

<td>Floor</td><td>Single layer thickness (nm)</td>

<td>Top SiA10_xN_yAnd carbon outer coating</td><td>38.6</td>

<td>Top layer NiCr</td><td>0. 1</td>

<td>Ag</td><td>13.2</td>

<td>ΖηΑ10_χ</td><td>9. 4</td>

<td>Middle SiA10_xN_y</td><td>67.4</td>

CN 101925552 Β

<td>Bottom NiCr</td><td>3. 6</td>

<td>NiCrO_x</td><td>1. 0</td>

<td>Ag</td><td>9. 8</td>

<td>ΖηΑ10_χ</td><td>10. 7</td>

<td>Bottom SiA10_xN_y</td><td>23. 3</td>

Example 6

[0144] The following table shows optical and electrical measurements performed on coatings according to embodiments of the present invention. "Low g A" products are annealed products that have not undergone any heat treatment. "Low g T" products are temperable products that include an outer coating according to the present invention. "BB" represents the measurement performed before tempering and "AB" represents the measurement performed after tempering. "N/A" means that no measurement result was obtained in this example.

[0145]

<td></td><td>Low g A (without heat treatment)</td><td colspan="2">Low gT</td>

<td></td><td>BB only</td><td>BB</td><td>AB</td>

<td>Transmission Y (single piece of 1/8" glass)</td><td>44.7</td><td>42.9</td><td>45.37</td>

<td>a*t (transmissive): (single piece of 1/8" glass)</td><td>-5.1</td><td>-0.51</td><td>5.3</td>

<td>b*t (transmissive): (single piece of 1/8" glass)</td><td>-4.3</td><td>1.59</td><td>-4.3</td>

<td>RtY (outside reflection): (single piece of 1/8" glass)</td><td>11.5</td><td>11.4</td><td>11.9</td>

<td>a*g (outside reflection): (single piece of 1/8" glass)</td><td>-1.7</td><td>-4.8</td><td>-2.7</td>

<td>b*g (outside reflection): (single 1/8" glass)</td><td>-4.2</td><td>-6.7</td><td>-4.6</td>

<td>SHGG: (in IGU)</td><td>0.23</td><td>N/A</td><td>N/A</td>

<td>SC</td><td>0.26</td><td>N/A</td><td>N/A</td>

<td>τUV</td><td>0.178</td><td>N/A</td><td>N/A</td>

<td>Rs</td><td>2.3</td><td>2.3</td><td>1.9</td>

<td>Transmission AE* (AL*a*b) (single 1/8" glass)</td><td></td><td></td><td>12.1</td>

<td>Glass side reflection AE* (AL*a*b) (single piece of 1/8" glass)</td><td></td><td></td><td>3.1</td>

Example 7

[0147] This example shows a summary of various coating specifications according to the present invention. According to some embodiments of the invention

CN 101925552 Β

The optical and electrical properties of the untempered and temperable coatings will be within the specifications listed in the table below.

[0148]

<td colspan="12">Low-g coating normal incident color specification</td>

<td></td><td colspan="3">transmission</td><td colspan="3">Glass side R</td><td colspan="3">Film side R</td><td colspan="2"></td>

<td></td><td>TY</td><td>a*</td><td>b*</td><td>RGY</td><td>a*</td><td>b*</td><td>RFY</td><td>a*</td><td>b*</td><td>NCRs</td><td>SHGC</td>

<td>The smallest</td><td>42.0</td><td>-6.0</td><td>-4.5</td><td>10.0</td><td>-3.0</td><td>-3.0</td><td>2.0</td><td>-1&amp;0</td><td>-4.0</td><td>2.0</td><td>0.22</td>

<td>maximum</td><td>46.0</td><td>-3.0</td><td>-1.5</td><td>12.0</td><td>-1.0</td><td>-6.0</td><td>6.0</td><td>-10.0</td><td>4.0</td><td>2.4</td><td>0.25</td>

Example 8

[0150] This example represents a substrate with a coating according to the invention. It should be noted that an optional carbon outer coating (not described) can be used in embodiments that are to be subjected to tempering or heat treatment, and its thickness is preferably about 3 nm to about 5 nm. Preferably, the optional overcoat is not included in embodiments where tempering or heat treatment is not intended. Such embodiments are referred to herein as "annealing". For the example embodiment shown below, the layer thickness is an approximation. The accuracy for the dielectric layer and the Ag layer is within the range of about ±20%. The thickness of the NiCr layer can be plus 200% minus 20%. In annealed coatings, the ZnA10' layer is generally thinner and can be as low as 60% of the values indicated in the following table.

[0151]

<td>Floor</td><td>Single layer thickness (nm)</td>

<td>Top SiA10_xN_y</td><td>31</td>

<td>Top layer NiCr</td><td>1. 6</td>

<td>Ag</td><td>11. 4</td>

<td>ZnA10_x</td><td>8. 4</td>

<td>Middle SiA10_xN_y</td><td>79. 7</td>

<td>Bottom NiCr</td><td>1. 1</td>

<td>Ag</td><td>11. 2</td>

<td>ZnA10_x</td><td>7. 7</td>

<td>Bottom SiA10_xN_y</td><td>24. 2</td>

<td>Substrate</td><td></td>

[0152] The description of these materials listed in the table is as follows:

[0153] In the embodiment represented by this example, the SiAlOf plant is reactively sputtered with a rotatable cathode of silicon/10wt% aluminum. The reactive gas is about 90% nitrogen flow and 10% oxygen. This material is used for the bottom, middle and top

CN 101925552 Β

The main dielectric layer. Although stoichiometric changes occur from layer to layer and between each production run, all SiAlO'y in this example is substoichiometric. For SiAl, there is insufficient nitrogen and oxygen in the sputtering gas to obtain a fully reacted oxynitride. The atomic ratio in this layer is approximately Si₄0₀.₄N₅o

[0154] ZnA10=-In the embodiment represented by this example, this material is reactively sputtered with a rotatable or planar cathode of zinc/1.5% by weight of aluminum. The sputtering gas is composed of nitrogen and enough oxygen so that the oxide to be deposited is in a fully oxidized state. This layer serves as a nucleation layer for silver and is consistent with such a layer generally described in low-e patent documents.

[0155] Calendar-In the embodiment represented by this example, the silver layer can be sputtered in pure nitrogen or a small amount of oxygen can be added. This oxygen contributes to the mechanical stability in the tempered form, but is not always necessary.

[0156] In the embodiment represented by this example, this thin protective or barrier layer sputtered on silver is deposited from a DC planar target and sputtered only in nitrogen. In this embodiment, these layers are completely metallic, except for unintentional impurities such as gas crosstalk from adjacent cathodes.

