CA2700565C

Vibrating micromechanical sensor of angular velocity

Abstract

The invention relates to measuring devices to be used in the measuring of angular velocity and, more precisely, to vibrating micromechanical sensors of angular velocity. In a sensor of angular velocity according to the invention, a mass is supported to the frame of the sensor component by means of an asymmetrical spring structure (1), (2), (3), (4), (22), (24) in such a way, that the coupling from one mode of motion to another, conveyed by the spring (1), (2), (3), (4), (22), (24), cancels or alleviates the coupling caused by the non-ideality due to the skewness in the springs or in their support. The structure of the sensor of angular velocity according to the invention enables reliable measuring with good performance, particularly in small vibrating micromechanical so-lutions for sensors of angular velocity.

CA2700565C, drawing sheet 1
Sheet 1 of 11

Term

Projected expiry 29 September 2028.

  1. Priority
  2. Filed
  3. Granted
  4. Today
  5. Projected expiry

15 claims: 5 independent, 10 dependent

  1. 1
    CA 02700565 2010-03-23 WO 2009/043967 PCT/FI2008/050539 Patent claims 1. A vibrating micromechanical sensor of angular velocity comprising at least one seismic mass and an associated moving electrode, which mass possesses a primary motion, into which it has to be activated, and, in addition to the primary motion, at least one degree of freedom in relation to a detection axis, or detection axes, essentially perpendicular to the primary motion, and which mass is, or which masses are, supported to the frame of the sensor component by means of a spring structure, characterized in, that the spring structure (1), (2), (3), (4), (22), (24) is asymmetrical such, that the coupling from one mode of motion to another, conveyed by the spring (1), (2), (3), (4), (22), (24), cancels or alleviates the coupling caused by a non-ideality due to skewness in the springs or in their support.
  2. 10
    The sensor of angular velocity according any one of the preceding claims 1 through 9, characterized in, that the spring structure (1), (2), (3), (4), (22), (24) is asymmetrically designed such, that the coupling from one mode of motion to another, conveyed by the spring (1), (2), (3), (4), (22), (24), cancels or alleviates the coupling caused by the non-ideality due to the inclination of the groove of the DRIE etching process relative to the normal to the disk.
  3. 11
    A method for the manufacturing of a vibrating micromechanical sensor of angular velocity by means of micromechanical disk structures, which sensor of angular velocity comprises at least one seismic mass and an associated moving electrode, which mass possesses a primary motion, into which it has to be activated, and, in addition CA 02700565 2010-03-23 WO 2009/043967 PCT/FI2008/050539 to the primary motion, at least one degree of freedom in relation to a detection axis, or detection axes, essentially perpendicular to the primary motion, and which mass is, or which masses are, supported to the frame of the sensor component by means of a spring structure, characterized in, that the spring structure (1), (2) , (3), (4), (22), (24) of the sensor of angular velocity is manufactured by etching to be asymmetrical.
  4. 14
    Method according to any one of the preceding claims 11 through 13, characterized in, that, in manufacturing, nonidealities of the DRIE etching process, such as the ARDE effect (ARDE, Aspect Ratio Dependent Etch rate), are being utilized.
  5. 15
    Method according to any one of the preceding claims 11 through 14, characterized in, that, in manufacturing, a twostage DRIE etching process is being utilized, by means of which the depth of a groove, or a cavity, to be etched can be suitably dimensioned.