Hot melt adhesive composition based on a random copolymer of isotactic polypropylene

A hot melt adhesive composition is based on an isotactic polypropylene random copolymer (RCP). The composition contains about 4%-50% by weight of the RCP copolymer, about 20%-65% by weight of a compatible tackifier, about 0%-40% by weight of a plasticizer, about 0%-3% by weight of a stabilizer, about 0%-40% by weight of a wax, about 0%-60% by weight of an atactic poly-alpha-olefin (APAO), and about 0%-40% by weight of a secondary polymer. The adhesive composition may be used in a number of applications such as, for example, in disposable nonwoven hygienic articles, paper converting, flexible packaging, wood working, carton and case sealing, labeling and other assembly applications.