[0157] Armor-The temperable form of this example embodiment uses a 3-5 nm thick sputtered carbon outer coating as the outermost layer, which is DC magnetron sputtered in nitrogen.

[0158] In this embodiment, the gas distribution of all materials is symmetrical in the longitudinal direction. In the lateral direction, in order to adjust the lateral uniformity, the gas flow of the reactive material can be changed.

[0159] In the various embodiments described herein, it is preferable that the top Ag layer is thicker than the bottom Ag layer and the bottom absorption barrier layer is thicker than the top absorption barrier. (In this example, the absorption barrier is NiCr, but it should be noted that other embodiments use NiCr._xO ) Such a reverse thickness ratio is beneficial to realize the preferred color of the laminate. It is also preferred that the bottom dielectric layer (SiAlO'Ny in this embodiment) is thicker than the middle and top dielectric layers. Such a structure is also beneficial for realizing preferred colors. In addition, the bottom layer nucleation layer is preferred (in this example, the ZnAlOj is thicker than the top nucleation layer. Such a structure improves mechanical and chemical stability. In a preferred embodiment, the layer ratio of the laminate generally falls within the following range : [0160] Bottom Ag/Top Ag: about 0.8-about 1.0

[0161] Bottom layer NiCr/top layer NiCr: about 1.2 to about 2.0

[0162] Bottom layer ZnA10_x/ Top layer ZnA10_x : About 1.2-about 2.0

[0163] Bottom SiA10_xN_y/ Top SiA10_xN_y : About 0.4 to about 0.8

[0164] Middle SiA10_xN_y/ Top SiAlO'Ny: about 1.5 to about 2.5.

[0165] In addition, for the top dielectric layer, it is also advantageous to have a lower refractive index than the bottom or middle dielectric layer. The preferred range includes:

[0166] Top layer refractive index: about 1.8 to about 2.3;

[0167] Bottom or middle layer: about 2.0 to about 2.5.

[0168] This example shows the following colors and solar properties.

[0169] The normal incidence color specification of a single piece of low G 1/8" glass

[0170]

CN 101925552 Β

<td></td><td colspan="3">transmission</td><td colspan="3">Reflection (uncoated side)</td><td colspan="3">Reflection (coating side)</td><td></td><td></td>

<td>Low GA</td><td>TY</td><td>a*</td><td>b*</td><td>RGY</td><td>a*</td><td>b*</td><td>RFY</td><td>a*</td><td>b*</td><td>NC Rs</td><td>SHGC</td>

<td>The smallest</td><td>42.0</td><td>-6.0</td><td>-4.5</td><td>12.0</td><td>-3.0</td><td>-3.0</td><td>2.0</td><td>-12.0</td><td>-4.0</td><td>2.0</td><td>0.22</td>

<td>maximum</td><td>46.0</td><td>-3.0</td><td>-1.5</td><td>16.0</td><td>-1.0</td><td>-6.0</td><td>6.0</td><td>-4.0</td><td>2.0</td><td>2.4</td><td>0.25</td>

[0171] "NC Rs" refers to non-contact surface resistance and the unit of this measurement is "ohm/square".

[0172] In the tempered embodiment, for the glass side reflection color, the tempered color change or AE is greater than 3. This is due to burnout of the carbon layer.

Example 9

[0174]

<td>material</td><td>Annealed stack (nm)</td><td>Tempering stack (nm)</td>

<td>carbon</td><td>n/a</td><td>0. 14</td>

<td>Top SiA10_xN_y</td><td>36. 4</td><td>36. 2</td>

<td>Top layer NiCrO_x</td><td>5. 7</td><td>4. 7</td>

<td>Top Ag</td><td>10. 2</td><td>11. 6</td>

<td>Top layer ZnA10_x</td><td>6. 5</td><td>5. 3</td>

<td>Middle SiA10_xN_y</td><td>71. 0</td><td>71. 1</td>

<td>Underlayer NiCrO_x</td><td>2. 4</td><td>5.2</td>

<td>Bottom Ag</td><td>14. 8</td><td>14. 1</td>

<td>Bottom ZnA10_x</td><td>3. 9</td><td>16. 5</td>

<td>Bottom SiA10_xN_y</td><td>22. 4</td><td>24. 3</td>

<td>Glass substrate</td><td>3mm</td><td>3mm</td>

[0175] This example represents a substrate with a coating according to the invention. It should be noted that an optional carbon outer coating (not described) can be used in embodiments that are to be subjected to tempering or heat treatment, and its thickness is preferably about 3 nm to about 5 nm. Preferably, the optional overcoat is not included in embodiments where tempering or heat treatment is not intended. Such embodiments are referred to herein as "annealing". For the embodiments shown in the table below, the layer thicknesses are approximate.

[0176] For this example embodiment, the thickness measurement is performed using a Dektak profilometer. Cover the entire stack on a glass slide with ink lines to obtain a total stack thickness. By turning off the top material cathode each time, one layer at a time until only the bottom SiA10 is present_xN_yTo prepare other samples. Remove the ink line with isopropyl alcohol and measure the resulting step with Dek Tak. Calculate the thickness of the single layer by subtracting the thickness of the remaining stack below. Therefore, the accuracy of the single layer is affected by them

CN 101925552 Β

The accuracy of the lower layer is affected. The accuracy of the dielectric layer (SiAlO'Ny) and silver (Ag) is within ±20%. NiCrO_xThe thickness range of the layer is ±100%. Annealing embodiments according to the present invention tend to have a thinner bottom layer ZnAIOx than the temperable form.

[0177] The description of these materials as listed in this example embodiment is as follows:

[0178] SiAlO^N plant in the embodiment represented by this example, this material is reactively sputtered from a rotatable cathode of silicon/10wt% aluminum. The reactive gas is about 90% nitrogen flow and 10% oxygen. This material is used for the main dielectric layers of the bottom, middle and top layers.

[0179] ΖηΑΙΟχ- In the embodiment represented by this example, this material is reactively sputtered with a rotatable or flat cathode of zinc/1. 5 wt% aluminum. The sputtering gas is composed of nitrogen and enough oxygen so that the oxide to be deposited is in a fully oxidized state. This layer serves as a nucleation layer for silver and is consistent with such a layer generally described in low-e patent documents.

[0180] Calendar-In the embodiment represented by this example, the silver layer can be sputtered in pure nitrogen or a small amount of oxygen can be added. Oxygen contributes to the mechanical stability in the tempered form.

[0181] NiCrO plant In the embodiment represented by this example, this thin protective layer or barrier layer sputtered on silver is deposited from a planar target and sputtered in a nitrogen-oxygen mixture. The ratio of power to oxygen flow (seem) is used to evaluate the NiCrO sputtering_xMedium oxidation method. Fully oxidized NiCrO_xThe ratio used is 10:1. The ratio used in the preferred coating according to this exemplary embodiment is 7.5: 1-&amp;0: Ε

[0182] Armor-The temperable form of this example embodiment uses a 3-5 nm thick sputtered carbon outer coating as the outermost layer.

This material is DC magnetron sputtered in nitrogen.

[0183] In this embodiment, the gas distribution of all materials is symmetrical in the longitudinal direction. In the lateral direction, in order to adjust the lateral uniformity, the gas flow of the reactive material can be changed.

[0184] This embodiment shows the following optical characteristics:

CN 101925552 Β

<td rowspan="2">Optical properties</td><td colspan="2">Annealed</td><td colspan="2">Temperable</td>

<td>Monolithic</td><td>IGU</td><td>Monolithic</td><td>IGU</td>

<td>Tvis</td><td>65.5%</td><td>59.8%</td><td>69.3%</td><td>63.1%</td>

<td>a*t</td><td>-3.29</td><td>-3.73</td><td>-1.13</td><td>-1.87</td>

<td>B*t</td><td>3.67</td><td>3.66</td><td>1.95</td><td>2.08</td>

<td>Outside reflection (glass side)</td><td>11.0%</td><td>14.4%</td><td>12.2%</td><td>15.9%</td>

<td>a*g</td><td>-1.56</td><td>-2.06</td><td>-1.48</td><td>-1.49</td>

<td>b*g</td><td>-7.41</td><td>-5.36</td><td>-3.56</td><td>-2.31</td>

<td>Inside reflection (film side)</td><td>5.7%</td><td>12.4%</td><td>8.9%</td><td>15.0%</td>

<td>a*f</td><td>-13.3</td><td>-6.09</td><td>-15.9</td><td>-9.09</td>

<td>b*f</td><td>1.36</td><td>1.13</td><td>2.92</td><td>2.28</td>

<td>SHGC</td><td>0.346</td><td>0.305</td><td>0.371</td><td>0.329</td>

<td>SC</td><td>0.40</td><td>0.35</td><td>0.43</td><td>0.38</td>

<td>Tuv</td><td>0.27</td><td>0.23</td><td>0.30</td><td>0.25</td>

[0186] This example shows the following colors and solar properties:

[0187]

<td>Middle G</td><td>TY</td><td>a*t</td><td>b*t</td><td>RgY</td><td>*ag</td><td>b*g</td><td>RfY</td><td>a*f</td><td>b*f</td><td>NC Rs</td><td>SHGC</td>

<td>The smallest</td><td>63%</td><td>-4</td><td>0</td><td>10%</td><td>-4</td><td>-7</td><td>5%</td><td>-16</td><td>0</td><td>1. 5</td><td>0.25</td>

<td>maximum</td><td>67%</td><td>0</td><td>4</td><td>12%</td><td>-1</td><td>-3</td><td>9%</td><td>-8</td><td>8</td><td>2. 5</td><td>0.32</td>

[0188] "NC Rs" refers to non-contact surface resistance and the unit of this measurement is "ohm/square".

[0189] In the tempering embodiment, AE is as follows:

[0190] For transmission, 6 color units

[0191]-For glass side reflection, 10 color units

[0192] For film side reflection, 14 color units.

[0193] This color change is due to burn-out of the carbon layer.

Example 10

[0195] This embodiment includes a coating having the following structure, and the oxygen:kw ratio used in the NiCr layer is 2:1.

[0196]

<img file="CN101925552B_D0003.tif" />

CN 101925552 Β

<img file="CN101925552B_D0004.tif" />

[0197] The process test data is provided in the following table:

[0198] Use 2: 1 NiCrO_xTempering coating machine settings

[0199]

<td>cathode</td><td>target</td><td>Voltage (V)</td><td>I (ampere)</td><td>Ρ(kW)</td><td>Ar(seem)</td><td>0₂(seem)</td><td>N₂(seem)</td><td>Pressure (X 10^_3hPA)</td><td>Reactive gas: kW ratio</td>

<td>1</td><td>SiAl</td><td>425. 9</td><td>194. 1</td><td>51. 9</td><td>300</td><td>30</td><td>344</td><td>3. 66</td><td>6. 63</td>

<td>2</td><td>SiAl</td><td>601. 3</td><td>149. 7</td><td>51.9</td><td>300</td><td>30</td><td>344</td><td>4. 22</td><td>6. 63</td>

<td>5</td><td>ZnAl</td><td>431. 1</td><td>179. 3</td><td>39. 3</td><td>150</td><td>420</td><td>0</td><td>2. 65</td><td>0. 00</td>

<td>7</td><td>ZnAl</td><td>328. 7</td><td>178. 4</td><td>39.4</td><td>150</td><td>420</td><td>0</td><td>1. 88</td><td>10. 66</td>

<td>10</td><td>Ag</td><td>436. 3</td><td>29. 8</td><td>13</td><td>100</td><td>20</td><td>0</td><td>1. 12</td><td>1. 54</td>

<td>20</td><td>NiCr</td><td>531. 8</td><td>73. 2</td><td>39</td><td>300</td><td>76. 4</td><td>0</td><td></td><td>1. 96</td>

<td>4</td><td>SiAl</td><td>604. 2</td><td>193. 5</td><td>67. 8</td><td>300</td><td>35</td><td>482</td><td>1. 29</td><td>7. 11</td>

<td>12</td><td>SiAl</td><td>615.2</td><td>208. 3</td><td>68. 3</td><td>300</td><td>30</td><td>482</td><td>4. 87</td><td>7. 06</td>

<td>13</td><td>SiAl</td><td>581</td><td>202. 1</td><td>68</td><td>300</td><td>30</td><td>482</td><td>4. 25</td><td>7. 09</td>

<td>15</td><td>SiAl</td><td>540. 5</td><td>212. 3</td><td>67. 7</td><td>300</td><td>30</td><td>482</td><td></td><td>7. 12</td>

CN 101925552 Β

<td>17</td><td>SiAl</td><td>549. 8</td><td>207. 5</td><td>67. 8</td><td>300</td><td>30</td><td>482</td><td>4. 45</td><td>7. 11</td>

<td>17A</td><td>SiAl</td><td>505. 8</td><td>213. 7</td><td>67. 5</td><td>300</td><td>30</td><td>482</td><td>4. 59</td><td>7. 14</td>

<td>21</td><td>ZnAl</td><td>392. 9</td><td>133. 3</td><td>39. 5</td><td>150</td><td>500</td><td>0</td><td>1. 66</td><td>0. 00</td>

<td>23</td><td>Ag</td><td>565. 4</td><td>14. 6</td><td>8. 2</td><td>100</td><td>20</td><td>0</td><td>1. 62</td><td>0. 00</td>

<td>19</td><td>NiCr</td><td>536. 2</td><td>31. 8</td><td>17. 1</td><td>300</td><td>35. 6</td><td>0</td><td>1. 56</td><td>2. 08</td>

<td>26</td><td>SiAl</td><td>471. 6</td><td>130. 7</td><td>35. 1</td><td>300</td><td>30</td><td>254</td><td></td><td>0. 85</td>

<td>27</td><td>SiAl</td><td>500. 6</td><td>118. 6</td><td>35. 3</td><td>300</td><td>30</td><td>254</td><td></td><td>0. 85</td>

<td>28</td><td>SiAl</td><td>484. 4</td><td>121. 9</td><td>35. 2</td><td>300</td><td>30</td><td>254</td><td>4. 58</td><td>7. 22</td>

<td>30</td><td>SiAl</td><td>560. 8</td><td>128. 2</td><td>35. 4</td><td>300</td><td>30</td><td>254</td><td></td><td>7. 18</td>

<td>18</td><td>C</td><td>519. 1</td><td>133. 4</td><td>34. 2</td><td>500</td><td>0</td><td>0</td><td>2. 93</td><td>0. 00</td>

Example 11

[0201] In this embodiment, an annealed form of the coating according to the present invention is provided. A description of the laminate structure and characteristics is included in the table below. In this example embodiment, NiCrO is used_xThe absorption barrier.

CN 101925552 Β

[0202]

<td></td><td colspan="3">Material thickness (nm)</td><td></td><td></td><td></td><td></td><td></td>

<td></td><td></td><td></td><td></td><td></td><td>Annealed</td><td></td><td>-40%</td><td>+40%</td>

<td>Floor</td><td>Preferred range</td><td></td><td>More preferred</td><td></td><td>Example</td><td></td><td></td><td></td>

<td>Bottom SiN</td><td>13-31nm</td><td></td><td>18-27nm</td><td></td><td>22.38</td><td></td><td>13</td><td>31</td>

<td>Bottom ZnO_x</td><td>2-5nm</td><td></td><td>3-5nm</td><td></td><td>3.92</td><td></td><td>2</td><td>5</td>

<td>Bottom Ag</td><td>9-21nm</td><td></td><td>12-18nm</td><td></td><td>14.76</td><td></td><td>9</td><td>21</td>

<td>Underlayer NiCrO_x</td><td>l-3nm</td><td></td><td>2-3nm</td><td></td><td>2.42</td><td></td><td>1</td><td>3</td>

<td>Middle SiN</td><td>43-99nm</td><td></td><td>57-85nm</td><td></td><td>70.98</td><td></td><td>43</td><td>99</td>

<td>Top layer ΖηΟχ</td><td>4-9nm</td><td></td><td>5-8nm</td><td></td><td>6.52</td><td></td><td>4</td><td>9</td>

<td>Top Ag</td><td>6-14nm</td><td></td><td>8-12nm</td><td></td><td>10.20</td><td></td><td>6</td><td>14</td>

<td>Top layer NiCrO_x</td><td>3-8nm</td><td></td><td>5-7nm</td><td></td><td>5.68</td><td></td><td>3</td><td>8</td>

<td>Top SiN</td><td>22-5 lnm</td><td></td><td>29-44nm</td><td></td><td>36.42</td><td></td><td>22</td><td>51</td>

<td></td><td></td><td></td><td></td><td></td><td></td><td></td><td></td><td></td>

<td></td><td colspan="2">Low E characteristics</td><td></td><td></td><td></td><td></td><td></td><td></td>

<td></td><td></td><td></td><td></td><td></td><td></td><td></td><td></td><td></td>

<td>characteristic</td><td>general</td><td></td><td>More preferred</td><td></td><td colspan="2">Most preferred</td><td></td><td></td>

<td>Rs (ohm/square)</td><td>&lt;/=5.0</td><td></td><td>&lt;/=2.0</td><td></td><td>&lt;/=1.5</td><td></td><td></td><td></td>

<td>En</td><td>&lt;/=0.07</td><td></td><td>&lt;/=0.04</td><td></td><td>&lt;/=0.03</td><td></td><td></td><td></td>

<td></td><td></td><td></td><td></td><td></td><td></td><td></td><td></td><td></td>

<td></td><td colspan="3">Monolithic solar characteristics</td><td></td><td></td><td></td><td></td><td></td>

<td></td><td></td><td></td><td></td><td></td><td></td><td></td><td></td><td></td>

<td>characteristic</td><td>general</td><td></td><td>More preferred</td><td></td><td>Example</td><td></td><td></td><td></td>

<td>TY(D65,10°)</td><td>&gt;/=64%</td><td></td><td>&gt;/=66%</td><td></td><td>65.5%</td><td></td><td></td><td></td>

<td>a*_t(D65,10°)</td><td>-10.0-0.0</td><td></td><td>-4.0 to -2.0</td><td></td><td>-3.29</td><td></td><td></td><td></td>

<td>b*t(D65,10.)</td><td>0-4.0</td><td></td><td>2.0-4.0</td><td></td><td>3.67</td><td></td><td></td><td></td>

<td>RgY(D65,10°)</td><td>4%-14%</td><td></td><td>10%-12%</td><td></td><td>11%</td><td></td><td></td><td></td>

<td>a*_g(D65,10°)</td><td>-10-0.0</td><td></td><td>-4.0 to -1.0</td><td></td><td>-1.56</td><td></td><td></td><td></td>

<td>b*g(D65,10.)</td><td>-10-0.0</td><td></td><td>-7.0 to -3.0</td><td></td><td>-7.41</td><td></td><td></td><td></td>

<td>RfY(D65,10°)</td><td>4%-14%</td><td></td><td>5%-9%</td><td></td><td>5.7%</td><td></td><td></td><td></td>

[0203]

CN 101925552 Β

<td>a*_f(D65,10°)</td><td>-20-0. 0</td><td></td><td>T6 to -&amp; 0</td><td></td><td>-13. 3</td><td></td><td></td><td></td>

<td>b*_f(D65,10°)</td><td>0. 0-10</td><td></td><td>0. 0-8. 0</td><td></td><td>1. 36</td><td></td><td></td><td></td>

<td>SHGC</td><td>&lt; / = 0. 40</td><td></td><td>&lt; / = 0. 35</td><td></td><td>0. 346</td><td></td><td></td><td></td>

<td>SC</td><td>&lt; / = 0. 49</td><td></td><td>&lt; / = 0. 46</td><td></td><td>0. 40</td><td></td><td></td><td></td>

<td>Tuv</td><td>&lt; / = 0. 35</td><td></td><td>&lt; / = 0. 30</td><td></td><td>0. 27</td><td></td><td></td><td></td>

<td>Tuv loss weighted (ISO)</td><td>&lt; / = 0. 49</td><td></td><td>&lt; / = 0. 46</td><td></td><td>0. 514</td><td></td><td></td><td></td>

[0204]

<td></td><td colspan="2">IGU solar characteristics</td><td></td><td></td><td></td>

<td></td><td></td><td></td><td></td><td></td><td></td>

<td>characteristic</td><td>general</td><td></td><td>More preferred</td><td></td><td>Example</td>

<td>TY(D65,10°)</td><td>&gt;/=58%</td><td></td><td>&gt;/=60%</td><td></td><td>59.8%</td>

<td>a*_t(D65,10°)</td><td>-10-0.0</td><td></td><td>-4.0 to -2.0</td><td></td><td>-3.73</td>

<td>b*_t(D65,10°)</td><td>0-4.0</td><td></td><td>2.0-4.0</td><td></td><td>3.66</td>

<td>RgY(D65,10°)</td><td>4%-20%</td><td></td><td>10%-15%</td><td></td><td>14.4%</td>

<td>a*_g(D65,10°)</td><td>-10-0.0</td><td></td><td>-4.0 to -1.0</td><td></td><td>-2.06</td>

<td>b*_g(D65,10°)</td><td>-10-0.0</td><td></td><td>-7.0 to -3.0</td><td></td><td>-5.36</td>

<td>RfY(D65,10°)</td><td>4%-20%</td><td></td><td>10%-15%</td><td></td><td>12.4%</td>

<td>a*((D65,10°)</td><td>-20-0.0</td><td></td><td>-16 to -8.0</td><td></td><td>-6.09</td>

<td>b*f(D65,10°)</td><td>0.0-10.0</td><td></td><td>0.0-&amp;0</td><td></td><td>1.33</td>

<td>SHGC</td><td>&lt;/=0.35</td><td></td><td>&lt;/=0.30</td><td></td><td>0.305</td>

<td>SC</td><td>&lt;/=0.43</td><td></td><td>&lt;/=0.40</td><td></td><td>0.35</td>

<td>u value</td><td>0.20-0.30</td><td></td><td>0.22-0.25</td><td></td><td>0.24</td>

<td>Tuv</td><td>&lt;/=0.30</td><td></td><td>&lt;/=0.25</td><td></td><td>0.23</td>

<td>Tuv loss weighted (ISO)</td><td>&lt;/=0.49</td><td></td><td>&lt;/=0.46</td><td></td><td>0.464</td>

<td></td><td></td><td></td><td></td><td></td><td></td>

<td></td><td></td><td></td><td></td><td></td><td></td>

<td></td><td></td><td></td><td></td><td></td><td></td>

CN 101925552 Β

[0205]

<td></td><td></td><td colspan="2">Example coating;</td><td colspan="3">Machine set annealing test #24</td><td></td><td></td><td></td>

<td>cathode</td><td>target</td><td>Voltage (V)</td><td>I (ampere)</td><td>P(kW)</td><td>Ar(seem)</td><td>0₂(seem)</td><td>n₂(seem)</td><td>Pressure (xlO'³hPA)</td><td>Reactive gas: kW</td>

<td>1</td><td>SiAl</td><td>537.6</td><td>197.9</td><td>55.1</td><td>300</td><td>30</td><td>358</td><td>3.28</td><td>6.50</td>

<td>2</td><td>SiAl</td><td>494.2</td><td>206.6</td><td>55</td><td>300</td><td>30</td><td>358</td><td>3.44</td><td>6.51</td>

<td>6</td><td>SiAl</td><td>511.6</td><td>231.7</td><td>55.7</td><td>300</td><td>30</td><td>358</td><td>3.09</td><td>6.43</td>

<td>5</td><td>ZnAl</td><td>448.5</td><td>111.4</td><td>29.3</td><td>150</td><td>350</td><td>0</td><td>1.61</td><td>11.95</td>

<td>9</td><td>Ag</td><td>526</td><td>52.1</td><td>27.5</td><td>100</td><td>0</td><td>0</td><td>?</td><td>0.00</td>

<td>20</td><td>NiCr</td><td>574.7</td><td>41.4</td><td>23.8</td><td>100</td><td>185</td><td>0</td><td>?</td><td>7.77</td>

<td>11</td><td>SiAl</td><td>656.8</td><td>222.8</td><td>66.7</td><td>300</td><td>30</td><td>405</td><td>3.37</td><td>6.07</td>

<td>4</td><td>SiAl</td><td>495.9</td><td>247.1</td><td>66.1</td><td>300</td><td>35</td><td>405</td><td>2.93</td><td>6.13</td>

<td>12</td><td>SiAl</td><td>671.3</td><td>212.7</td><td>66.4</td><td>300</td><td>30</td><td>405</td><td>5.25</td><td>6.10</td>

<td>13</td><td>SiAl</td><td>579.9</td><td>217.5</td><td>66.1</td><td>300</td><td>30</td><td>405</td><td>4.74</td><td>6.13</td>

<td>14</td><td>SiAl</td><td>474</td><td>255.9</td><td>66</td><td>300</td><td>30</td><td>405</td><td>4.24</td><td>6.14</td>

<td>15</td><td>SiAl</td><td>531.8</td><td>222.6</td><td>65.9</td><td>300</td><td>30</td><td>405</td><td>1.03</td><td>6.15</td>

<td>16</td><td>SiAl</td><td>480.3</td><td>209.9</td><td>65.9</td><td>300</td><td>30</td><td>405</td><td>4.29</td><td>6.15</td>

<td>17</td><td>SiAl</td><td>583.3</td><td>211.8</td><td>65.9</td><td>300</td><td>30</td><td>405</td><td>4.57</td><td>6.15</td>

<td>17Α</td><td>SiAl</td><td>545.7</td><td>229.1</td><td>65.8</td><td>300</td><td>30</td><td>405</td><td>4.43</td><td>6.16</td>

<td>18Α</td><td>ZnAl</td><td>361.1</td><td>147.6</td><td>29.8</td><td>150</td><td>390</td><td>0</td><td>1.18</td><td>13.09</td>

<td>22</td><td>Ag</td><td>667.2</td><td>26.2</td><td>17.5</td><td>100</td><td>0</td><td>0</td><td>?</td><td>0.00</td>

<td>19</td><td>NiCr</td><td>612.6</td><td>3&amp;1</td><td>23.3</td><td>100</td><td>192</td><td>0</td><td>?</td><td>8.24</td>

<td>25</td><td>SiAl</td><td>483.8</td><td>194.3</td><td>47.7</td><td>300</td><td>30</td><td>339</td><td>1.72</td><td>7.11</td>

<td>26</td><td>SiAl</td><td>443.9</td><td>195.8</td><td>47.9</td><td>300</td><td>30</td><td>339</td><td>4.99</td><td>7.08</td>

<td>27</td><td>SiAl</td><td>489</td><td>177.5</td><td>48</td><td>300</td><td>30</td><td>339</td><td>2.03</td><td>7.06</td>

<td>28</td><td>SiAl</td><td>384.3</td><td>186</td><td>47.8</td><td>300</td><td>30</td><td>339</td><td>5.1</td><td>7.09</td>

<td>29</td><td>SiAl</td><td>479.7</td><td>185.2</td><td>47.9</td><td>300</td><td>30</td><td>339</td><td>5.66</td><td>7.08</td>

<td>30</td><td>SiAl</td><td>524.9</td><td>177.7</td><td>48</td><td>300</td><td>30</td><td>339</td><td>3.83</td><td>7.06</td>

CN 101925552 Β

[0206]

<td></td><td></td><td></td><td></td><td></td>

<td>sample</td><td></td><td></td><td></td><td></td>

<td>#505 AC31 annealed</td><td colspan="3">Monolithic &amp; IGU solar characteristics</td><td></td>

<td></td><td></td><td></td><td></td><td></td>

<td>characteristic</td><td>Monolithic</td><td></td><td>IGU</td><td></td>

<td>TY(D65,10°)</td><td>65.5%</td><td></td><td>59.8%</td><td></td>

<td>a*_t(D65,10°)</td><td>-3.29</td><td></td><td>-3.73</td><td></td>

<td>b*_t(D65,10°)</td><td>3.67</td><td></td><td>3.66</td><td></td>

<td>RgY(D65,10°)</td><td>11%</td><td></td><td>14.4%</td><td></td>

<td>a*_g(D65,10°)</td><td>-1.56</td><td></td><td>-2.06</td><td></td>

<td>b*_g(D65,10°)</td><td>-7.41</td><td></td><td>-5.36</td><td></td>

<td>RfY(D65,10°)</td><td>5.7%</td><td></td><td>12.4%</td><td></td>

<td>a*f(D65,10°)</td><td>-13.3</td><td></td><td>-6.09</td><td></td>

<td>b*f(D65,10^o)</td><td>1.36</td><td></td><td>1.33</td><td></td>

<td>SHGC</td><td>0.346</td><td></td><td>0.305</td><td></td>

<td>SC</td><td>0.40</td><td></td><td>0.35</td><td></td>

<td>Tuv</td><td>0.27</td><td></td><td>0.23</td><td></td>

<td>Tuv loss weight (ISO)</td><td>0.514</td><td></td><td>0.464</td><td></td>

<td></td><td></td><td></td><td></td><td></td>

<td></td><td></td><td></td><td></td><td></td>

<td></td><td></td><td></td><td></td><td></td>

Example 12

[0208] In this embodiment, a temperable form of the coating according to the invention is provided. A description of the laminate structure and characteristics is included in the table below. In this example embodiment, NiCrO is used_xThe absorption barrier.

[0209]

CN 101925552 Β

<td></td><td colspan="2">material</td><td colspan="4">Bu thickness (nm)</td><td></td><td colspan="2"></td><td></td><td></td><td></td>

<td></td><td colspan="2"></td><td colspan="2"></td><td colspan="2"></td><td></td><td colspan="2">Temperable</td><td></td><td>-40%</td><td>+40%</td>

<td>Floor</td><td colspan="2">Preferred range</td><td colspan="2"></td><td colspan="2">More preferred</td><td></td><td colspan="2">Example</td><td></td><td></td><td></td>

<td>Bottom SiN</td><td colspan="2">15-34nm</td><td colspan="2"></td><td colspan="2">19-29iun</td><td></td><td colspan="2">24.32</td><td></td><td>15</td><td>34</td>

<td>Bottom ZnO_x</td><td colspan="2">10-23nm</td><td colspan="2"></td><td colspan="2">13-20nm</td><td></td><td colspan="2">16.50</td><td></td><td>10</td><td>23</td>

<td>Bottom Ag</td><td colspan="2">8-20nm</td><td colspan="2"></td><td colspan="2">ll-17nm</td><td></td><td colspan="2">14.06</td><td></td><td>8</td><td>20</td>

<td>Underlayer NiCrO_x</td><td colspan="2">3-7nm</td><td colspan="2"></td><td colspan="2">4-6nm</td><td></td><td colspan="2">5.24</td><td></td><td>3</td><td>7</td>

<td>Middle SiN</td><td colspan="2">43-100nm</td><td colspan="2"></td><td colspan="2">57-85nm</td><td></td><td colspan="2">71.10</td><td></td><td>43</td><td>100</td>

<td>Top layer ZnO_x</td><td colspan="2">3-7nm</td><td colspan="2"></td><td colspan="2">4-6nm</td><td></td><td colspan="2">5.34</td><td></td><td>3</td><td>7</td>

<td>Top Ag</td><td colspan="2">7-16nm</td><td colspan="2"></td><td colspan="2">9-14nm</td><td></td><td colspan="2">11.60</td><td></td><td>7</td><td>16</td>

<td>Top layer NiCrO_x</td><td colspan="2">3-7nm</td><td colspan="2"></td><td colspan="2">4-6nm</td><td></td><td colspan="2">4.74</td><td></td><td>3</td><td>7</td>

<td>Top SiN</td><td colspan="2">22-5 lnm</td><td colspan="2"></td><td colspan="2">29-43nm</td><td></td><td colspan="2">36.24</td><td></td><td>22</td><td>51</td>

<td>Top carbon</td><td colspan="2">l-10nm</td><td colspan="2"></td><td colspan="2">3-5nm</td><td></td><td colspan="2">0.14</td><td></td><td>0</td><td>0</td>

<td></td><td colspan="2"></td><td colspan="2"></td><td colspan="2"></td><td></td><td colspan="2"></td><td></td><td></td><td></td>

<td></td><td colspan="4">Low E characteristics</td><td colspan="2"></td><td></td><td colspan="2"></td><td></td><td></td><td></td>

<td></td><td colspan="2"></td><td colspan="2"></td><td colspan="2"></td><td></td><td colspan="2"></td><td></td><td></td><td></td>

<td>characteristic</td><td colspan="2">general</td><td colspan="2"></td><td colspan="2">More preferred</td><td></td><td colspan="3">Most preferred</td><td></td><td></td>

<td>Rs (ohm/square)</td><td colspan="2">&lt;/=5.0</td><td colspan="2"></td><td colspan="2">&lt;/=2.0</td><td></td><td colspan="2">&lt;/=1.5</td><td></td><td></td><td></td>

<td>En</td><td colspan="2">&lt;/=0.07</td><td colspan="2"></td><td colspan="2">&lt;/=0.04</td><td></td><td colspan="2">&lt;/=0.03</td><td></td><td></td><td></td>

<td></td><td colspan="2"></td><td colspan="2"></td><td colspan="2"></td><td></td><td colspan="2"></td><td></td><td></td><td></td>

<td colspan="2"></td><td colspan="6">Monolithic solar characteristics</td><td></td><td colspan="4"></td>

<td colspan="2"></td><td colspan="2"></td><td colspan="2"></td><td colspan="2"></td><td></td><td colspan="4"></td>

<td colspan="2">characteristic</td><td colspan="2">General</td><td colspan="2"></td><td colspan="2">More preferred</td><td></td><td colspan="4"></td>

<td colspan="2">TY(D65,10°)</td><td colspan="2">&gt;/=64%</td><td colspan="2"></td><td colspan="2">&gt;/=66%</td><td></td><td colspan="4">69.3%</td>

<td colspan="2">a*_t(D65,10°)</td><td colspan="2">-10-0.0</td><td colspan="2"></td><td colspan="2">-4.0 to -2.0</td><td></td><td colspan="4">-1.13</td>

<td colspan="2">b*t(D65,10°)</td><td colspan="2">0-4.0</td><td colspan="2"></td><td colspan="2">2.0-4.0</td><td></td><td colspan="4">1.95</td>

<td colspan="2">RgY(D65,10°)</td><td colspan="2">4%-14%</td><td colspan="2"></td><td colspan="2">10%-12%</td><td></td><td colspan="4">12.2%</td>

<td colspan="2">a*_g(D65,10°)</td><td colspan="2">-10-0.0</td><td colspan="2"></td><td colspan="2">-4.0 to -1.0</td><td></td><td colspan="4">-1.48</td>

<td colspan="2">b*_g(D65,10°)</td><td colspan="2">-10-0.0</td><td colspan="2"></td><td colspan="2">-7.0 to -3.0</td><td></td><td colspan="4">-3.56</td>

<td colspan="2">RfY(D65,10°)</td><td colspan="2">4%-14%</td><td colspan="2"></td><td colspan="2">5%-9%</td><td></td><td colspan="4">8.9%</td>

[0210]

CN 101925552 Β

<td>a*_f(D65,10°)</td><td>-20-0.0</td><td></td><td>T6 to -&amp; 0</td><td></td><td>-15.9</td>

<td>b*_f(D65,10°)</td><td>0. 0-10. 0</td><td></td><td>0. 0-8. 0</td><td></td><td>2. 92</td>

<td>SHGC</td><td>&lt; / = 0. 40</td><td></td><td>&lt;/ = 0. 35</td><td></td><td>0. 371</td>

<td>SC</td><td>&lt; / = 0. 49</td><td></td><td>&lt;/ = 0. 46</td><td></td><td>0. 43</td>

<td>Tuv</td><td>&lt;/ = 0.35</td><td></td><td>&lt;/ = 0. 30</td><td></td><td>0. 297</td>

<td>Tuv loss weighted (ISO)</td><td>&lt; / = 0. 49</td><td></td><td>&lt;/ = 0. 46</td><td></td><td>0. 559</td>

<td></td><td></td><td></td><td></td><td></td><td></td>

<td></td><td></td><td></td><td></td><td></td><td></td>

<td></td><td></td><td></td><td></td><td></td><td></td>

[0211]

<td></td><td colspan="2">IGU solar characteristics</td><td></td><td></td><td></td>

<td></td><td></td><td></td><td></td><td></td><td></td>

<td>characteristic</td><td>general</td><td></td><td>More preferred</td><td></td><td></td>

<td>TY(D65,10°)</td><td>&gt;/=58%</td><td></td><td>&gt;/=60%</td><td></td><td>63.1%</td>

<td>a*_t(D65,10°)</td><td>-10-0.0</td><td></td><td>-4.0 to -2.0</td><td></td><td>-1.87</td>

<td>b*_t(D65,10°)</td><td>0-4.0</td><td></td><td>2.0-4.0</td><td></td><td>2.08</td>

<td>RgY(D65,10°)</td><td>4%-20%</td><td></td><td>10%-15%</td><td></td><td>15.9%</td>

<td>a*_g(D65,10°)</td><td>-10-0.0</td><td></td><td>-4.0 to -1.0</td><td></td><td>-1.49</td>

<td>b*_g(D65,10°)</td><td>-10-0.0</td><td></td><td>-7.0 to -3.0</td><td></td><td>-2.31</td>

<td>RfY(D65,10°)</td><td>4%-20%</td><td></td><td>10%-15%</td><td></td><td>15.0%</td>

<td>a*f(D65,10^o)</td><td>-20-0.0</td><td></td><td>-16 to -8.0</td><td></td><td>-9.09</td>

<td>b*f(D65,10^o)</td><td>0.0-10.0</td><td></td><td>0.0-8.0</td><td></td><td>2.28</td>

<td>SHGC</td><td>&lt;/=0.35</td><td></td><td>&lt;/=0.30</td><td></td><td>0.329</td>

<td>SC</td><td>&lt;/=0.43</td><td></td><td>&lt;/=0.40</td><td></td><td>0.38</td>

<td>u value</td><td>0.20-0.30</td><td></td><td>0.22-0.25</td><td></td><td>0.24</td>

<td>Tuv</td><td>&lt;/=0.30</td><td></td><td>&lt;/=0.25</td><td></td><td>0.248</td>

<td>Tuv loss weighted (ISO)</td><td>&lt;/=0.49</td><td></td><td>&lt;/=0.46</td><td></td><td>0.501</td>

<td></td><td></td><td></td><td></td><td></td><td></td>

<td></td><td></td><td></td><td></td><td></td><td></td>

CN 101925552 Β

[0212]

<td></td><td></td><td colspan="9">Example Coating machine setting can be tempered test #38</td>

<td></td><td></td><td></td><td></td><td></td><td></td><td></td><td></td><td></td><td>Temperable</td><td>Annealed</td>

<td>cathode</td><td>target</td><td>Voltage (V)</td><td>I (ampere)</td><td>P(kW)</td><td>Ar(seem)</td><td>0₂(seem)</td><td>n₂(seem)</td><td>Pressure (xlO'hPA)</td><td>Reactive gas: kW</td><td></td>

<td>1</td><td>SiAl</td><td>458.9</td><td>179.8</td><td>43.2</td><td>300</td><td>30</td><td>328</td><td>0</td><td>7.59</td><td>6.50</td>

<td>2</td><td>SiAl</td><td>463</td><td>178.1</td><td>43.3</td><td>300</td><td>30</td><td>328</td><td>3.53</td><td>7.58</td><td>6.51</td>

<td>6</td><td>SiAl</td><td>436.9</td><td>195.8</td><td>43.7</td><td>300</td><td>30</td><td>328</td><td>3.45</td><td>7.51</td><td>6.43</td>

<td>5</td><td>ZnAl</td><td>439.8</td><td>129.2</td><td>34.2</td><td>150</td><td>330</td><td>0</td><td>2.02</td><td>9.65</td><td>11.95</td>

<td>7</td><td>ZnAl</td><td>325.8</td><td>160.6</td><td>34.6</td><td>150</td><td>330</td><td>0</td><td>1.1</td><td>9.54</td><td>0.00</td>

<td>10</td><td>Ag</td><td>527.8</td><td>44.1</td><td>23.3</td><td>100</td><td>40</td><td>0</td><td>0.644</td><td>1.72</td><td>7.77</td>

<td>20</td><td>NiCr</td><td>532.4</td><td>47.9</td><td>25.5</td><td>100</td><td>196</td><td>0</td><td>0.155</td><td>7.69</td><td>6.07</td>

<td>11</td><td>SiAl</td><td>558.4</td><td>161.8</td><td>39.1</td><td>300</td><td>30</td><td>264</td><td>3.86</td><td>6.75</td><td>6.13</td>

<td>4</td><td>SiAl</td><td>476.9</td><td>163.2</td><td>3&amp;8</td><td>300</td><td>30</td><td>264</td><td>2.65</td><td>6.80</td><td>6.10</td>

<td>12</td><td>SiAl</td><td>519.7</td><td>162.6</td><td>39</td><td>300</td><td>30</td><td>264</td><td>5.09</td><td>6.77</td><td>6.13</td>

<td>13</td><td>SiAl</td><td>497.7</td><td>155.8</td><td>3&amp;7</td><td>300</td><td>30</td><td>264</td><td>4.57</td><td>6.82</td><td>6.14</td>

<td>14</td><td>SiAl</td><td>410.9</td><td>182.6</td><td>3&amp;6</td><td>300</td><td>30</td><td>264</td><td>4.07</td><td>6.84</td><td>6.15</td>

<td>15</td><td>SiAl</td><td>444.4</td><td>165.9</td><td>38.7</td><td>300</td><td>30</td><td>264</td><td>1.15</td><td>6.82</td><td>6.15</td>

<td>16</td><td>SiAl</td><td>449.7</td><td>151.9</td><td>3&amp;7</td><td>300</td><td>30</td><td>264</td><td>4.93</td><td>6.82</td><td>6.15</td>

<td>17</td><td>SiAl</td><td>477.4</td><td>157.4</td><td>3&amp;7</td><td>300</td><td>30</td><td>264</td><td>4.31</td><td>6.82</td><td>6.16</td>

<td>17Α</td><td>SiAl</td><td>474</td><td>160.3</td><td>38.4</td><td>300</td><td>30</td><td>264</td><td>0</td><td>6.88</td><td>13.09</td>

<td>18Α</td><td>ZnAl</td><td>366.9</td><td>168.5</td><td>34.8</td><td>150</td><td>440</td><td>0</td><td>1.42</td><td>12.64</td><td>0.00</td>

<td>23</td><td>Ag</td><td>486.7</td><td>21.4</td><td>10.4</td><td>100</td><td>40</td><td>0</td><td>0.661</td><td>3.85</td><td>&amp;24</td>

<td>19</td><td>NiCr</td><td>605.9</td><td>39.8</td><td>24.1</td><td>100</td><td>194</td><td>0</td><td>0.578</td><td>8.05</td><td>7.11</td>

<td>26</td><td>SiAl</td><td>461.2</td><td>141.3</td><td>32.8</td><td>300</td><td>30</td><td>257</td><td>3.46</td><td>7.84</td><td>7.08</td>

<td>27</td><td>SiAl</td><td>443.3</td><td>138.5</td><td>33</td><td>300</td><td>30</td><td>257</td><td>1.39</td><td>7.79</td><td>7.06</td>

<td>28</td><td>SiAl</td><td>445.6</td><td>136.8</td><td>32.8</td><td>300</td><td>30</td><td>257</td><td>538</td><td>7.84</td><td>7.09</td>

<td>29</td><td>SiAl</td><td>435.2</td><td>145.5</td><td>32.4</td><td>300</td><td>30</td><td>257</td><td>4.37</td><td>7.93</td><td>7.08</td>

[0213]

<td>30</td><td>SiAl</td><td>474. 5</td><td>138.6</td><td>33</td><td>300</td><td>30</td><td>257</td><td>4. 14</td><td>7. 79</td><td>7. 06</td>

<td>18</td><td>C</td><td>506.9</td><td>123. 7</td><td>30. 9</td><td>500</td><td>0</td><td>0</td><td>3. 78</td><td></td><td></td>

CN 101925552 Β

[0214]

<td>sample</td><td></td><td></td><td></td><td></td>

<td>#521 AC31 temperable 3/16/07</td><td colspan="3">Monolithic &amp; IGU solar characteristics</td><td></td>

<td></td><td></td><td></td><td></td><td></td>

<td>characteristic</td><td>Monolithic</td><td></td><td>IGU</td><td></td>

<td>TY(D65,10°)</td><td>69.3%</td><td></td><td>63.1%</td><td></td>

<td>a*_t(D65,10°)</td><td>-1.13</td><td></td><td>-1.87</td><td></td>

<td>b*_t(D65,10°)</td><td>1.95</td><td></td><td>2.08</td><td></td>

<td>RgY(D65,10°)</td><td>12.2%</td><td></td><td>15.9%</td><td></td>

<td>a*_g(D65,10°)</td><td>-1.48</td><td></td><td>-1.49</td><td></td>

<td>b*_g(D65,10°)</td><td>-3.56</td><td></td><td>-2.31</td><td></td>

<td>RfY(D65,10°)</td><td>8.9%</td><td></td><td>15.0%</td><td></td>

<td>a*f(D65,10^o)</td><td>-15.9</td><td></td><td>-9.09</td><td></td>

<td>b*f(D65,10^o)</td><td>2.92</td><td></td><td>2.28</td><td></td>

<td>SHGC</td><td>0.371</td><td></td><td>0.329</td><td></td>

<td>SC</td><td>0.43</td><td></td><td>0.38</td><td></td>

<td>Tuv</td><td>0.297</td><td></td><td>0.248</td><td></td>

<td>Tuv loss weighted (ISO)</td><td>0.559</td><td></td><td>0.501</td><td></td>

<td></td><td></td><td></td><td></td><td></td>

<td></td><td></td><td></td><td></td><td></td>

<td></td><td></td><td></td><td></td><td></td>

[0215] Although the present invention has been described in terms of specific embodiments, it is not limited to the specific details set forth, but includes various changes and modifications that those skilled in the art may think of, and all these changes and modifications are made by Within the scope defined by the appended claims.

CN 101925552 Β